Mounting semiconductor bodies in containers

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CPC
H01L21/52

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/52Mounting semiconductor bodies in containers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package and manufacturing method of the same
- Patent number 12,322,668
- Issue date Jun 3, 2025
- Nippon Telegraph and Telephone Corporation
- Hiromasa Tanobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure including low- and high-density conductive structures
- Patent number 12,315,820
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system and related methods
- Patent number 12,308,297
- Issue date May 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power module package structures
- Patent number 12,293,955
- Issue date May 6, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing singulated encapsulated components
- Patent number 12,283,491
- Issue date Apr 22, 2025
- EV Group E. Thallner GmbH
- Gerald Mittendorfer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,283,566
- Issue date Apr 22, 2025
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with annular package lid structure
- Patent number 12,278,150
- Issue date Apr 15, 2025
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe spacer for double-sided power module
- Patent number 12,278,158
- Issue date Apr 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tzu-Hsuan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided coolable semiconductor package
- Patent number 12,266,586
- Issue date Apr 1, 2025
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly including liquid alloy thermal interface material...
- Patent number 12,255,119
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,255,127
- Issue date Mar 18, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidekazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising interconnect structures
- Patent number 12,249,518
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waferscale physiological characteristic sensor package with integra...
- Patent number 12,232,842
- Issue date Feb 25, 2025
- Medtronic MiniMed, Inc.
- Daniel Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with bridge chiplets
- Patent number 12,238,872
- Issue date Feb 25, 2025
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing device and method of manufacturing substrate p...
- Patent number 12,211,706
- Issue date Jan 28, 2025
- Tokyo Electron Limited
- Manabu Nakagawasai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method of semiconductor package using jig
- Patent number 12,211,818
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,191,224
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bonding material, bonding member including the conductiv...
- Patent number 12,157,170
- Issue date Dec 3, 2024
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device, power conversion apparatus, and manufacturing...
- Patent number 12,142,540
- Issue date Nov 12, 2024
- Mitsubishi Electric Corporation
- Masayuki Mafune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switch circuit, mixer, and electronic device
- Patent number 12,113,481
- Issue date Oct 8, 2024
- Huawei Technologies Co., Ltd.
- Yongli Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,107,024
- Issue date Oct 1, 2024
- Mitsubishi Electric Corporation
- Takayuki Onaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having heat dissipation structure of curved pr...
- Patent number 12,094,836
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Analog sense points for measuring circuit die
- Patent number 12,094,789
- Issue date Sep 17, 2024
- Micron Technology, Inc.
- Christopher F. Kinney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrations and methods of making thereof
- Patent number 12,068,231
- Issue date Aug 20, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with redistribution structure having multiple chips
- Patent number 12,046,548
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for semiconductor device and preparation method t...
- Patent number 12,040,241
- Issue date Jul 16, 2024
- Xidian University
- Chen Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit packages to minimize stress on a semiconductor die
- Patent number 12,027,472
- Issue date Jul 2, 2024
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for making the same
- Patent number 12,027,433
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with clip having through hole accommodating component-relat...
- Patent number 12,027,436
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250183126
- Publication date Jun 5, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Hidekazu NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Comprising Interconnect Structures
- Publication number 20250183056
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PRODUCING HIGH POWER MODULE PACKAGE STRUCTURES
- Publication number 20250174515
- Publication date May 29, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEM FOR ADDITIVE MANUFACTURED SEMICONDUCTOR PACKAGIN...
- Publication number 20250174570
- Publication date May 29, 2025
- Advanced Printed Electronic Solutions LLC
- Richard Neill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE COOLING MECHANISM AND SUBSTRATE...
- Publication number 20250174511
- Publication date May 29, 2025
- NEC Corporation
- Junichi Chiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblage module 3D
- Publication number 20250167057
- Publication date May 22, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Manon PORLAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING INTEGRATED LID STRUCTURE AND METHOD THE...
- Publication number 20250157862
- Publication date May 15, 2025
- NXP B.V.
- Yu Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH RAISED LID ATTACH AREA
- Publication number 20250157864
- Publication date May 15, 2025
- ADVANCED MICRO DEVICES, INC.
- Chia-Chun MIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS
- Publication number 20250149495
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Corner Reinforcement Structure for Package Interconnect
- Publication number 20250105115
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PLURALITY OF FIN...
- Publication number 20250096062
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Ping-Yin Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC MICROELECTRONIC MODULE USING A SHEATH
- Publication number 20250087540
- Publication date Mar 13, 2025
- Peter C. Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250087550
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA ACCURACY MEASUREMENT
- Publication number 20250079242
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hsuen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SPREADER
- Publication number 20250069978
- Publication date Feb 27, 2025
- SK Hynix NAND Product Solutions Corp. (dba Solidigm)
- Hardeep Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20250069962
- Publication date Feb 27, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Mun Gil Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TOOL WITH MOVABLE COMPONENT FOR IMPROVED DIE PROTRUSION...
- Publication number 20250054786
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Yuan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-INTERCONNECT
- Publication number 20250015031
- Publication date Jan 9, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-Attach Fillet Height Reduction
- Publication number 20240421044
- Publication date Dec 19, 2024
- Wolfspeed, Inc.
- Daniel Ginn Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240387446
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL...
- Publication number 20240379496
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240379474
- Publication date Nov 14, 2024
- NXP USA, Inc.
- Ankur Shailesh Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371794
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20240371657
- Publication date Nov 7, 2024
- TORAY ENGINEERING CO., LTD.
- Shimpei AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE
- Publication number 20240355722
- Publication date Oct 24, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE HAVING MULTIPLE CHIPS
- Publication number 20240347439
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE PACKAGE
- Publication number 20240332274
- Publication date Oct 3, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yueh TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
- Publication number 20240321700
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Daeyeun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE AND METHOD OF FORMING SAME
- Publication number 20240312897
- Publication date Sep 19, 2024
- ACT IDENTITY TECHNOLOGY LIMITED
- Gang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240312851
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Mounting semiconductor bodies in containers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package and manufacturing method of the same

Wiring structure including low- and high-density conductive structures

Semiconductor package system and related methods

High power module package structures

Method for producing singulated encapsulated components

Semiconductor device and method for manufacturing the same

Semiconductor package with annular package lid structure

Leadframe spacer for double-sided power module

Double-sided coolable semiconductor package

Package assembly including liquid alloy thermal interface material...

Semiconductor device and method for manufacturing the same

Secure semiconductor integration and method for making thereof

Semiconductor device comprising interconnect structures

Waferscale physiological characteristic sensor package with integra...

Circuit board with bridge chiplets

Substrate processing device and method of manufacturing substrate p...

Manufacturing method of semiconductor package using jig

Semiconductor package and manufacturing method thereof

Conductive bonding material, bonding member including the conductiv...

Semiconductor device, power conversion apparatus, and manufacturing...

Switch circuit, mixer, and electronic device

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device having heat dissipation structure of curved pr...

Analog sense points for measuring circuit die

3D integrations and methods of making thereof

Chip package with redistribution structure having multiple chips

Package structure for semiconductor device and preparation method t...

Integrated circuit packages to minimize stress on a semiconductor die

Semiconductor package and method for making the same

Package with clip having through hole accommodating component-relat...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Device Comprising Interconnect Structures

METHODS OF PRODUCING HIGH POWER MODULE PACKAGE STRUCTURES

METHODS AND SYSTEM FOR ADDITIVE MANUFACTURED SEMICONDUCTOR PACKAGIN...

METHOD FOR MANUFACTURING SUBSTRATE COOLING MECHANISM AND SUBSTRATE...

Assemblage module 3D

SEMICONDUCTOR DEVICE HAVING INTEGRATED LID STRUCTURE AND METHOD THE...

INTEGRATED CIRCUIT DEVICE WITH RAISED LID ATTACH AREA

SEMICONDUCTOR PACKAGE AND METHODS

Corner Reinforcement Structure for Package Interconnect

PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PLURALITY OF FIN...

HERMETIC MICROELECTRONIC MODULE USING A SHEATH

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

VIA ACCURACY MEASUREMENT

THERMAL SPREADER

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

DIE BONDING TOOL WITH MOVABLE COMPONENT FOR IMPROVED DIE PROTRUSION...

3D-INTERCONNECT

Die-Attach Fillet Height Reduction

JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE

PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL...

A PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MOUNTING DEVICE AND MOUNTING METHOD

APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE

CHIP PACKAGE HAVING MULTIPLE CHIPS

OPTICAL DEVICE PACKAGE

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD

CHIP MODULE AND METHOD OF FORMING SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME