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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/52
Mounting semiconductor bodies in containers
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Patents Grants
last 30 patents
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Patent Grant
Method for forming package structure with cavity substrate
Patent number
11,967,579
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with lid structure
Patent number
11,929,293
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Tsung-Shu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D-interconnect
Patent number
11,929,337
Issue date
Mar 12, 2024
Invensas LLC
Chok J. Chia
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with multiple interposers on a single substrate
Patent number
11,923,347
Issue date
Mar 5, 2024
Amazon Technologies, Inc.
Bassam Abdel-Dayem
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer chips and enclosures for quantum circuits
Patent number
11,908,756
Issue date
Feb 20, 2024
International Business Machines Corporation
David Abraham
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with plurality of leads and sealing resin
Patent number
11,908,777
Issue date
Feb 20, 2024
Rohm Co., Ltd.
Mamoru Yamagami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor module and power conversion apparatus
Patent number
11,908,822
Issue date
Feb 20, 2024
Mitsubishi Electric Corporation
Jun Fujita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for collectively bending microelectronic components using s...
Patent number
11,908,832
Issue date
Feb 20, 2024
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Alexis Rochas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
Patent number
11,908,755
Issue date
Feb 20, 2024
Amkor Technology Singapore Holding Pte Ltd.
Sang Jae Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor device assembly
Patent number
11,908,784
Issue date
Feb 20, 2024
NXP USA, INC.
Akhilesh Kumar Singh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,901,263
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chung-Jung Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package with stress reduction design and metho...
Patent number
11,894,320
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shu-Shen Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ceramic semiconductor package seal rings
Patent number
11,881,460
Issue date
Jan 23, 2024
Texas Instruments Incorporated
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High dielectric constant carrier based packaging with enhanced WG m...
Patent number
11,862,584
Issue date
Jan 2, 2024
NXP USA, INC.
Jinbang Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging substrate, packaging structure, electronic device, and ma...
Patent number
11,854,953
Issue date
Dec 26, 2023
Huawei Technologies Co., Ltd.
Zan Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing assembly structure by using frame structur...
Patent number
11,848,280
Issue date
Dec 19, 2023
ADVANCED SEMlCONDUCTOR ENGINEERING, INC.
Wen Hung Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for manufacturing a strained semiconductor device and corre...
Patent number
11,837,558
Issue date
Dec 5, 2023
STMicroelectronics S.r.l.
Santo Alessandro Smerzi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe spacer for double-sided power module
Patent number
11,830,784
Issue date
Nov 28, 2023
Semiconductor Components Industries, LLC
Tzu-Hsuan Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package having stress isolation and method the...
Patent number
11,823,968
Issue date
Nov 21, 2023
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal bonding sheet and thermal bonding sheet with dicing tape
Patent number
11,817,415
Issue date
Nov 14, 2023
Nitto Denko Corporation
Satoshi Honda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser bonding apparatus for three-dimensional molded sculptures
Patent number
11,813,688
Issue date
Nov 14, 2023
LASERSSEL CO., LTD.
Jae Joon Choi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods of manufacturing a semiconductor package
Patent number
11,817,325
Issue date
Nov 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High power module package structures
Patent number
11,810,775
Issue date
Nov 7, 2023
Semiconductor Components Industries, LLC
Yusheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor package using jig
Patent number
11,804,468
Issue date
Oct 31, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with plurality of leads and sealing resin
Patent number
11,804,422
Issue date
Oct 31, 2023
Rohm Co., Ltd.
Mamoru Yamagami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sheet for heat bonding, and sheet for heat bonding having dicing tape
Patent number
11,786,966
Issue date
Oct 17, 2023
Nitto Denko Corporation
Satoshi Honda
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Hermetic semiconductor packages
Patent number
11,784,102
Issue date
Oct 10, 2023
UTAC HEADQUARTERS PTE. LTD.
Eakkasit Dumsong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermosetting resin composition, semiconductor device, and electric...
Patent number
11,784,153
Issue date
Oct 10, 2023
Kyocera Corporation
Masakazu Fujiwara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices comprising a lid structure and methods of man...
Patent number
11,784,101
Issue date
Oct 10, 2023
Amkor Technology Singapore Holding Pte Ltd.
Shaun Bowers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Production of optoelectronic components
Patent number
11,784,062
Issue date
Oct 10, 2023
OSRAM OLED GmbH
Thomas Schwarz
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
Publication number
20240136202
Publication date
Apr 25, 2024
TONG HSING ELECTRONIC INDUSTRIES, LTD.
LI-CHUN HUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240136251
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Jung Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDIS...
Publication number
20240113075
Publication date
Apr 4, 2024
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240112983
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Li WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADFRAME SPACER FOR DOUBLE-SIDED POWER MODULE
Publication number
20240096734
Publication date
Mar 21, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Tzu-Hsuan CHENG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240096719
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuan-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240087970
Publication date
Mar 14, 2024
KIOXIA Corporation
Takeori MAEDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
Publication number
20240071847
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yi-Huan Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH POWER MODULE PACKAGE STRUCTURES
Publication number
20240071860
Publication date
Feb 29, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Yusheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES WITH FLEXIBLE SPACER
Publication number
20240047285
Publication date
Feb 8, 2024
Micron Technology, Inc.
Faxing Che
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN
Publication number
20240038635
Publication date
Feb 1, 2024
Rohm Co., Ltd.
Mamoru YAMAGAMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES
Publication number
20240033840
Publication date
Feb 1, 2024
LASERSSEL CO., LTD.
Jae Joon CHOI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240038606
Publication date
Feb 1, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Shaun Bowers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240038617
Publication date
Feb 1, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Heat dissipation optimization method of silicon-based SU-8 thin fil...
Publication number
20230420327
Publication date
Dec 28, 2023
SHANGHAI JIAOTONG UNIVERSITY
Linsheng Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRICA...
Publication number
20230411335
Publication date
Dec 21, 2023
Kyocera Corporation
Masakazu FUJIWARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...
Publication number
20230411175
Publication date
Dec 21, 2023
NEXPERIA B.V.
Wai Wai Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM IN A PACKAGE (SIP) WITH AIR CAVITY AND EPOXY SEAL
Publication number
20230402333
Publication date
Dec 14, 2023
Qorvo US, Inc.
MD Hasnine
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE WITH HEATSINK AND MANUFACTURING METHOD THEREFOR
Publication number
20230402355
Publication date
Dec 14, 2023
NEXPERIA B.V.
Wei Leong Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
Publication number
20230395463
Publication date
Dec 7, 2023
Micron Technology, Inc.
Sameer S. Vadhavkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FILM ADHESIVE AND METHOD FOR MAKING SAME; DICING/DIE BONDING INTEGR...
Publication number
20230395420
Publication date
Dec 7, 2023
Yuya AKIYAMA
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE A...
Publication number
20230386945
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company Limited
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE STRUCTURE AND WIRING STRUCTURE INCLUDING THE SAME
Publication number
20230387034
Publication date
Nov 30, 2023
Advanced Semiconductor Engineering, Inc.
Wen Hung HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING LID WITH INTEGRATED HEAT PIPE FOR T...
Publication number
20230386960
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company Limited
Yu-Sheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG
Publication number
20230369283
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20230343744
Publication date
Oct 26, 2023
Rohm Co., Ltd.
Akihiro Kimura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230335506
Publication date
Oct 19, 2023
Unimicron Technology Corp.
Chin-Sheng Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR APPARATUS
Publication number
20230335448
Publication date
Oct 19, 2023
Fuji Electric Co., Ltd.
Tadahiko SATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND PACKAGE METHOD
Publication number
20230298954
Publication date
Sep 21, 2023
Huawei Technologies Co., Ltd
Yanhai LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
Publication number
20230274951
Publication date
Aug 31, 2023
SHINKAWA LTD.
Yuichiro NOGUCHI
H01 - BASIC ELECTRIC ELEMENTS