Moulding and encapsulation Deposition techniques Protective layers

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CPC
H05K2203/13

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/13Moulding and encapsulation Deposition techniques Protective layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Component carrier with embedded interposer laterally between electr...
- Patent number 12,165,964
- Issue date Dec 10, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,167,540
- Issue date Dec 10, 2024
- LG Innotek Co., Ltd
- Eui Yeol Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overmolded components having sub-flush residuals
- Patent number 12,156,345
- Issue date Nov 26, 2024
- Apple Inc.
- Depeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing shielded printed wiring board and shielded...
- Patent number 12,150,239
- Issue date Nov 19, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Sirou Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,137,523
- Issue date Nov 5, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Lighting system with lens assembly
- Patent number 12,129,990
- Issue date Oct 29, 2024
- KORRUS, INC.
- Ariel Meir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Molded article, electrical product and method for producing molded...
- Patent number 12,122,078
- Issue date Oct 22, 2024
- Nissha Co., Ltd.
- Seiichi Yamazaki
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Mouth guard having user-notification feature of impact force
- Patent number 12,109,045
- Issue date Oct 8, 2024
- Force Impact Technologies, Inc.
- Anthony M. Gonzales
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Waterproof electronic pen
- Patent number 12,111,986
- Issue date Oct 8, 2024
- Wacom Co., Ltd.
- Takayuki Arai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of insulated metal substrate
- Patent number 12,096,569
- Issue date Sep 17, 2024
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,096,562
- Issue date Sep 17, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,089,349
- Issue date Sep 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive assembly, camera module and manufacturing method the...
- Patent number 12,081,849
- Issue date Sep 3, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Zhongyu Luan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Flexible circuit board
- Patent number 12,082,352
- Issue date Sep 3, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Yao-Cai Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and manufacturing method of display device
- Patent number 12,069,910
- Issue date Aug 20, 2024
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder paste stencil with aperture wall coating
- Patent number 12,069,810
- Issue date Aug 20, 2024
- SanDisk Technologies, Inc.
- Fakhrozi Bin Che Ani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conformal electromagnetic interference shielding film
- Patent number 12,069,845
- Issue date Aug 20, 2024
- Microsoft Technology Licensing, LLC
- Jaejin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Control unit for a motor vehicle and method for producing and measu...
- Patent number 12,058,809
- Issue date Aug 6, 2024
- Vitesco Technologies Germany GmbH
- Christian Walda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a number of electrical nodes, electrical n...
- Patent number 12,052,829
- Issue date Jul 30, 2024
- TACTOTEK OY
- Tomi Simula
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 12,051,616
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-treated glass cloth, prepreg, and printed wiring board
- Patent number 12,041,727
- Issue date Jul 16, 2024
- Nitto Boseki Co., LTD
- Kazutaka Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module and array camera module based on integral packaging t...
- Patent number 12,035,029
- Issue date Jul 9, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D-printed, PCB composite structures, and formation methods
- Patent number 12,035,465
- Issue date Jul 9, 2024
- Continental Automotive Systems, Inc.
- Stanton F Rak
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electrical device having heat dissipation structure using filler an...
- Patent number 12,028,985
- Issue date Jul 2, 2024
- SOLUM CO., LTD.
- Jun Kyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with stacked passive components
- Patent number 12,022,618
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Chien Te Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,004,299
- Issue date Jun 4, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Circuit board
- Patent number 12,004,301
- Issue date Jun 4, 2024
- Dongwoo Fine-Chem Co., Ltd.
- Ki Joon Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for coating a substrate
- Patent number 12,004,303
- Issue date Jun 4, 2024
- Nordson Corporation
- Michel Van De Vijver
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Process for laminating graphene-coated printed circuit boards
- Patent number 12,004,308
- Issue date Jun 4, 2024
- Mellanox Technologies, Ltd.
- Boaz Atias
- C01 - INORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240407099
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyun Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD TO PRODUCE ELECTRONIC DEVICE
- Publication number 20240389244
- Publication date Nov 21, 2024
- Darwin Precisions Corporation
- Keng-Kuei Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY
- Publication number 20240373559
- Publication date Nov 7, 2024
- TactoTek Oy
- Mikko HEIKKINEN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CONFORMAL ELECTROMAGNETIC INTERFERENCE SHIELDING FILM
- Publication number 20240373608
- Publication date Nov 7, 2024
- Microsoft Technology Licensing, LLC
- Jaejin LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, DISPLAY APPARATUS, AND MANUFACTURING METHOD FOR CIRC...
- Publication number 20240365478
- Publication date Oct 31, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Guoteng LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR PACKAGING MUL...
- Publication number 20240341029
- Publication date Oct 10, 2024
- Spreadtrum Communications (Shanghai) CO., Ltd.
- Li YAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICE HAVING HEAT DISSIPATION STRUCTURE USING FILLER AN...
- Publication number 20240334614
- Publication date Oct 3, 2024
- SOLUM CO., LTD.
- Jun Kyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240314937
- Publication date Sep 19, 2024
- LG Innotek Co., Ltd.
- Hee Jung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT DEVICE
- Publication number 20240306294
- Publication date Sep 12, 2024
- AUO Corporation
- CHUN-YUEH HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLANTABLE MEDICAL DEVICE CASE FIT WITH SELECTIVE ENCAPSULATION
- Publication number 20240306310
- Publication date Sep 12, 2024
- Cardiac Pacemakers, Inc.
- Benjamin J. Haasl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE
- Publication number 20240306304
- Publication date Sep 12, 2024
- HYUNDAI MOBIS CO., LTD.
- Chan Yang CHOE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER FOR AN ELECTRICAL DEVICE
- Publication number 20240306309
- Publication date Sep 12, 2024
- Honeywell International Inc.
- Sandeep Laxman MAUT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY
- Publication number 20240284598
- Publication date Aug 22, 2024
- TactoTek Oy
- Mikko HEIKKINEN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
- Publication number 20240276653
- Publication date Aug 15, 2024
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240276650
- Publication date Aug 15, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yu-Hsien LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240268034
- Publication date Aug 8, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jesang Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ORGANIC SUBSTRATE-BASED WEARABLE PLATFORM AND METHODS FOR ON-BODY S...
- Publication number 20240268037
- Publication date Aug 8, 2024
- Takaroa Corporation, Inc.
- Ethan M. Devine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL AR...
- Publication number 20240226565
- Publication date Jul 11, 2024
- The Regents of the University of California
- Shadi A. Dayeh
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240224409
- Publication date Jul 4, 2024
- FUJIFILM CORPORATION
- Yusuke FUJII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240186261
- Publication date Jun 6, 2024
- FUJIFILM CORPORATION
- Yusuke FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR, CIRCUIT MODULE, AND METHOD OF MANUFAC...
- Publication number 20240170221
- Publication date May 23, 2024
- Murata Manufacturing Co., Ltd.
- China UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240155771
- Publication date May 9, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENCAPSULATING ELECTRONICS ON FLEXIBLE FLUOROELASTOMER SUBSTRATES
- Publication number 20240138061
- Publication date Apr 25, 2024
- Saudi Arabian Oil Company
- Sahil P. Wankhede
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL AR...
- Publication number 20240131339
- Publication date Apr 25, 2024
- The Regents of the University of California
- Shadi A. Dayeh
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SENSORS, SYSTEMS AND METHODS FOR DETECTING ANALYTES USING SAME
- Publication number 20240125738
- Publication date Apr 18, 2024
- MODOC TECHNOLOGIES, LLC
- David H. Sierra
- G01 - MEASURING TESTING
Information Patent Application
WATERPROOF ELECTRONIC PEN
- Publication number 20240085997
- Publication date Mar 14, 2024
- WACOM CO., LTD.
- Takayuki Arai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TRANSFER MOLDING SYSTEMS FOR SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20240074066
- Publication date Feb 29, 2024
- Apple Inc.
- Nitesh KUMBHAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240057249
- Publication date Feb 15, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED PLATE AND WIRING BASE BOARD PRODUCTION METHOD
- Publication number 20240049395
- Publication date Feb 8, 2024
- Resonac Corporation
- Masaya TOBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...
- Publication number 20240032204
- Publication date Jan 25, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yueh-Kai TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Moulding and encapsulation Deposition techniques Protective layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Component carrier with embedded interposer laterally between electr...

Printed circuit board

Overmolded components having sub-flush residuals

Method for manufacturing shielded printed wiring board and shielded...

Interface assembly and method for manufacturing interface assembly

Lighting system with lens assembly

Hermetic metallized via with improved reliability

Molded article, electrical product and method for producing molded...

Mouth guard having user-notification feature of impact force

Waterproof electronic pen

Manufacturing method of insulated metal substrate

Interface assembly and method for manufacturing interface assembly

Semiconductor device package and method of manufacturing the same

Photosensitive assembly, camera module and manufacturing method the...

Flexible circuit board

Display device and manufacturing method of display device

Solder paste stencil with aperture wall coating

Conformal electromagnetic interference shielding film

Control unit for a motor vehicle and method for producing and measu...

Method for manufacturing a number of electrical nodes, electrical n...

Wafer level chip scale packaging intermediate structure apparatus a...

Surface-treated glass cloth, prepreg, and printed wiring board

Camera module and array camera module based on integral packaging t...

3D-printed, PCB composite structures, and formation methods

Electrical device having heat dissipation structure using filler an...

Printed circuit board with stacked passive components

Interface assembly and method for manufacturing interface assembly

Circuit board

Systems for coating a substrate

Process for laminating graphene-coated printed circuit boards

Patents Applicationslast 30 patents

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

ELECTRONIC DEVICE AND METHOD TO PRODUCE ELECTRONIC DEVICE

INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY

CONFORMAL ELECTROMAGNETIC INTERFERENCE SHIELDING FILM

CIRCUIT BOARD, DISPLAY APPARATUS, AND MANUFACTURING METHOD FOR CIRC...

MULTILAYER PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR PACKAGING MUL...

ELECTRICAL DEVICE HAVING HEAT DISSIPATION STRUCTURE USING FILLER AN...

CIRCUIT BOARD

CIRCUIT DEVICE

IMPLANTABLE MEDICAL DEVICE CASE FIT WITH SELECTIVE ENCAPSULATION

APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE

BARRIER LAYER FOR AN ELECTRICAL DEVICE

INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY

WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

ORGANIC SUBSTRATE-BASED WEARABLE PLATFORM AND METHODS FOR ON-BODY S...

MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL AR...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

MULTILAYER CERAMIC CAPACITOR, CIRCUIT MODULE, AND METHOD OF MANUFAC...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

ENCAPSULATING ELECTRONICS ON FLEXIBLE FLUOROELASTOMER SUBSTRATES

MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL AR...

SENSORS, SYSTEMS AND METHODS FOR DETECTING ANALYTES USING SAME

WATERPROOF ELECTRONIC PEN

TRANSFER MOLDING SYSTEMS FOR SEMICONDUCTOR DEVICE PACKAGING

ELECTRONIC PACKAGE AND METHOD FOR MAKING THE SAME

LAYERED PLATE AND WIRING BASE BOARD PRODUCTION METHOD

METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...