Moulds

Industry

CPC
H01L21/565

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/565Moulds

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including interposer
- Patent number 12,170,249
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Jong-youn Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure
- Patent number 12,170,236
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,170,274
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,170,251
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,165,978
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using cavity substrate and manufacturing methods
- Patent number 12,165,986
- Issue date Dec 10, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with cavities and methods of manufactur...
- Patent number 12,165,942
- Issue date Dec 10, 2024
- Texas Instruments Incorporated
- Jesus Bajo Bautista
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, encapsulated package with punched lead and sawn side fla...
- Patent number 12,165,959
- Issue date Dec 10, 2024
- Infineon Technologies AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,165,985
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,165,988
- Issue date Dec 10, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Min Won Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing resistor layer, and method of manufacturing sem...
- Patent number 12,164,232
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,159,863
- Issue date Dec 3, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package having conductive p...
- Patent number 12,159,822
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having hollow cylinders and method of fabricating...
- Patent number 12,159,851
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with mold patterning to create pac...
- Patent number 12,155,133
- Issue date Nov 26, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including antenna
- Patent number 12,154,873
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 12,154,845
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame design in embedded die package
- Patent number 12,154,861
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip integrated fan-out package
- Patent number 12,148,728
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and associated methods with antennas and EMI...
- Patent number 12,148,711
- Issue date Nov 19, 2024
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stencil for controlling die attach material thickness on die
- Patent number 12,142,549
- Issue date Nov 12, 2024
- Texas Instruments Incorporated
- Mario Alfonso Eduardo Magana
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package comprising metal layer configured for electromagnetic inter...
- Patent number 12,142,577
- Issue date Nov 12, 2024
- QUALCOMM Technologies, Inc.
- Marc Huesgen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,142,571
- Issue date Nov 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Chao Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device
- Patent number 12,142,491
- Issue date Nov 12, 2024
- Ampleon Netherlands B.V.
- Frans Meeuwsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nested architectures for enhanced heterogeneous integration
- Patent number 12,142,545
- Issue date Nov 12, 2024
- Intel Corporation
- Ravindranath Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite bridge die-to-die interconnects for integrated-circuit pa...
- Patent number 12,142,570
- Issue date Nov 12, 2024
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor having tubular walled sensing cavity
- Patent number 12,135,303
- Issue date Nov 5, 2024
- Texas Instruments Incorporated
- Christlyn Faith Arias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlayer of sub-structure having elevations and further sub-struc...
- Patent number 12,136,578
- Issue date Nov 5, 2024
- Infineon Technologies AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a chip package, method of forming a semiconductor...
- Patent number 12,136,583
- Issue date Nov 5, 2024
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE WITH REDISTRIBUTION LAYER PLATE FORMED VIA TEMPO...
- Publication number 20240421019
- Publication date Dec 19, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421020
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- YOUNG KWAN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240421103
- Publication date Dec 19, 2024
- Advanced Semiconductor Engineering, Inc.
- Chia Hsiu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MOLDING APPARATUS AND COMPRESSION MOLDING METHOD USIN...
- Publication number 20240420972
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Taejun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTIPLE STACKED PASSIVE DEVICES
- Publication number 20240421128
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Enhanced FCBGA Package
- Publication number 20240421024
- Publication date Dec 19, 2024
- STATS ChipPAC Pte Ltd.
- KyungOe Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USIN...
- Publication number 20240421055
- Publication date Dec 19, 2024
- STMicroelectronics International N.V.
- Loic Pierre Louis RENARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE
- Publication number 20240421120
- Publication date Dec 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20240413030
- Publication date Dec 12, 2024
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, POWER ELECTRONIC SUBSTRATE AND METHOD FOR FAB...
- Publication number 20240413046
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Frank Sauerland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUS...
- Publication number 20240413025
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Georg Troska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240412982
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interlayer of Sub-structure Having Elevations and Further Sub-struc...
- Publication number 20240413033
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240413028
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making an EMI Shield Using Inten...
- Publication number 20240413095
- Publication date Dec 12, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Package Structures Including Redistribution Layers
- Publication number 20240404992
- Publication date Dec 5, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making an Interconnect Bridge wi...
- Publication number 20240404956
- Publication date Dec 5, 2024
- STATS ChipPAC Pte Ltd.
- YongTaek Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PROCESS FOR SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240404973
- Publication date Dec 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mohamad Ashraf bin Mohd Arshad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING COMPOSITION, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATIN...
- Publication number 20240404898
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia Hao Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20240404924
- Publication date Dec 5, 2024
- MEDIATEK INC.
- Tsung-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240404831
- Publication date Dec 5, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240404900
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN
- Publication number 20240404926
- Publication date Dec 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Heejo CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240404932
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240404878
- Publication date Dec 5, 2024
- Amkor Technology Portugal, S.A.
- Eoin O'Toole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240395725
- Publication date Nov 28, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Myung Jea Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THEREOF
- Publication number 20240395751
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF
- Publication number 20240395783
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240395727
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Channels in Encapsulant...
- Publication number 20240395647
- Publication date Nov 28, 2024
- STATS ChipPAC Pte Ltd.
- Jian Zuo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package including interposer

Method for forming package structure

Semiconductor packages and methods of forming same

Semiconductor package

Package structure and method of manufacturing the same

Semiconductor package using cavity substrate and manufacturing methods

Integrated circuit packages with cavities and methods of manufactur...

Leadframe, encapsulated package with punched lead and sawn side fla...

Semiconductor device and method

Semiconductor devices and methods of manufacturing semiconductor de...

Method for removing resistor layer, and method of manufacturing sem...

Semiconductor devices and methods of manufacturing semiconductor de...

Method of manufacturing a semiconductor package having conductive p...

Package structure having hollow cylinders and method of fabricating...

Microelectronic devices designed with mold patterning to create pac...

Semiconductor package including antenna

Semiconductor package with nickel-silver pre-plated leadframe

Frame design in embedded die package

Multi-chip integrated fan-out package

Semiconductor packages and associated methods with antennas and EMI...

Wafer stencil for controlling die attach material thickness on die

Package comprising metal layer configured for electromagnetic inter...

Power amplifier modules including semiconductor resistor and tantal...

Semiconductor device package and method of manufacturing the same

Packaged electronic device

Nested architectures for enhanced heterogeneous integration

Composite bridge die-to-die interconnects for integrated-circuit pa...

Sensor having tubular walled sensing cavity

Interlayer of sub-structure having elevations and further sub-struc...

Method of forming a chip package, method of forming a semiconductor...

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE WITH REDISTRIBUTION LAYER PLATE FORMED VIA TEMPO...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR MOLDING APPARATUS AND COMPRESSION MOLDING METHOD USIN...

SEMICONDUCTOR DEVICE WITH MULTIPLE STACKED PASSIVE DEVICES

Thermally Enhanced FCBGA Package

SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USIN...

PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE

PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

SEMICONDUCTOR MODULE, POWER ELECTRONIC SUBSTRATE AND METHOD FOR FAB...

METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUS...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Interlayer of Sub-structure Having Elevations and Further Sub-struc...

DIE STRUCTURES AND METHODS OF FORMING THE SAME

Semiconductor Device and Method of Making an EMI Shield Using Inten...

Multi-Die Package Structures Including Redistribution Layers

Semiconductor Device and Method of Making an Interconnect Bridge wi...

WAFER LEVEL PROCESS FOR SEMICONDUCTOR DEVICE PACKAGE

MOLDING COMPOSITION, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATIN...

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THEREOF

PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

Semiconductor Device and Method of Forming Channels in Encapsulant...