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SUBSTRATE CONTACT IN WAFER BACKSIDE
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Publication number 20240145498
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Publication date May 2, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Hao-Lin Yang
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H01 - BASIC ELECTRIC ELEMENTS
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PHOTO DETECTION DEVICE
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Publication number 20240145519
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Publication date May 2, 2024
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Optohub Co., Ltd
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Ikuo KURACHI
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H01 - BASIC ELECTRIC ELEMENTS
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METHODS FOR FABRICATING IMAGE SENSOR
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Publication number 20240145520
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Publication date May 2, 2024
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Taiwan Semiconductor Manufacturing company Ltd.
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JHY-JYI SZE
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H01 - BASIC ELECTRIC ELEMENTS
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IMAGE SENSOR
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Publication number 20240136375
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Publication date Apr 25, 2024
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Samsung Electronics Co., Ltd.
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Masato FUJITA
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H01 - BASIC ELECTRIC ELEMENTS
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IMAGING DEVICE
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Publication number 20240136373
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Publication date Apr 25, 2024
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Tianma Japan, Ltd.
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Shuhei NARA
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H01 - BASIC ELECTRIC ELEMENTS
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IMAGE SENSOR
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Publication number 20240128289
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Publication date Apr 18, 2024
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STMicroelectronics (Crolles 2) SAS
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Francois ROY
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H01 - BASIC ELECTRIC ELEMENTS
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IMAGE SENSOR
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Publication number 20240128287
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Publication date Apr 18, 2024
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Samsung Electronics Co., Ltd.
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Sanghyuck Moon
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H01 - BASIC ELECTRIC ELEMENTS
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SOLID-STATE IMAGING DEVICE
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Publication number 20240105754
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Publication date Mar 28, 2024
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Kabushiki Kaisha Toshiba
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Yuexing ZHENG
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H01 - BASIC ELECTRIC ELEMENTS
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