mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package

Industry

CPC
H01Q1/2283

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Parent Industries

HELECTRICITY H01Electric elements H01QAERIALS H01Q1/00Details of, or arrangements associated with, aerials

Current Industry

H01Q1/2283mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package

Industries

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,967,758
- Issue date Apr 23, 2024
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ex-situ manufacture of metal micro-wires and FIB placement in IC ci...
- Patent number 11,967,569
- Issue date Apr 23, 2024
- Texas Instruments Incorporated
- Michael Lee Dawson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,967,570
- Issue date Apr 23, 2024
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module and electronic device including the same
- Patent number 11,967,759
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Soon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna apparatus and method
- Patent number 11,961,809
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages including multiple d...
- Patent number 11,961,825
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Aparna U. Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package and image display device including the same
- Patent number 11,955,693
- Issue date Apr 9, 2024
- Dongwoo Fine-Chem Co., Ltd.
- Byung Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna device
- Patent number 11,955,726
- Issue date Apr 9, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Nam Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including multiple substrates with dif...
- Patent number 11,955,419
- Issue date Apr 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Yi Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device package with integrated antenna
- Patent number 11,955,692
- Issue date Apr 9, 2024
- Texas Instruments Incorporated
- Juan Alejandro Herbsommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Loading blocks for antennas in system packaging
- Patent number 11,955,717
- Issue date Apr 9, 2024
- Apple Inc.
- Thomas Wu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differential on-chip loop antenna
- Patent number 11,955,728
- Issue date Apr 9, 2024
- Intel Corporation
- Nir Weisman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module and communication device carrying the same
- Patent number 11,955,737
- Issue date Apr 9, 2024
- National University Corporation Saitama University
- Masataka Ohira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package and image display device including the same
- Patent number 11,955,709
- Issue date Apr 9, 2024
- Dongwoo Fine-Chem Co., Ltd.
- Na Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna structure and terminal
- Patent number 11,955,725
- Issue date Apr 9, 2024
- VIVO MOBILE COMMUNICATION CO., LTD.
- Xianjing Jian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter wave antenna tuner
- Patent number 11,949,175
- Issue date Apr 2, 2024
- QUALCOMM Incorporated
- Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming stacked semiconductors die assemblies
- Patent number 11,948,921
- Issue date Apr 2, 2024
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency and high power thin-film component
- Patent number 11,949,169
- Issue date Apr 2, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna structure and terminal device
- Patent number 11,942,674
- Issue date Mar 26, 2024
- VIVO MOBILE COMMUNICATION CO., LTD.
- Yijin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, antenna module, and communication device
- Patent number 11,936,096
- Issue date Mar 19, 2024
- Murata Manufacturing Co., Ltd.
- Norikazu Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna element module
- Patent number 11,936,124
- Issue date Mar 19, 2024
- Viasat, Inc.
- Douglas J. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with an antenna substrate
- Patent number 11,935,849
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communication apparatus and method for adaptive cooling of antenna...
- Patent number 11,936,093
- Issue date Mar 19, 2024
- PELTBEAM INC.
- Mehdi Hatamian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sputtered SiP antenna
- Patent number 11,929,542
- Issue date Mar 12, 2024
- Analog Devices International Unlimited Company
- Romulo Maggay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless communication device using a radio frequency identificatio...
- Patent number 11,929,544
- Issue date Mar 12, 2024
- Murata Manufacturing Co., Ltd.
- Noboru Kato
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated fan-out package
- Patent number 11,929,333
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-bandwidth antenna in package apparatus
- Patent number 11,929,543
- Issue date Mar 12, 2024
- Huawei Technologies Co., Ltd.
- Haiwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module and communication apparatus
- Patent number 11,923,885
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Hisanori Murase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable high-bandwidth connectivity
- Patent number 11,923,598
- Issue date Mar 5, 2024
- Molex, LLC
- Gary D McCormack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module and electronic device using the same
- Patent number 11,923,601
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Namjun Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ANTENNA MODULE, ANTENNA SUPPORTING SUBSTRATE AND MANUFACTURING METH...
- Publication number 20240136728
- Publication date Apr 25, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Pao-Hung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF
- Publication number 20240128635
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Effect Protection and Electrostatic Discharge Protection fo...
- Publication number 20240120639
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hsiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240120640
- Publication date Apr 11, 2024
- Advanced Semiconductor Engineering, Inc.
- Jenchun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR...
- Publication number 20240113413
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser-Based Redistribution and Multi-Stacked Packages
- Publication number 20240113038
- Publication date Apr 4, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS
- Publication number 20240113050
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Juan Herbsommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACTLESS MULTI-DROP AND BROADCAST BIDIRECTIONAL COMMUNICATION SY...
- Publication number 20240106126
- Publication date Mar 28, 2024
- Intel Corporation
- Zhen ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compact, single near-field communication (NFC) antenna utilized for...
- Publication number 20240106122
- Publication date Mar 28, 2024
- Plume Design, Inc.
- Miroslav Samardzija
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA UNIT AND METHOD OF PRODUCING AN ANTENNA UNIT
- Publication number 20240106105
- Publication date Mar 28, 2024
- NXP B.V.
- Waqas Hassan Syed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Apparatus and Fabrication Method
- Publication number 20240097313
- Publication date Mar 21, 2024
- INFINEON TECHNOLOGIES AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLAR ANTENNA ARRAY FABRICATION
- Publication number 20240097346
- Publication date Mar 21, 2024
- NovaSolix, Inc.
- Laurence H. COOKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RFID TAG, BLOOD COLLECTION TUBE, AND ANTENNA
- Publication number 20240095486
- Publication date Mar 21, 2024
- DAIO PAPER CORPORATION
- Takuro SHIMADA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH TH...
- Publication number 20240096817
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULE
- Publication number 20240097312
- Publication date Mar 21, 2024
- LG Innotek Co., Ltd.
- Sang Ki EUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-PROFILE ANTENNA FOR BELOW-GRADE APPLICATIONS
- Publication number 20240097338
- Publication date Mar 21, 2024
- PCTEL, Inc.
- Umesh Navsariwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED FILTERS
- Publication number 20240090123
- Publication date Mar 14, 2024
- Skyworks Solutions, Inc.
- Robert Francis DARVEAUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240088070
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Yi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ANTENNA
- Publication number 20240088083
- Publication date Mar 14, 2024
- Fujitsu Limited
- Junya IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH PACKAGE VIA AND METHOD THEREFOR
- Publication number 20240088068
- Publication date Mar 14, 2024
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF MILLIMETER-WAVE ANTENNA MODULE PACKAGE STRU...
- Publication number 20240088552
- Publication date Mar 14, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ASSEMBLY FOR SEMICONDUCTOR DEVICE AND METHOD OF MAKING
- Publication number 20240079344
- Publication date Mar 7, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA ARRAY WITH REPLACEABLE ANTENNA CELL
- Publication number 20240079760
- Publication date Mar 7, 2024
- FANG-YAO KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240079759
- Publication date Mar 7, 2024
- STATS ChipPAC Pte Ltd.
- PeiEe Linda CHUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULE FOR VEHICLE AND VEHICLE INCLUDING THE SAME
- Publication number 20240072414
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Hyunggon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240072413
- Publication date Feb 29, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yu HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES AND COMMUNICATION DEVICES
- Publication number 20240072419
- Publication date Feb 29, 2024
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING ANTENNA AND HEAT DISSIPATION STRUCTURE
- Publication number 20240064889
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Seunghan Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A PARTIAL SHIELDING FOR AN ELECTRONIC ASSEMBLY
- Publication number 20240055367
- Publication date Feb 15, 2024
- JCET STATS ChipPAC Korea Limited
- EunByeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240047852
- Publication date Feb 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS

mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board structure including a closed cavity

Ex-situ manufacture of metal micro-wires and FIB placement in IC ci...

Semiconductor package having improved thermal interface between sem...

Antenna module and electronic device including the same

Antenna apparatus and method

Microelectronic device assemblies and packages including multiple d...

Antenna package and image display device including the same

Antenna device

Semiconductor device package including multiple substrates with dif...

Microelectronic device package with integrated antenna

Loading blocks for antennas in system packaging

Differential on-chip loop antenna

Antenna module and communication device carrying the same

Antenna package and image display device including the same

Antenna structure and terminal

Millimeter wave antenna tuner

Methods of forming stacked semiconductors die assemblies

High frequency and high power thin-film component

Antenna structure and terminal device

Wiring substrate, antenna module, and communication device

Antenna element module

Semiconductor package with an antenna substrate

Communication apparatus and method for adaptive cooling of antenna...

Sputtered SiP antenna

Wireless communication device using a radio frequency identificatio...

Integrated fan-out package

High-bandwidth antenna in package apparatus

High-frequency module and communication apparatus

Scalable high-bandwidth connectivity

Antenna module and electronic device using the same

Patents Applicationslast 30 patents

ANTENNA MODULE, ANTENNA SUPPORTING SUBSTRATE AND MANUFACTURING METH...

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF

Antenna Effect Protection and Electrostatic Discharge Protection fo...

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR...

Laser-Based Redistribution and Multi-Stacked Packages

SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS

CONTACTLESS MULTI-DROP AND BROADCAST BIDIRECTIONAL COMMUNICATION SY...

Compact, single near-field communication (NFC) antenna utilized for...

ANTENNA UNIT AND METHOD OF PRODUCING AN ANTENNA UNIT

Antenna Apparatus and Fabrication Method

SOLAR ANTENNA ARRAY FABRICATION

RFID TAG, BLOOD COLLECTION TUBE, AND ANTENNA

ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH TH...

ANTENNA MODULE

LOW-PROFILE ANTENNA FOR BELOW-GRADE APPLICATIONS

NESTED FILTERS

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE WITH ANTENNA

SEMICONDUCTOR DEVICE WITH THROUGH PACKAGE VIA AND METHOD THEREFOR

MANUFACTURING METHOD OF MILLIMETER-WAVE ANTENNA MODULE PACKAGE STRU...

PACKAGING ASSEMBLY FOR SEMICONDUCTOR DEVICE AND METHOD OF MAKING

ANTENNA ARRAY WITH REPLACEABLE ANTENNA CELL

INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME

ANTENNA MODULE FOR VEHICLE AND VEHICLE INCLUDING THE SAME

ELECTRONIC DEVICE

ANTENNA MODULES AND COMMUNICATION DEVICES

ELECTRONIC DEVICE INCLUDING ANTENNA AND HEAT DISSIPATION STRUCTURE

METHOD FOR FORMING A PARTIAL SHIELDING FOR AN ELECTRONIC ASSEMBLY

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...