Mounting of the opto-electronic elements

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GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

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G02B6/4245Mounting of the opto-electronic elements

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Patents Grantslast 30 patents

Information Patent Grant
Photonics optoelectrical system
- Patent number 12,366,705
- Issue date Jul 22, 2025
- THE RESEARCH FOUNDATION FOR THE STATE UNIVERISTY OF NEWYORK
- William Charles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device, method and system for optical communication with a photonic...
- Patent number 12,298,572
- Issue date May 13, 2025
- Intel Corporation
- Changhua Liu
- G02 - OPTICS
Information Patent Grant
Optical module
- Patent number 12,276,849
- Issue date Apr 15, 2025
- Dongguan Luxshare Technologies Co., Ltd.
- QianBing Yan
- G02 - OPTICS
Information Patent Grant
Fiber shuffle embedded optical connector
- Patent number 12,253,724
- Issue date Mar 18, 2025
- Intel Corporation
- Asako Toda
- G02 - OPTICS
Information Patent Grant
Semiconductor device
- Patent number 12,248,188
- Issue date Mar 11, 2025
- Kabushiki Kaisha Toshiba
- Kazuya Ohira
- G02 - OPTICS
Information Patent Grant
Biased connector system
- Patent number 12,248,190
- Issue date Mar 11, 2025
- Molex, LLC
- Gianni Ryan Bardella
- G02 - OPTICS
Information Patent Grant
Multicomponent photonically intra-die bridged assembly
- Patent number 12,242,122
- Issue date Mar 4, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Manufacturing method and application of optical interconnection module
- Patent number 12,235,498
- Issue date Feb 25, 2025
- Electronics and Telecommunications Research Institute
- Sae-Kyoung Kang
- G02 - OPTICS
Information Patent Grant
Optical bridging element for separately stacked electrical ICs
- Patent number 12,216,318
- Issue date Feb 4, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Assembly alignment structure for optical component
- Patent number 12,197,022
- Issue date Jan 14, 2025
- FOCI Fiber Optic Communications, Inc.
- Ting-Ta Hu
- G02 - OPTICS
Information Patent Grant
Stacked-dies optically bridged multicomponent package
- Patent number 12,164,161
- Issue date Dec 10, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Multicomponent photonically bridged assembly
- Patent number 12,164,162
- Issue date Dec 10, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Stacked-dies optically bridged multicomponent package
- Patent number 12,130,485
- Issue date Oct 29, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Optical multi-die interconnect bridge with optical interface
- Patent number 12,124,095
- Issue date Oct 22, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 12,050,350
- Issue date Jul 30, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang-Feng You
- G02 - OPTICS
Information Patent Grant
Wavelength checker
- Patent number 12,038,601
- Issue date Jul 16, 2024
- Nippon Telegraph and Telephone Corporation
- Takuya Tanaka
- G02 - OPTICS
Information Patent Grant
Package structure having photonic integrated circuit
- Patent number 11,988,867
- Issue date May 21, 2024
- Molex, LLC
- Chih-Wei Peng
- G02 - OPTICS
Information Patent Grant
Optical micro-electromechanical system with flip chip packaging
- Patent number 11,982,850
- Issue date May 14, 2024
- ANYON TECHNOLOGIES PTE. LTD.
- Hongbo Zhang
- G02 - OPTICS
Information Patent Grant
Optical subassembly for non-reciprocal coupling of light and assemb...
- Patent number 11,966,081
- Issue date Apr 23, 2024
- CLOUD LIGHT TECHNOLOGY LIMITED
- Wing Keung Mark Mak
- G02 - OPTICS
Information Patent Grant
FAUs including passive alignment adhesive profiles and related methods
- Patent number 11,934,025
- Issue date Mar 19, 2024
- Corning Research & Development Corporation
- Alexander Lee Cuno
- G02 - OPTICS
Information Patent Grant
Optoelectronic ball grid array package with fiber
- Patent number 11,892,690
- Issue date Feb 6, 2024
- Acacia Communications, Inc.
- Christopher Doerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device
- Patent number 11,867,956
- Issue date Jan 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei Lin
- G02 - OPTICS
Information Patent Grant
Thermosonic bonding for securing photonic components
- Patent number 11,860,427
- Issue date Jan 2, 2024
- Rockley Photonics Limited
- Albert Benzoni
- G02 - OPTICS
Information Patent Grant
Optical multi-die interconnect bridge (OMIB)
- Patent number 11,835,777
- Issue date Dec 5, 2023
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
High-density FAUs and optical interconnection devices and related m...
- Patent number 11,828,998
- Issue date Nov 28, 2023
- Corning Research & Development Corporation
- James Scott Sutherland
- G02 - OPTICS
Information Patent Grant
Connector having optical fiber connection mechanism and connector a...
- Patent number 11,774,690
- Issue date Oct 3, 2023
- Delta Electronics, Inc.
- Sheng-Hua Li
- G02 - OPTICS
Information Patent Grant
Photonics fabrication process performance improvement
- Patent number 11,762,146
- Issue date Sep 19, 2023
- Analog Photonics LLC
- Michael Robert Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Receiver optical assembly and assembly method thereof
- Patent number 11,762,153
- Issue date Sep 19, 2023
- InnoLight Technology (Suzhou) LTD.
- Long Chen
- G02 - OPTICS
Information Patent Grant
Spot-size converters with angled facets
- Patent number 11,719,895
- Issue date Aug 8, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Yusheng Bian
- G02 - OPTICS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 11,710,719
- Issue date Jul 25, 2023
- Sumitomo Electric Device Innovations, Inc.
- Taketo Kawano
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
Optically Bridged Multicomponent Package with Extended Temperature...
- Publication number 20250231429
- Publication date Jul 17, 2025
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G01 - MEASURING TESTING
Information Patent Application
PHOTONIC INTEGRATED CIRCUITS WITH SUBSTRATE NOISE COUPLING MITIGATION
- Publication number 20250216599
- Publication date Jul 3, 2025
- Apple Inc.
- Zhechao Wang
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICE AND OPTICAL TRANSCEIVER
- Publication number 20250189735
- Publication date Jun 12, 2025
- FURUKAWA ELECTRIC CO., LTD.
- Yuta ISHIGE
- G02 - OPTICS
Information Patent Application
BIASED CONNECTOR SYSTEM
- Publication number 20250189737
- Publication date Jun 12, 2025
- Molex, LLC
- Gianni Ryan BARDELLA
- G02 - OPTICS
Information Patent Application
OPTICAL WAVEGUIDE BOARD, OPTICAL WAVEGUIDE PACKAGE, AND LIGHT SOURC...
- Publication number 20250167188
- Publication date May 22, 2025
- KYOCERA CORPORATION
- Shougo MATSUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ASSEMBLY AND METHOD FOR MANUFACTURING SAME, LASER MODULE, OPT...
- Publication number 20250155658
- Publication date May 15, 2025
- TDK Corporation
- Takashi HONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250149503
- Publication date May 8, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BURIED HETERO STRUCTURE LASER STRUCTURES AND INTERPOSER
- Publication number 20250138260
- Publication date May 1, 2025
- POET Technologies, Inc.
- Suresh Venkatesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC CHIP
- Publication number 20250125312
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250125321
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250123449
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- G02 - OPTICS
Information Patent Application
ASSEMBLY ALIGNMENT STRUCTURE FOR OPTICAL COMPONENT
- Publication number 20250093595
- Publication date Mar 20, 2025
- FOCI FIBER OPTIC COMMUNICATIONS, INC.
- Ting-Ta Hu
- G02 - OPTICS
Information Patent Application
STRUCTURE AND METHOD FOR FASTENING OPTICAL FIBER CABLE TO SILICON P...
- Publication number 20250076596
- Publication date Mar 6, 2025
- Marvell Asia Pte Ltd.
- Pei-Keng Fu
- G02 - OPTICS
Information Patent Application
SUB-SURFACE COMPOUND MICROLENSES
- Publication number 20250060516
- Publication date Feb 20, 2025
- Intel Corporation
- Nicholas Psaila
- G02 - OPTICS
Information Patent Application
Integrated transceiver array
- Publication number 20250054930
- Publication date Feb 13, 2025
- Apple Inc.
- Shingo Mandai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING APPARATUS AND DEVICE FORMED BY MOLDING APPARATUS
- Publication number 20250052965
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Ling Hwang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Direct Silicon-to-Silicon Bonding for Fiber-First Packaging Process
- Publication number 20250044534
- Publication date Feb 6, 2025
- Ayar Labs, Inc.
- Chong Zhang
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE
- Publication number 20250035868
- Publication date Jan 30, 2025
- Sumitomo Electric Industries, Ltd.
- Taisuke NAGASAKI
- G02 - OPTICS
Information Patent Application
DETECTION OF OPTICAL MODULE MISALIGNMENT USING A LIGHT FREQUENCY RE...
- Publication number 20250012984
- Publication date Jan 9, 2025
- International Business Machines Corporation
- Kyle Indukummar Giesen
- G02 - OPTICS
Information Patent Application
SUBSTRATE ASSEMBLY
- Publication number 20250012986
- Publication date Jan 9, 2025
- FURUKAWA ELECTRIC CO., LTD.
- Yuta ISHIGE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Optical Device and Method of Manufacture
- Publication number 20240393549
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- G02 - OPTICS
Information Patent Application
METHOD FOR FABRICATING EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-D...
- Publication number 20240393552
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240385395
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Ming-Fa Chen
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE HAVING PHOTONIC INTEGRATED CIRCUIT
- Publication number 20240319438
- Publication date Sep 26, 2024
- Molex, LLC
- Chih-Chung Hsu
- G02 - OPTICS
Information Patent Application
PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE
- Publication number 20240319455
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240280764
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Fu Tsai
- G02 - OPTICS
Information Patent Application
400G SILICON PHOTONIC INTEGRATED OPTICAL MODULE WITH EMBEDDED THERM...
- Publication number 20240280771
- Publication date Aug 22, 2024
- SHUNYUN TECHNOLOGY (ZHONGSHAN) Limited
- Jie Huang
- G02 - OPTICS
Information Patent Application
400G SILICON PHOTONIC INTEGRATED OPTICAL MODULE WITH PHOTOELECTRIC...
- Publication number 20240280768
- Publication date Aug 22, 2024
- SHUNYUN TECHNOLOGY (ZHONGSHAN) Limited
- Jie Huang
- G02 - OPTICS
Information Patent Application
MULTICOMPONENT PHOTONICALLY INTRA-DIE BRIDGED ASSEMBLY
- Publication number 20240272393
- Publication date Aug 15, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
MULTICOMPONENT PHOTONICALLY BRIDGED ASSEMBLY
- Publication number 20240272392
- Publication date Aug 15, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS

Mounting of the opto-electronic elements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Photonics optoelectrical system

Device, method and system for optical communication with a photonic...

Optical module

Fiber shuffle embedded optical connector

Semiconductor device

Biased connector system

Multicomponent photonically intra-die bridged assembly

Manufacturing method and application of optical interconnection module

Optical bridging element for separately stacked electrical ICs

Assembly alignment structure for optical component

Stacked-dies optically bridged multicomponent package

Multicomponent photonically bridged assembly

Stacked-dies optically bridged multicomponent package

Optical multi-die interconnect bridge with optical interface

Semiconductor package structure and method of manufacturing the same

Wavelength checker

Package structure having photonic integrated circuit

Optical micro-electromechanical system with flip chip packaging

Optical subassembly for non-reciprocal coupling of light and assemb...

FAUs including passive alignment adhesive profiles and related methods

Optoelectronic ball grid array package with fiber

Optoelectronic device

Thermosonic bonding for securing photonic components

Optical multi-die interconnect bridge (OMIB)

High-density FAUs and optical interconnection devices and related m...

Connector having optical fiber connection mechanism and connector a...

Photonics fabrication process performance improvement

Receiver optical assembly and assembly method thereof

Spot-size converters with angled facets

Method for manufacturing electronic device

Patents Applicationslast 30 patents

Optically Bridged Multicomponent Package with Extended Temperature...

PHOTONIC INTEGRATED CIRCUITS WITH SUBSTRATE NOISE COUPLING MITIGATION

OPTICAL DEVICE AND OPTICAL TRANSCEIVER

BIASED CONNECTOR SYSTEM

OPTICAL WAVEGUIDE BOARD, OPTICAL WAVEGUIDE PACKAGE, AND LIGHT SOURC...

LASER ASSEMBLY AND METHOD FOR MANUFACTURING SAME, LASER MODULE, OPT...

PACKAGE STRUCTURE

SELF-ALIGNED BURIED HETERO STRUCTURE LASER STRUCTURES AND INTERPOSER

SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC CHIP

SEMICONDUCTOR PACKAGE

PHOTONIC SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

ASSEMBLY ALIGNMENT STRUCTURE FOR OPTICAL COMPONENT

STRUCTURE AND METHOD FOR FASTENING OPTICAL FIBER CABLE TO SILICON P...

SUB-SURFACE COMPOUND MICROLENSES

Integrated transceiver array

MOLDING APPARATUS AND DEVICE FORMED BY MOLDING APPARATUS

Direct Silicon-to-Silicon Bonding for Fiber-First Packaging Process

OPTICAL MODULE

DETECTION OF OPTICAL MODULE MISALIGNMENT USING A LIGHT FREQUENCY RE...

SUBSTRATE ASSEMBLY

Optical Device and Method of Manufacture

METHOD FOR FABRICATING EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-D...

OPTICAL DEVICE AND METHOD OF MANUFACTURE

PACKAGE STRUCTURE HAVING PHOTONIC INTEGRATED CIRCUIT

PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

400G SILICON PHOTONIC INTEGRATED OPTICAL MODULE WITH EMBEDDED THERM...

400G SILICON PHOTONIC INTEGRATED OPTICAL MODULE WITH PHOTOELECTRIC...

MULTICOMPONENT PHOTONICALLY INTRA-DIE BRIDGED ASSEMBLY

MULTICOMPONENT PHOTONICALLY BRIDGED ASSEMBLY