Mounted on an edge

Industry

CPC
H05K2201/10446

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10446Mounted on an edge

Industries

Patents Grantslast 30 patents

Information Patent Grant
Board mounted active component assembly
- Patent number 12,078,847
- Issue date Sep 3, 2024
- CommScope Technologies LLC
- Joseph Christopher Coffey
- G02 - OPTICS
Information Patent Grant
Shunt resistor module
- Patent number 11,961,642
- Issue date Apr 16, 2024
- LG ENERGY SOLUTION, LTD.
- Dong-Wan Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package, electronic assembly and method for ma...
- Patent number 11,764,137
- Issue date Sep 19, 2023
- Cheng-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector
- Patent number 11,677,191
- Issue date Jun 13, 2023
- Advanced-Connectek Inc.
- Shu-Fen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board assembly for edge-coupling to an integrated c...
- Patent number 11,678,433
- Issue date Jun 13, 2023
- D-Wave Systems Inc.
- Richard D. Neufeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transporting light within circuit board profile
- Patent number 11,598,911
- Issue date Mar 7, 2023
- Arista Networks, Inc.
- Matthew Albert Moe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pin side edge mount connector and systems and methods thereof
- Patent number 11,431,117
- Issue date Aug 30, 2022
- Lockheed Martin Corporation
- Samuel Muen Shyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of forming an electronic package
- Patent number 11,399,434
- Issue date Jul 26, 2022
- Intel Corporation
- Florence Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board mounted active component assembly
- Patent number 11,226,453
- Issue date Jan 18, 2022
- CommScope Technologies LLC
- Joseph Christopher Coffey
- G02 - OPTICS
Information Patent Grant
Circuit board for HF applications including an integrated broadband...
- Patent number 11,108,128
- Issue date Aug 31, 2021
- Airbus Defence and Space GmbH
- Volker Ziegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection box
- Patent number 10,958,027
- Issue date Mar 23, 2021
- Sumitomo Wiring Systems, Ltd.
- Ryoma Hamada
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Low-cost superior performance coinless RF power amplifier
- Patent number 10,912,185
- Issue date Feb 2, 2021
- Telefonaktiebolaget LM Ericsson (publ)
- Reginald Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package, electronic assembly and method for ma...
- Patent number 10,886,208
- Issue date Jan 5, 2021
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and optical module having such circuit board
- Patent number 10,880,987
- Issue date Dec 29, 2020
- InnoLight Technology (Suzhou) LTD.
- Xigui Fang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting a power amplifier (AP) assembly
- Patent number 10,842,028
- Issue date Nov 17, 2020
- Telefonaktiebolaget LM Ericsson (publ)
- Ronald Nehring
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure of a fob key for increasing the operating force of a button
- Patent number 10,796,864
- Issue date Oct 6, 2020
- Continental Automotive GmbH
- JaeHo Mun
- B60 - VEHICLES IN GENERAL
Information Patent Grant
High speed bypass cable assembly
- Patent number RE48230
- Issue date Sep 29, 2020
- Molex, LLC
- Brian Keith Lloyd
Information Patent Grant
Mainboard for POS terminal
- Patent number 10,765,004
- Issue date Sep 1, 2020
- POSBANK CO., LTD.
- Dong Uk Eun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical subassembly and optical module
- Patent number 10,761,278
- Issue date Sep 1, 2020
- Hisense Broadband Multimedia Technologies Co., Ltd
- Tao Jiang
- G02 - OPTICS
Information Patent Grant
Semiconductor package module
- Patent number 10,638,614
- Issue date Apr 28, 2020
- Samsung Electronics Co., Ltd.
- Hyuk-jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting structure for circuit board and output terminal of power...
- Patent number 10,617,022
- Issue date Apr 7, 2020
- Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 10,613,270
- Issue date Apr 7, 2020
- Samsung Electronics Co., Ltd.
- Jong Pil Jeon
- G02 - OPTICS
Information Patent Grant
Image pickup unit, wiring board with cable, and manufacturing metho...
- Patent number 10,582,839
- Issue date Mar 10, 2020
- Olympus Corporation
- Takatoshi Igarashi
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Arrangement and method for connecting an electrical component to a...
- Patent number 10,539,585
- Issue date Jan 21, 2020
- Continental Automotive Systems, Inc.
- Gaetan Vich
- G01 - MEASURING TESTING
Information Patent Grant
Substrate connection structure
- Patent number 10,498,060
- Issue date Dec 3, 2019
- J.S.T. Mfg. Co., Ltd.
- Ryo Naemura
- F21 - LIGHTING
Information Patent Grant
Connector and circuit board assembly
- Patent number 10,483,668
- Issue date Nov 19, 2019
- Japan Aviation Electronics Industry, Limited
- Osamu Hashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass waveguide assemblies for OE-PCBs and methods of forming OE-PCBs
- Patent number 10,459,160
- Issue date Oct 29, 2019
- Corning Optical Communications LLC
- Lars Martin Otfried Brusberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image pickup apparatus
- Patent number 10,440,243
- Issue date Oct 8, 2019
- Olympus Corporation
- Noriyuki Fujimori
- G02 - OPTICS
Information Patent Grant
Circuit assembly having vibration-proof fixing structure for circui...
- Patent number 10,406,890
- Issue date Sep 10, 2019
- MITSUBISHI HEAVY INDUSTRIES THERMAL SYSTEMS, LTD.
- Shunsuke Yakushiji
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Carrier and electric switch having said carrier
- Patent number 10,332,696
- Issue date Jun 25, 2019
- Marquardt GmbH
- Frank Rottler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE, ELECTRONIC ASSEMBLY AND METHOD FOR MA...
- Publication number 20240088001
- Publication date Mar 14, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY MODULE CONNECTION INTERFACE FOR POWER DELIVERY
- Publication number 20240008181
- Publication date Jan 4, 2024
- Dell Products L.P.
- Isaac Q. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD EDGE ELECTRICAL CONTACT STRUCTURES
- Publication number 20230232533
- Publication date Jul 20, 2023
- Nokia Solutions and Networks Oy
- David NORTH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE...
- Publication number 20230141357
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Gidae KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPORTING LIGHT WITHIN CIRCUIT BOARD PROFILE
- Publication number 20230066177
- Publication date Mar 2, 2023
- Arista Networks, Inc.
- Matthew Albert Moe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD MOUNTED ACTIVE COMPONENT ASSEMBLY
- Publication number 20220350085
- Publication date Nov 3, 2022
- CommScope Technologies LLC
- Joseph Christopher Coffey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Shunt Resistor Module
- Publication number 20220102032
- Publication date Mar 31, 2022
- LG ENERGY SOLUTION, LTD.
- Dong-Wan KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN SIDE EDGE MOUNT CONNECTOR AND SYSTEMS AND METHODS THEREOF
- Publication number 20210151913
- Publication date May 20, 2021
- Lockheed Martin Corporation
- Samuel Muen SHYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE, ELECTRONIC ASSEMBLY AND METHOD FOR MA...
- Publication number 20210125909
- Publication date Apr 29, 2021
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN SIDE EDGE MOUNT CONNECTOR AND SYSTEMS AND METHODS THEREOF
- Publication number 20210066827
- Publication date Mar 4, 2021
- Lockheed Martin Corporation
- Samuel Muen SHYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE, ELECTRONIC ASSEMBLY AND METHOD FOR MA...
- Publication number 20200118912
- Publication date Apr 16, 2020
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin HO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR END ASSEMBLIES
- Publication number 20200120800
- Publication date Apr 16, 2020
- Intel Corporation
- Florence PON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND OPTICAL MODULE HAVING SUCH CIRCUIT BOARD
- Publication number 20200045806
- Publication date Feb 6, 2020
- InnoLight Technology (Suzhou) Ltd.
- Xigui FANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE OF A FOB KEY FOR INCREASING THE OPERATING FORCE OF A BUTT...
- Publication number 20200013568
- Publication date Jan 9, 2020
- CONTINENTAL AUTOMOTIVE GMBH
- JaeHo Mun
- B60 - VEHICLES IN GENERAL
Information Patent Application
Mainboard for POS Terminal
- Publication number 20190380205
- Publication date Dec 12, 2019
- Dong Uk EUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARDS WITH PLIABLE REGIONS
- Publication number 20190313527
- Publication date Oct 10, 2019
- Hewlett-Packard Development Company, L.P.
- Roger A. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL SUBASSEMBLY AND OPTICAL MODULE
- Publication number 20190285816
- Publication date Sep 19, 2019
- HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD
- Tao JIANG
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE MODULE
- Publication number 20190246505
- Publication date Aug 8, 2019
- Samsung Electronics Co., Ltd.
- Hyuk-jin LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SLIDE AND MOUNT MANUFACTURING FOR COINLESS RF POWER AMPLIFIER
- Publication number 20180310416
- Publication date Oct 25, 2018
- Telefonaktiebolaget LM Ericsson (publ)
- Ronald NEHRING
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH WIRE CONDUCTIVE PADS AND METHOD FOR FIXING THE W...
- Publication number 20180076550
- Publication date Mar 15, 2018
- KAO-KUNG CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR UNIT, METHOD OF MANUFACTURING THE SAME, ELECTRONIC APPARATUS...
- Publication number 20140347823
- Publication date Nov 27, 2014
- SEIKO EPSON CORPORATION
- Yusuke KINOSHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20140290981
- Publication date Oct 2, 2014
- HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
- YU-HSU LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AUDIO AND VIDEO REPRODUCTION APPARATUS HAVING MAIN BOARD ON WHICH S...
- Publication number 20140233198
- Publication date Aug 21, 2014
- Samsung Electronics Co., Ltd.
- Sung-soo KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD
- Publication number 20140160683
- Publication date Jun 12, 2014
- CHRIS R. SNIDER
- B60 - VEHICLES IN GENERAL
Information Patent Application
LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD
- Publication number 20140146482
- Publication date May 29, 2014
- Delphi Technologies, Inc.
- CHRIS R. SNIDER
- B60 - VEHICLES IN GENERAL
Information Patent Application
HETEROGENEOUS ENCAPSULATION
- Publication number 20140098505
- Publication date Apr 10, 2014
- Apple Inc.
- John J. Baker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULE WITH AN ELECTRONIC CONNECTOR ALIGNED WITH A SUBSTRAT...
- Publication number 20140092565
- Publication date Apr 3, 2014
- Sumitomo Electric Industries, Ltd.
- Tateki NAKASHIMA
- G02 - OPTICS
Information Patent Application
LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD
- Publication number 20140049101
- Publication date Feb 20, 2014
- Chris R. Snider
- B60 - VEHICLES IN GENERAL
Information Patent Application
High Speed Bypass Cable Assembly
- Publication number 20140041937
- Publication date Feb 13, 2014
- Brian Keith Lloyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD
- Publication number 20140036460
- Publication date Feb 6, 2014
- CHRIS R. SNIDER
- B60 - VEHICLES IN GENERAL

Mounted on an edge

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Board mounted active component assembly

Shunt resistor module

Semiconductor device package, electronic assembly and method for ma...

Electrical connector

Printed circuit board assembly for edge-coupling to an integrated c...

Transporting light within circuit board profile

Pin side edge mount connector and systems and methods thereof

Electronic package and method of forming an electronic package

Board mounted active component assembly

Circuit board for HF applications including an integrated broadband...

Electrical connection box

Low-cost superior performance coinless RF power amplifier

Semiconductor device package, electronic assembly and method for ma...

Circuit board and optical module having such circuit board

Method for mounting a power amplifier (AP) assembly

Structure of a fob key for increasing the operating force of a button

High speed bypass cable assembly

Mainboard for POS terminal

Optical subassembly and optical module

Semiconductor package module

Connecting structure for circuit board and output terminal of power...

Display apparatus

Image pickup unit, wiring board with cable, and manufacturing metho...

Arrangement and method for connecting an electrical component to a...

Substrate connection structure

Connector and circuit board assembly

Glass waveguide assemblies for OE-PCBs and methods of forming OE-PCBs

Image pickup apparatus

Circuit assembly having vibration-proof fixing structure for circui...

Carrier and electric switch having said carrier

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE, ELECTRONIC ASSEMBLY AND METHOD FOR MA...

MEMORY MODULE CONNECTION INTERFACE FOR POWER DELIVERY

BOARD EDGE ELECTRICAL CONTACT STRUCTURES

ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE...

TRANSPORTING LIGHT WITHIN CIRCUIT BOARD PROFILE

BOARD MOUNTED ACTIVE COMPONENT ASSEMBLY

Shunt Resistor Module

PIN SIDE EDGE MOUNT CONNECTOR AND SYSTEMS AND METHODS THEREOF

SEMICONDUCTOR DEVICE PACKAGE, ELECTRONIC ASSEMBLY AND METHOD FOR MA...

PIN SIDE EDGE MOUNT CONNECTOR AND SYSTEMS AND METHODS THEREOF

SEMICONDUCTOR DEVICE PACKAGE, ELECTRONIC ASSEMBLY AND METHOD FOR MA...

CONNECTOR END ASSEMBLIES

CIRCUIT BOARD AND OPTICAL MODULE HAVING SUCH CIRCUIT BOARD

STRUCTURE OF A FOB KEY FOR INCREASING THE OPERATING FORCE OF A BUTT...

Mainboard for POS Terminal

BOARDS WITH PLIABLE REGIONS

OPTICAL SUBASSEMBLY AND OPTICAL MODULE

SEMICONDUCTOR PACKAGE MODULE

SLIDE AND MOUNT MANUFACTURING FOR COINLESS RF POWER AMPLIFIER

CIRCUIT BOARD WITH WIRE CONDUCTIVE PADS AND METHOD FOR FIXING THE W...

SENSOR UNIT, METHOD OF MANUFACTURING THE SAME, ELECTRONIC APPARATUS...

PRINTED CIRCUIT BOARD

AUDIO AND VIDEO REPRODUCTION APPARATUS HAVING MAIN BOARD ON WHICH S...

LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD

LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD

HETEROGENEOUS ENCAPSULATION

OPTICAL MODULE WITH AN ELECTRONIC CONNECTOR ALIGNED WITH A SUBSTRAT...

LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD

High Speed Bypass Cable Assembly

LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD