MOS based technologies

Industry

CPC
H01L27/14689

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/14689MOS based technologies

Industries

Patents Grantslast 30 patents

Information Patent Grant
Solid-state imaging device, manufacturing method thereof, and elect...
- Patent number 12,237,356
- Issue date Feb 25, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Shinya Yamakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
NMOS structure and manufacturing method thereof
- Patent number 12,237,350
- Issue date Feb 25, 2025
- United Microelectronics Corporation
- Hau-Yuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 12,237,354
- Issue date Feb 25, 2025
- Xintec Inc.
- Tsang-Yu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside-illumination solid-state image pickup apparatus, image pic...
- Patent number 12,230,662
- Issue date Feb 18, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Naoki Komai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,230,696
- Issue date Feb 18, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and method of manufacturing the same
- Patent number 12,224,295
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Hakyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of photoelectric conversion panel, photoelectr...
- Patent number 12,224,303
- Issue date Feb 11, 2025
- Sharp Display Technology Corporation
- Makoto Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure with high via density
- Patent number 12,224,298
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hsien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and imaging device with combined dynamic...
- Patent number 12,225,305
- Issue date Feb 11, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Pooria Mostafalu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and manufacturing method thereof
- Patent number 12,218,159
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Lei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 12,218,173
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-noise image sensor having stacked semiconductor substrates
- Patent number 12,218,171
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-side deep trench isolation structure for image sensor
- Patent number 12,211,877
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low noise vertical gate device structure
- Patent number 12,211,861
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extra doped region for back-side deep trench isolation
- Patent number 12,211,876
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,205,974
- Issue date Jan 21, 2025
- Innolux Corporation
- Chandra Lius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor comprising stacked photo-sensitive devices
- Patent number 12,205,973
- Issue date Jan 21, 2025
- Imec VZW
- Jiwon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and image-capturing apparatus
- Patent number 12,199,126
- Issue date Jan 14, 2025
- Nikon Corporation
- Atsushi Komai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection panel, method for manufacturing the same and flat panel d...
- Patent number 12,196,896
- Issue date Jan 14, 2025
- BEIJING BOE SENSOR TECHNOLOGY CO., LTD.
- Xiangmi Zhan
- G01 - MEASURING TESTING
Information Patent Grant
Image sensor having a gate dielectric structure for improved device...
- Patent number 12,191,336
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Jui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and imaging system
- Patent number 12,192,665
- Issue date Jan 7, 2025
- Canon Kabushiki Kaisha
- Masahiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS image sensor having indented photodiode structure
- Patent number 12,191,327
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and method of making
- Patent number 12,183,753
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluorine passivation in a pixel sensor
- Patent number 12,183,751
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complementary metal-oxide-semiconductor image sensor and method of...
- Patent number 12,183,767
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device and electronic apparatus
- Patent number 12,183,755
- Issue date Dec 31, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kaito Yokochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 12,176,376
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Junghoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion device and photodetection system having av...
- Patent number 12,177,588
- Issue date Dec 24, 2024
- Canon Kabushiki Kaisha
- Yasuharu Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device and electronic device
- Patent number 12,176,363
- Issue date Dec 24, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Shinya Yamakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor structure including nanowire structure and manufacturi...
- Patent number 12,176,375
- Issue date Dec 24, 2024
- United Microelectronics Corp.
- Zhaoyao Zhan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR
- Publication number 20250063833
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTU...
- Publication number 20250063832
- Publication date Feb 20, 2025
- Canon Kabushiki Kaisha
- Nobuyuki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE, IMAGING MODULE, ELECTRONIC DEVICE, AND IMAGING SYSTEM
- Publication number 20250053798
- Publication date Feb 13, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Takayuki IKEDA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGING ELEMENT, METHOD FOR MANUFACTURING IMAGING ELEMENT, AND ELEC...
- Publication number 20250056910
- Publication date Feb 13, 2025
- Sony Semiconductor Solutions Corporation
- MASATAKA ISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20250048758
- Publication date Feb 6, 2025
- Sony Semiconductor Solutions Corporation
- YASUNORI SOGOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTO DETECTION SUBSTRATE, IMAGE SENSOR, AND ELECTRONIC APPARATUS
- Publication number 20250048756
- Publication date Feb 6, 2025
- BOE TECHNOLOGY GROUP CO., LTD.
- Rui HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EYE GESTURE TRACKING
- Publication number 20250036200
- Publication date Jan 30, 2025
- Artilux, Inc.
- Yun-Chung Na
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGE SENSOR
- Publication number 20250040266
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE AND ELECTRONIC DEVICE
- Publication number 20250022895
- Publication date Jan 16, 2025
- Sony Semiconductor Solutions Corporation
- SHINYA YAMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF IMAGE SENSOR STRUCTURE
- Publication number 20250022905
- Publication date Jan 16, 2025
- United Microelectronics Corp.
- Zhaoyao Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND MANUFACTURING METHOD OF IMAGE SENSOR
- Publication number 20250015114
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Sanghoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE WAVELENGTH BAND LIGHT SENSOR DEVICE
- Publication number 20250015102
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR IMAGE SENSING DEVICES
- Publication number 20250006770
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Jihun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION APPARATUS, MANUFACTURING METHOD, AND EQUIP...
- Publication number 20250006750
- Publication date Jan 2, 2025
- Canon Kabushiki Kaisha
- MASAAKI IWANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEAR INFRARED LIGHT SENSOR WITH IMPROVED LIGHT COUPLING AND CMOS IM...
- Publication number 20240429261
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- ChunHao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIBAND FOCAL PLANE ARRAY (FPA) ENABLED BY THE COMBINATION OF MIC...
- Publication number 20240429262
- Publication date Dec 26, 2024
- SWIR Vision Systems Inc.
- Christopher William Gregory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
- Publication number 20240429252
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Changkeun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE ILLUMINATED IMAGE SENSOR WITH REDUCED SIDEWALL-INDUCED LE...
- Publication number 20240421177
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuang-Ji Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
- Publication number 20240413177
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Changkeun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING SOLID-STATE IMA...
- Publication number 20240406599
- Publication date Dec 5, 2024
- Sony Semiconductor Solutions Corporation
- HIROAKI AMMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET TOOL KIT FOR FORMING SEMICONDUCTOR STRUCTURE AND CMOS IMAGE SEN...
- Publication number 20240404832
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Chenchia Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECRONIC DEVICE WITH POLARIZING MASK STRUCTURE
- Publication number 20240405053
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR PHASE DETECTION AUTO FOCUS
- Publication number 20240406596
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GERMANIUM-BASED PHOTODETECTOR WITH REDUCED DARK CURRENT AND METHODS...
- Publication number 20240405035
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yeh-Hsun FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFRARED DETECTOR WITH MULTI-LAYER STRUCTURE BASED ON CMOS PROCESS
- Publication number 20240395848
- Publication date Nov 28, 2024
- Beijing North Gaoye Technology Co., Ltd.
- Guangjie Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLOBAL SHUTTER SENSOR SYSTEMS AND RELATED METHODS
- Publication number 20240387581
- Publication date Nov 21, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Manuel H. INNOCENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICES AND METHODS OF FORMATION
- Publication number 20240387596
- Publication date Nov 21, 2024
- Traiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240387576
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Lei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240387590
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Jinpyo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240387594
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuichiro YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS

MOS based technologies

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solid-state imaging device, manufacturing method thereof, and elect...

NMOS structure and manufacturing method thereof

Chip package and method for forming the same

Backside-illumination solid-state image pickup apparatus, image pic...

Semiconductor device and method for fabricating the same

Image sensor and method of manufacturing the same

Manufacturing method of photoelectric conversion panel, photoelectr...

Bond pad structure with high via density

Solid-state imaging device and imaging device with combined dynamic...

Image sensor and manufacturing method thereof

Image sensor device

Low-noise image sensor having stacked semiconductor substrates

Back-side deep trench isolation structure for image sensor

Low noise vertical gate device structure

Extra doped region for back-side deep trench isolation

Electronic device

Image sensor comprising stacked photo-sensitive devices

Image sensor and image-capturing apparatus

Detection panel, method for manufacturing the same and flat panel d...

Image sensor having a gate dielectric structure for improved device...

Solid-state imaging device and imaging system

CMOS image sensor having indented photodiode structure

Image sensor and method of making

Fluorine passivation in a pixel sensor

Complementary metal-oxide-semiconductor image sensor and method of...

Imaging device and electronic apparatus

Image sensor

Photoelectric conversion device and photodetection system having av...

Imaging device and electronic device

Image sensor structure including nanowire structure and manufacturi...

Patents Applicationslast 30 patents

IMAGE SENSOR

MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTU...

IMAGING DEVICE, IMAGING MODULE, ELECTRONIC DEVICE, AND IMAGING SYSTEM

IMAGING ELEMENT, METHOD FOR MANUFACTURING IMAGING ELEMENT, AND ELEC...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

PHOTO DETECTION SUBSTRATE, IMAGE SENSOR, AND ELECTRONIC APPARATUS

EYE GESTURE TRACKING

IMAGE SENSOR

IMAGING DEVICE AND ELECTRONIC DEVICE

MANUFACTURING METHOD OF IMAGE SENSOR STRUCTURE

IMAGE SENSOR AND MANUFACTURING METHOD OF IMAGE SENSOR

MULTIPLE WAVELENGTH BAND LIGHT SENSOR DEVICE

COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR IMAGE SENSING DEVICES

PHOTOELECTRIC CONVERSION APPARATUS, MANUFACTURING METHOD, AND EQUIP...

NEAR INFRARED LIGHT SENSOR WITH IMPROVED LIGHT COUPLING AND CMOS IM...

MULTIBAND FOCAL PLANE ARRAY (FPA) ENABLED BY THE COMBINATION OF MIC...

IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

BACK SIDE ILLUMINATED IMAGE SENSOR WITH REDUCED SIDEWALL-INDUCED LE...

IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING SOLID-STATE IMA...

WET TOOL KIT FOR FORMING SEMICONDUCTOR STRUCTURE AND CMOS IMAGE SEN...

OPTOELECRONIC DEVICE WITH POLARIZING MASK STRUCTURE

STRUCTURES AND METHODS FOR PHASE DETECTION AUTO FOCUS

GERMANIUM-BASED PHOTODETECTOR WITH REDUCED DARK CURRENT AND METHODS...

INFRARED DETECTOR WITH MULTI-LAYER STRUCTURE BASED ON CMOS PROCESS

GLOBAL SHUTTER SENSOR SYSTEMS AND RELATED METHODS

IMAGE SENSOR DEVICES AND METHODS OF FORMATION

IMAGE SENSOR AND MANUFACTURING METHOD THEREOF

IMAGE SENSOR AND MANUFACTURING METHOD THEREOF

IMAGE SENSOR