Moulding and encapsulation Deposition techniques Protective layers

Industry

CPC
H05K2203/13

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/13Moulding and encapsulation Deposition techniques Protective layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Recyclable electronic device
- Patent number 12,349,286
- Issue date Jul 1, 2025
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Stephan Harkema
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of producing wiring board
- Patent number 12,342,473
- Issue date Jun 24, 2025
- TOPPAN INC.
- Takeshi Tamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module including a grooved shield film
- Patent number 12,295,130
- Issue date May 6, 2025
- Murata Manufacturing Co., Ltd.
- Tetsuya Oda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
On-vehicle illumination device and production method therefor
- Patent number 12,292,172
- Issue date May 6, 2025
- Stanley Electric Co., Ltd.
- Reiki Tada
- F21 - LIGHTING
Information Patent Grant
Printed wiring board
- Patent number 12,289,829
- Issue date Apr 29, 2025
- Ibiden Co., Ltd.
- Jun Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,262,519
- Issue date Mar 25, 2025
- Murata Manufacturing Co., Ltd.
- Shota Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-clad laminated plate, resin-clad copper foil, and circuit su...
- Patent number 12,233,621
- Issue date Feb 25, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Kitai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Mouth guard having internal components for sensing impact forces
- Patent number 12,232,889
- Issue date Feb 25, 2025
- Force Impact Technologies, Inc.
- Anthony M. Gonzales
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mouth guard having low-profile printed circuit board for sensing an...
- Patent number 12,213,805
- Issue date Feb 4, 2025
- Force Impact Technologies, Inc.
- Anthony M. Gonzales
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Control device for a motor vehicle
- Patent number 12,200,872
- Issue date Jan 14, 2025
- Vitesco Technologies Germany GmbH
- Johannes Bock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device with multilayer laminate
- Patent number 12,185,474
- Issue date Dec 31, 2024
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Jeroen Van Den Brand
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,167,540
- Issue date Dec 10, 2024
- LG Innotek Co., Ltd
- Eui Yeol Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with embedded interposer laterally between electr...
- Patent number 12,165,964
- Issue date Dec 10, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overmolded components having sub-flush residuals
- Patent number 12,156,345
- Issue date Nov 26, 2024
- Apple Inc.
- Depeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing shielded printed wiring board and shielded...
- Patent number 12,150,239
- Issue date Nov 19, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Sirou Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,137,523
- Issue date Nov 5, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Lighting system with lens assembly
- Patent number 12,129,990
- Issue date Oct 29, 2024
- KORRUS, INC.
- Ariel Meir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Molded article, electrical product and method for producing molded...
- Patent number 12,122,078
- Issue date Oct 22, 2024
- Nissha Co., Ltd.
- Seiichi Yamazaki
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Mouth guard having user-notification feature of impact force
- Patent number 12,109,045
- Issue date Oct 8, 2024
- Force Impact Technologies, Inc.
- Anthony M. Gonzales
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Waterproof electronic pen
- Patent number 12,111,986
- Issue date Oct 8, 2024
- Wacom Co., Ltd.
- Takayuki Arai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of insulated metal substrate
- Patent number 12,096,569
- Issue date Sep 17, 2024
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,096,562
- Issue date Sep 17, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,089,349
- Issue date Sep 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive assembly, camera module and manufacturing method the...
- Patent number 12,081,849
- Issue date Sep 3, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Zhongyu Luan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Flexible circuit board
- Patent number 12,082,352
- Issue date Sep 3, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Yao-Cai Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste stencil with aperture wall coating
- Patent number 12,069,810
- Issue date Aug 20, 2024
- SanDisk Technologies, Inc.
- Fakhrozi Bin Che Ani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conformal electromagnetic interference shielding film
- Patent number 12,069,845
- Issue date Aug 20, 2024
- Microsoft Technology Licensing, LLC
- Jaejin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and manufacturing method of display device
- Patent number 12,069,910
- Issue date Aug 20, 2024
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control unit for a motor vehicle and method for producing and measu...
- Patent number 12,058,809
- Issue date Aug 6, 2024
- Vitesco Technologies Germany GmbH
- Christian Walda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE REMOVAL OF ADHESIVE FROM COVERLAY FOR PRINTED CIRCUIT BOA...
- Publication number 20250227837
- Publication date Jul 10, 2025
- Rockwell Collins, Inc.
- John A. Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250212321
- Publication date Jun 26, 2025
- Dyi-Chung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250203767
- Publication date Jun 19, 2025
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE, FILM, THERMOSETTING FILM, AND MANUFACTURING METHOD OF WIR...
- Publication number 20250178313
- Publication date Jun 5, 2025
- FUJIFILM CORPORATION
- Daisuke HAYASHI
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250185180
- Publication date Jun 5, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Chanhoon Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...
- Publication number 20250168977
- Publication date May 22, 2025
- The Trustees of the University of Pennsylvania
- Alan T. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20250168970
- Publication date May 22, 2025
- KYOCERA CORPORATION
- Daichi SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250132224
- Publication date Apr 24, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jung Chul GONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250133656
- Publication date Apr 24, 2025
- LG Innotek Co., Ltd.
- Sang Il KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULES WITH ENCAPSULANT-EMBEDDED LEADFRAME TERMINALS, AND...
- Publication number 20250126716
- Publication date Apr 17, 2025
- NXP USA, Inc.
- Boon Yew Low
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...
- Publication number 20250113447
- Publication date Apr 3, 2025
- FUJI CORPORATION
- Tasuku TAKEUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS TO MANAGE NOISE FOR TIMING CIRCUITRY
- Publication number 20250107003
- Publication date Mar 27, 2025
- Intel Corporation
- Chin Mian Choong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250107008
- Publication date Mar 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Hyun Hu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATED ELECTRICAL ASSEMBLY
- Publication number 20250098077
- Publication date Mar 20, 2025
- HZO, Inc.
- Gianfranco Aresta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and Apparatus for Increasing Skin Depth and Reducing Eddy Cu...
- Publication number 20250087483
- Publication date Mar 13, 2025
- Atlas Magnetics
- John Othniel McDonald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADING COATING FOR ELECTRONIC ASSEMBLIES
- Publication number 20250071883
- Publication date Feb 27, 2025
- Elbit Systems Ltd.
- Reut BEN ZAKEN (BITTON)
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE
- Publication number 20250056729
- Publication date Feb 13, 2025
- MURATA MANUFACTURING CO., LTD.
- Ryuichi KUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mouth Guard Having User-Notification Feature Of Impact Force
- Publication number 20250025104
- Publication date Jan 23, 2025
- Force Impact Technologies, Inc.
- Anthony M. Gonzales
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for Manufacturing Shielded Printed Wiring Board and Shielded...
- Publication number 20250031298
- Publication date Jan 23, 2025
- Tatsuta Electric Wire & Cable Co., Ltd.
- Sirou YAMAUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING METHOD AND PACKAGING DEVICE FOR PCBA BOARD
- Publication number 20240431033
- Publication date Dec 26, 2024
- KONIG ELECTRONIC TECHNOLOGY CO., LTD
- Jianxiao ZHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WATERPROOF ELECTRONIC PEN
- Publication number 20240427435
- Publication date Dec 26, 2024
- WACOM CO., LTD.
- Takayuki Arai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DESIGN OF A RECYCLABLE ELECTRONIC DEVICE
- Publication number 20240431037
- Publication date Dec 26, 2024
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Stephan HARKEMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240407099
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyun Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD TO PRODUCE ELECTRONIC DEVICE
- Publication number 20240389244
- Publication date Nov 21, 2024
- Darwin Precisions Corporation
- Keng-Kuei Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY
- Publication number 20240373559
- Publication date Nov 7, 2024
- TactoTek Oy
- Mikko HEIKKINEN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CONFORMAL ELECTROMAGNETIC INTERFERENCE SHIELDING FILM
- Publication number 20240373608
- Publication date Nov 7, 2024
- Microsoft Technology Licensing, LLC
- Jaejin LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, DISPLAY APPARATUS, AND MANUFACTURING METHOD FOR CIRC...
- Publication number 20240365478
- Publication date Oct 31, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Guoteng LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR PACKAGING MUL...
- Publication number 20240341029
- Publication date Oct 10, 2024
- Spreadtrum Communications (Shanghai) CO., Ltd.
- Li YAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICE HAVING HEAT DISSIPATION STRUCTURE USING FILLER AN...
- Publication number 20240334614
- Publication date Oct 3, 2024
- SOLUM CO., LTD.
- Jun Kyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240314937
- Publication date Sep 19, 2024
- LG Innotek Co., Ltd.
- Hee Jung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Moulding and encapsulation Deposition techniques Protective layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Recyclable electronic device

Wiring board and method of producing wiring board

Module including a grooved shield film

On-vehicle illumination device and production method therefor

Printed wiring board

Module

Copper-clad laminated plate, resin-clad copper foil, and circuit su...

Mouth guard having internal components for sensing impact forces

Mouth guard having low-profile printed circuit board for sensing an...

Control device for a motor vehicle

Electronic device with multilayer laminate

Printed circuit board

Component carrier with embedded interposer laterally between electr...

Overmolded components having sub-flush residuals

Method for manufacturing shielded printed wiring board and shielded...

Interface assembly and method for manufacturing interface assembly

Lighting system with lens assembly

Hermetic metallized via with improved reliability

Molded article, electrical product and method for producing molded...

Mouth guard having user-notification feature of impact force

Waterproof electronic pen

Manufacturing method of insulated metal substrate

Interface assembly and method for manufacturing interface assembly

Semiconductor device package and method of manufacturing the same

Photosensitive assembly, camera module and manufacturing method the...

Flexible circuit board

Solder paste stencil with aperture wall coating

Conformal electromagnetic interference shielding film

Display device and manufacturing method of display device

Control unit for a motor vehicle and method for producing and measu...

Patents Applicationslast 30 patents

SELECTIVE REMOVAL OF ADHESIVE FROM COVERLAY FOR PRINTED CIRCUIT BOA...

SUBSTRATE AND MANUFACTURING METHOD THEREOF

PRINTED WIRING BOARD

LAMINATE, FILM, THERMOSETTING FILM, AND MANUFACTURING METHOD OF WIR...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...

WIRING BOARD

PRINTED CIRCUIT BOARD

SEMICONDUCTOR PACKAGE

CIRCUIT MODULES WITH ENCAPSULANT-EMBEDDED LEADFRAME TERMINALS, AND...

ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...

METHODS AND APPARATUS TO MANAGE NOISE FOR TIMING CIRCUITRY

PRINTED CIRCUIT BOARD

COATED ELECTRICAL ASSEMBLY

Method and Apparatus for Increasing Skin Depth and Reducing Eddy Cu...

HEAT SPREADING COATING FOR ELECTRONIC ASSEMBLIES

SUBSTRATE

Mouth Guard Having User-Notification Feature Of Impact Force

Method for Manufacturing Shielded Printed Wiring Board and Shielded...

PACKAGING METHOD AND PACKAGING DEVICE FOR PCBA BOARD

WATERPROOF ELECTRONIC PEN

DESIGN OF A RECYCLABLE ELECTRONIC DEVICE

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

ELECTRONIC DEVICE AND METHOD TO PRODUCE ELECTRONIC DEVICE

INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY

CONFORMAL ELECTROMAGNETIC INTERFERENCE SHIELDING FILM

CIRCUIT BOARD, DISPLAY APPARATUS, AND MANUFACTURING METHOD FOR CIRC...

MULTILAYER PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR PACKAGING MUL...

ELECTRICAL DEVICE HAVING HEAT DISSIPATION STRUCTURE USING FILLER AN...

CIRCUIT BOARD