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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/565
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Patents Grants
last 30 patents
Information
Patent Grant
Film covers for sensor packages
Patent number
11,972,994
Issue date
Apr 30, 2024
Texas Instruments Incorporated
Sreenivasan Kalyani Koduri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lid attach process and dispenser head
Patent number
11,972,956
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chin-Liang Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
Patent number
11,973,007
Issue date
Apr 30, 2024
Rohm Co., Ltd.
Toshio Hanada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,973,037
Issue date
Apr 30, 2024
Powertech Technology Inc.
Shang-Yu Chang Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,973,042
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Jingu Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
11,973,001
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shu-Shen Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip packaging method and chip package unit
Patent number
11,973,010
Issue date
Apr 30, 2024
Richtek Technology Corporation
Hao-Lin Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module with semiconductor packages mounted on metal frame
Patent number
11,973,012
Issue date
Apr 30, 2024
Infineon Technologies Austria AG
Andreas Grassmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and method of manufacturing the same
Patent number
11,973,039
Issue date
Apr 30, 2024
Advanced Semiconductor Engineering, Inc.
Chia-Hao Sung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chiplet first architecture for die tiling applications
Patent number
11,973,041
Issue date
Apr 30, 2024
Intel Corporation
Srinivas Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stud bump for wirebonding high voltage isolation barrier connection
Patent number
11,973,052
Issue date
Apr 30, 2024
Texas Instruments Incorporated
Chien-Chang Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution substrate, method of fabricating the same, and semic...
Patent number
11,973,028
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Jongyoun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure with improved antenna patterns performance
Patent number
11,973,038
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Fang-Yu Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
Patent number
11,967,543
Issue date
Apr 23, 2024
Rohm Co., Ltd.
Toshio Hanada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tie bar removal for semiconductor device packaging
Patent number
11,967,507
Issue date
Apr 23, 2024
NXP USA, INC.
Richard Te Gan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor device and method for fabricating a packaged...
Patent number
11,967,562
Issue date
Apr 23, 2024
Infineon Technologies AG
Horst Theuss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with EMI shield and fabricating method thereof
Patent number
11,967,567
Issue date
Apr 23, 2024
Amkor Technology Singapore Holding Pte Ltd.
Doo Soub Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
RF devices with nanotube particles for enhanced performance and met...
Patent number
11,961,781
Issue date
Apr 16, 2024
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Via for semiconductor device connection and methods of forming the...
Patent number
11,961,800
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
Patent number
11,961,805
Issue date
Apr 16, 2024
Skyworks Solutions, Inc.
Howard E. Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
RF devices with enhanced performance and methods of forming the same
Patent number
11,961,813
Issue date
Apr 16, 2024
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
Patent number
11,955,434
Issue date
Apr 9, 2024
Intel Corporation
Yoshihiro Tomita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module
Patent number
11,955,451
Issue date
Apr 9, 2024
Rohm Co., Ltd.
Kenji Hayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
RE49912
Issue date
Apr 9, 2024
Rohm Co., Ltd.
Akihiro Kimura
Information
Patent Grant
Package-on-package device
Patent number
11,955,433
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming vertical interconnect st...
Patent number
11,955,467
Issue date
Apr 9, 2024
STATS ChipPAC Pte. Ltd.
Junghwan Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module
Patent number
11,955,452
Issue date
Apr 9, 2024
Rohm Co., Ltd.
Kenji Hayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Advanced info POP and method of forming thereof
Patent number
11,955,460
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Da Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Encapsulation process for double-sided cooled packages
Patent number
11,955,347
Issue date
Apr 9, 2024
ASMPT SINGAPORE PTE. LTD.
Teng Hock Kuah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of forming the same
Patent number
11,948,863
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hung-Chun Cho
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DIE SHIELDING STRUCTURE
Publication number
20240145402
Publication date
May 2, 2024
CYPRESS SEMICONDUCTOR CORPORATION
Mark PAVIER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package with Heat Dissipation Structure and Method for Forming the...
Publication number
20240145342
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Tung-Liang Shao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240145397
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Jeongho LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Cross-Wafer RDLs in Constructed Wafers
Publication number
20240145257
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240145350
Publication date
May 2, 2024
MEDIATEK INC.
Pu-Shan HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND ASSOCIATED METHODS WITH SOLDER MASK OPEN...
Publication number
20240145405
Publication date
May 2, 2024
Micron Technology, Inc.
Avishesh Dhakal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240145444
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Kiju Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240145295
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Jihyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDING APPARATUS FOR FABRICATING SEMICONDUCTOR PACKAGE AND MOLDING...
Publication number
20240145268
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Jun Woo Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package with Molded Heat Dissipation Plate
Publication number
20240145325
Publication date
May 2, 2024
Infineon Technologies Austria AG
Joon Seo Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING SUCH SEMICONDUC...
Publication number
20240145354
Publication date
May 2, 2024
NEXPERIA B.V.
Arnel Taduran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE
Publication number
20240136299
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240136242
Publication date
Apr 25, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Hyeon Gyu Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER
Publication number
20240136247
Publication date
Apr 25, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Liangbiao CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED HIGH VOLTAGE MOSFET DEVICE WITH CONNECTION CLIP AND MANUFA...
Publication number
20240136260
Publication date
Apr 25, 2024
STMicroelectronics S.r.l.
Cristiano Gianluca STELLA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES WITH EMBEDDED FILLER PARTICLES AND ASSOCIATED...
Publication number
20240136240
Publication date
Apr 25, 2024
INFINEON TECHNOLOGIES AG
Martin MAYER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
InFO-POP Structures with TIVs Having Cavities
Publication number
20240136298
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Dp., Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT STRIPS
Publication number
20240128094
Publication date
Apr 18, 2024
TEXAS INSTRUMENTS INCORPORATED
CHIH-CHIEN HO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240128173
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Ji-Yong Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20240128206
Publication date
Apr 18, 2024
Advanced Semiconductor Engineering, Inc.
Peng YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS
Publication number
20240128205
Publication date
Apr 18, 2024
Intel Corporation
Debendra MALLIK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
Publication number
20240128152
Publication date
Apr 18, 2024
Intel Corporation
Elizabeth NOFEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION
Publication number
20240128162
Publication date
Apr 18, 2024
Intel Corporation
Ravindranath MAHAJAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CLEANING LIQUID AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240124799
Publication date
Apr 18, 2024
Kabushiki Kaisha Toshiba
Masato YASUI
C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information
Patent Application
MULTI-CHIP PACKAGING METHOD AND MULTI-CHIP PACKAGING STRUCTURE
Publication number
20240128141
Publication date
Apr 18, 2024
Luxis Precision Intelligent Manufacturing (Kunshan) Co., Ltd.
Yijun YE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240128232
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Ding Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
Publication number
20240128145
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
HYEONSEOK LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR AND METHOD FOR FORMING THE SAME
Publication number
20240128196
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wen-Shiang Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240128155
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Minjun Bae
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240120288
Publication date
Apr 11, 2024
Advanced Semiconductor Engineering, Inc.
Chih-Hsin LAI
H01 - BASIC ELECTRIC ELEMENTS