Moulded encapsulation of mounted components

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CPC
H05K2203/1316

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1316Moulded encapsulation of mounted components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Control device for a motor vehicle
- Patent number 12,200,872
- Issue date Jan 14, 2025
- Vitesco Technologies Germany GmbH
- Johannes Bock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device with multilayer laminate
- Patent number 12,185,474
- Issue date Dec 31, 2024
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Jeroen Van Den Brand
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lighting system with lens assembly
- Patent number 12,129,990
- Issue date Oct 29, 2024
- KORRUS, INC.
- Ariel Meir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waterproof electronic pen
- Patent number 12,111,986
- Issue date Oct 8, 2024
- Wacom Co., Ltd.
- Takayuki Arai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,089,349
- Issue date Sep 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive assembly, camera module and manufacturing method the...
- Patent number 12,081,849
- Issue date Sep 3, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Zhongyu Luan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for manufacturing a number of electrical nodes, electrical n...
- Patent number 12,052,829
- Issue date Jul 30, 2024
- TACTOTEK OY
- Tomi Simula
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 12,051,616
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module and array camera module based on integral packaging t...
- Patent number 12,035,029
- Issue date Jul 9, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device having heat dissipation structure using filler an...
- Patent number 12,028,985
- Issue date Jul 2, 2024
- SOLUM CO., LTD.
- Jun Kyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with stacked passive components
- Patent number 12,022,618
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Chien Te Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Illuminated multilayer structure with embedded light sources
- Patent number 11,934,004
- Issue date Mar 19, 2024
- TACTOTEK OY
- Antti Keränen
- G02 - OPTICS
Information Patent Grant
Lead frame, packaged integrated circuit board, power chip, and circ...
- Patent number 11,887,918
- Issue date Jan 30, 2024
- Huawei Technologies Co., Ltd.
- Xuanwei Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lighting system with lens assembly
- Patent number 11,867,382
- Issue date Jan 9, 2024
- KORRUS, INC.
- Ariel Meir
- G02 - OPTICS
Information Patent Grant
Waterproof electronic pen
- Patent number 11,853,484
- Issue date Dec 26, 2023
- Wacom Co., Ltd.
- Takayuki Arai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Panel-molded electronic assemblies
- Patent number 11,751,338
- Issue date Sep 5, 2023
- Vicor Corporation
- Patrizio Vinciarelli
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless power of in-mold electronics and the application within a...
- Patent number 11,751,337
- Issue date Sep 5, 2023
- Honda Motor Co., Ltd.
- Alex W. Baker
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Mechanically bridged SMD interconnects for electronic devices
- Patent number 11,744,020
- Issue date Aug 29, 2023
- Texas Instruments Incorporated
- Kyle Brent Norell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,744,024
- Issue date Aug 29, 2023
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a number of electrical nodes, electrical n...
- Patent number 11,729,915
- Issue date Aug 15, 2023
- TACTOTEK OY
- Tomi Simula
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Saw based optical sensor device and package including the same
- Patent number 11,674,890
- Issue date Jun 13, 2023
- HAESUNG DS CO., LTD.
- Jin Woo Lee
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for manufacturing semiconductor modules
- Patent number 11,652,132
- Issue date May 16, 2023
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 11,631,611
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DI metal transaction devices and processes for the manufacture thereof
- Patent number 11,618,191
- Issue date Apr 4, 2023
- Composecure, LLC
- Adam Lowe
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Power module package and method of manufacturing the same
- Patent number 11,615,967
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module
- Patent number 11,602,089
- Issue date Mar 7, 2023
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer structure and related method of manufacture for electronics
- Patent number 11,594,482
- Issue date Feb 28, 2023
- TACTOTEK OY
- Jarmo Sääski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module, molded circuit board assembly, molded photosensitive...
- Patent number 11,575,816
- Issue date Feb 7, 2023
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- G02 - OPTICS
Information Patent Grant
Ceramic thermal insulation
- Patent number 11,548,826
- Issue date Jan 10, 2023
- Oulun Yliopisto
- Jari Hannu
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Sensor component, pre-assembly arrangement for a sensor component,...
- Patent number 11,536,594
- Issue date Dec 27, 2022
- Vitesco Technologies Germany GmbH
- Jürgen Rietsch
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
WATERPROOF ELECTRONIC PEN
- Publication number 20240427435
- Publication date Dec 26, 2024
- WACOM CO., LTD.
- Takayuki Arai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DESIGN OF A RECYCLABLE ELECTRONIC DEVICE
- Publication number 20240431037
- Publication date Dec 26, 2024
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Stephan HARKEMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICE HAVING HEAT DISSIPATION STRUCTURE USING FILLER AN...
- Publication number 20240334614
- Publication date Oct 3, 2024
- SOLUM CO., LTD.
- Jun Kyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPLANTABLE MEDICAL DEVICE CASE FIT WITH SELECTIVE ENCAPSULATION
- Publication number 20240306310
- Publication date Sep 12, 2024
- Cardiac Pacemakers, Inc.
- Benjamin J. Haasl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE
- Publication number 20240306304
- Publication date Sep 12, 2024
- HYUNDAI MOBIS CO., LTD.
- Chan Yang CHOE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR, CIRCUIT MODULE, AND METHOD OF MANUFAC...
- Publication number 20240170221
- Publication date May 23, 2024
- Murata Manufacturing Co., Ltd.
- China UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WATERPROOF ELECTRONIC PEN
- Publication number 20240085997
- Publication date Mar 14, 2024
- WACOM CO., LTD.
- Takayuki Arai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TRANSFER MOLDING SYSTEMS FOR SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20240074066
- Publication date Feb 29, 2024
- Apple Inc.
- Nitesh KUMBHAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240057249
- Publication date Feb 15, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230411275
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230413454
- Publication date Dec 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A NUMBER OF ELECTRICAL NODES, ELECTRICAL N...
- Publication number 20230309242
- Publication date Sep 28, 2023
- TactoTek Oy
- Tomi SIMULA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE
- Publication number 20230200032
- Publication date Jun 22, 2023
- Murata Manufacturing Co., Ltd.
- Shota HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20230189490
- Publication date Jun 15, 2023
- Murata Manufacturing Co., Ltd.
- Shota Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICALLY BRIDGED SMD INTERCONNECTS FOR ELECTRONIC DEVICES
- Publication number 20230171894
- Publication date Jun 1, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Kyle Brent Norell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE ASSEMBLY, CAMERA MODULE AND MANUFACTURING METHOD THE...
- Publication number 20220303436
- Publication date Sep 22, 2022
- NINGBO SUNNY OPOTECH CO., LTD.
- Zhongyu LUAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE WITH MULTILAYER LAMINATE
- Publication number 20220287186
- Publication date Sep 8, 2022
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Jeroen VAN DEN BRAND
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME, PACKAGED INTEGRATED CIRCUIT BOARD, POWER CHIP, AND CIRC...
- Publication number 20220223506
- Publication date Jul 14, 2022
- Huawei Technologies Co., Ltd
- Xuanwei FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL DEVICE FOR A MOTOR VEHICLE
- Publication number 20220201868
- Publication date Jun 23, 2022
- Vitesco Technologies Germany GmbH
- Johannes Bock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICE HAVING HEAT DISSIPATION STRUCTURE USING FILLER AN...
- Publication number 20220183161
- Publication date Jun 9, 2022
- SOLUM CO., LTD.
- Jun Kyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220141971
- Publication date May 5, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC UNIT COMPRISING ELECTRONIC COMPONENTS AND AN ARRANGEMENT...
- Publication number 20220007517
- Publication date Jan 6, 2022
- ZF Friedrichshafen AG
- Josef Loibl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SAW BASED OPTICAL SENSOR DEVICE AND PACKAGE INCLUDING THE SAME
- Publication number 20210381952
- Publication date Dec 9, 2021
- HAESUNG DS CO., LTD
- Jin Woo LEE
- G01 - MEASURING TESTING
Information Patent Application
MULTILAYER STRUCTURE AND RELATED METHOD OF MANUFACTURE FOR ELECTRONICS
- Publication number 20210335702
- Publication date Oct 28, 2021
- TactoTek Oy
- Jarmo SÄÄSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR MANUFACTURING SEMICONDUCTOR MODULES
- Publication number 20210305308
- Publication date Sep 30, 2021
- Ningbo Sunny Opotech Co., Ltd.
- Mingzhu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND LIGHT GUIDE FOR ELECTRONICS ASSEMBLY
- Publication number 20210291753
- Publication date Sep 23, 2021
- DURA OPERATING, LLC
- Jochen Schulze zur Wiesche
- B60 - VEHICLES IN GENERAL
Information Patent Application
Manufacturing Implantable Tissue Stimulators
- Publication number 20210298182
- Publication date Sep 23, 2021
- Micron Medical LLC
- Benjamin Speck
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ILLUMINATED MULTILAYER STRUCTURE WITH EMBEDDED LIGHT SOURCES
- Publication number 20210157047
- Publication date May 27, 2021
- TactoTek Oy
- Antti KERÄNEN
- G02 - OPTICS
Information Patent Application
DI METAL TRANSACTION DEVICES AND PROCESSES FOR THE MANUFACTURE THEREOF
- Publication number 20210154898
- Publication date May 27, 2021
- COMPOSECURE, LLC
- Adam Lowe
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SYSTEM AND METHOD FOR HEAT REMOVAL USING A THERMAL POTTING SOLUTION...
- Publication number 20210153335
- Publication date May 20, 2021
- DELL PRODUCTS, L.P.
- Iris Huang
- G06 - COMPUTING CALCULATING COUNTING

Moulded encapsulation of mounted components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Control device for a motor vehicle

Electronic device with multilayer laminate

Lighting system with lens assembly

Waterproof electronic pen

Semiconductor device package and method of manufacturing the same

Photosensitive assembly, camera module and manufacturing method the...

Method for manufacturing a number of electrical nodes, electrical n...

Wafer level chip scale packaging intermediate structure apparatus a...

Camera module and array camera module based on integral packaging t...

Electrical device having heat dissipation structure using filler an...

Printed circuit board with stacked passive components

Illuminated multilayer structure with embedded light sources

Lead frame, packaged integrated circuit board, power chip, and circ...

Lighting system with lens assembly

Waterproof electronic pen

Panel-molded electronic assemblies

Wireless power of in-mold electronics and the application within a...

Mechanically bridged SMD interconnects for electronic devices

Semiconductor device package and method of manufacturing the same

Method for manufacturing a number of electrical nodes, electrical n...

Saw based optical sensor device and package including the same

Systems and methods for manufacturing semiconductor modules

Wafer level chip scale packaging intermediate structure apparatus a...

DI metal transaction devices and processes for the manufacture thereof

Power module package and method of manufacturing the same

High-frequency module

Multilayer structure and related method of manufacture for electronics

Camera module, molded circuit board assembly, molded photosensitive...

Ceramic thermal insulation

Sensor component, pre-assembly arrangement for a sensor component,...

Patents Applicationslast 30 patents

WATERPROOF ELECTRONIC PEN

DESIGN OF A RECYCLABLE ELECTRONIC DEVICE

ELECTRICAL DEVICE HAVING HEAT DISSIPATION STRUCTURE USING FILLER AN...

IMPLANTABLE MEDICAL DEVICE CASE FIT WITH SELECTIVE ENCAPSULATION

APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE

MULTILAYER CERAMIC CAPACITOR, CIRCUIT MODULE, AND METHOD OF MANUFAC...

WATERPROOF ELECTRONIC PEN

TRANSFER MOLDING SYSTEMS FOR SEMICONDUCTOR DEVICE PACKAGING

ELECTRONIC PACKAGE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING A NUMBER OF ELECTRICAL NODES, ELECTRICAL N...

MODULE

MODULE

MECHANICALLY BRIDGED SMD INTERCONNECTS FOR ELECTRONIC DEVICES

PHOTOSENSITIVE ASSEMBLY, CAMERA MODULE AND MANUFACTURING METHOD THE...

ELECTRONIC DEVICE WITH MULTILAYER LAMINATE

LEAD FRAME, PACKAGED INTEGRATED CIRCUIT BOARD, POWER CHIP, AND CIRC...

CONTROL DEVICE FOR A MOTOR VEHICLE

ELECTRICAL DEVICE HAVING HEAT DISSIPATION STRUCTURE USING FILLER AN...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC UNIT COMPRISING ELECTRONIC COMPONENTS AND AN ARRANGEMENT...

SAW BASED OPTICAL SENSOR DEVICE AND PACKAGE INCLUDING THE SAME

MULTILAYER STRUCTURE AND RELATED METHOD OF MANUFACTURE FOR ELECTRONICS

SYSTEMS AND METHODS FOR MANUFACTURING SEMICONDUCTOR MODULES

PRINTED CIRCUIT BOARD AND LIGHT GUIDE FOR ELECTRONICS ASSEMBLY

Manufacturing Implantable Tissue Stimulators

ILLUMINATED MULTILAYER STRUCTURE WITH EMBEDDED LIGHT SOURCES

DI METAL TRANSACTION DEVICES AND PROCESSES FOR THE MANUFACTURE THEREOF

SYSTEM AND METHOD FOR HEAT REMOVAL USING A THERMAL POTTING SOLUTION...