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H01L23/12

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/12Mountings

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Reinforcing resin composition, electronic component, method for man...
- Patent number 12,275,839
- Issue date Apr 15, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shigeru Yamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,266,638
- Issue date Apr 1, 2025
- Samsung Electronics Co., Ltd.
- Sangcheon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit test structure and method of using
- Patent number 12,253,558
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for an integrated circuit and manufacturing method
- Patent number 12,249,549
- Issue date Mar 11, 2025
- STMicroelectronics (Grenoble 2) SAS
- Jerome Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package stress balance structures and related methods
- Patent number 12,230,502
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate, electronic unit, method for manufactur...
- Patent number 12,218,068
- Issue date Feb 4, 2025
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI substrate and related methods
- Patent number 12,211,784
- Issue date Jan 28, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark Griswold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,205,935
- Issue date Jan 21, 2025
- AISIN CORPORATION
- Takanobu Naruse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module, and method of manufacturing electronic...
- Patent number 12,177,990
- Issue date Dec 24, 2024
- Murata Manufacturing Co., Ltd.
- Takahiro Kitazume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with direct chip attach to circuit bo...
- Patent number 12,170,273
- Issue date Dec 17, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component manufacturing device and component manufacturing method
- Patent number 12,165,904
- Issue date Dec 10, 2024
- Mitsui Chemicals Tohcello, Inc.
- Eiji Hayashishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,154,878
- Issue date Nov 26, 2024
- Intel Corporation
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 12,136,591
- Issue date Nov 5, 2024
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stiffener structure and method forming t...
- Patent number 12,125,757
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper/ceramic joined body and insulating circuit substrate
- Patent number 12,125,765
- Issue date Oct 22, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a supporting glass substrate
- Patent number 12,119,278
- Issue date Oct 15, 2024
- Nippon Electric Glass Co., Ltd.
- Hiroki Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 12,119,338
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for bonding the same
- Patent number 12,107,073
- Issue date Oct 1, 2024
- Beijing Boe Display Technology Co., Ltd.
- Zhihua Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bonding method
- Patent number 12,080,675
- Issue date Sep 3, 2024
- Rohm Co., Ltd.
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, power converter, and method of manufacturing...
- Patent number 12,074,132
- Issue date Aug 27, 2024
- Mitsubishi Electric Corporation
- Yo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,040,243
- Issue date Jul 16, 2024
- Murata Manufacturing Co., Ltd.
- Tsuyoshi Takakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die sidewall coatings and related methods
- Patent number 12,040,192
- Issue date Jul 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having a recessed portion for an electronic component
- Patent number 12,009,285
- Issue date Jun 11, 2024
- Kyocera Corporation
- Yoshitomo Onitsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for mounting electronic element, electronic device, and e...
- Patent number 12,004,293
- Issue date Jun 4, 2024
- Kyocera Corporation
- Yukio Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and method for manufacturing the same
- Patent number 11,990,396
- Issue date May 21, 2024
- Resonac Corporation
- Kazuyuki Mitsukura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for integrated circuit and manufacturing method
- Patent number 11,984,373
- Issue date May 14, 2024
- STMicroelectronics (Grenoble 2) SAS
- Jerome Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising interconnects in a core layer configured for s...
- Patent number 11,955,409
- Issue date Apr 9, 2024
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI substrate and related methods
- Patent number 11,948,880
- Issue date Apr 2, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark Griswold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,915,987
- Issue date Feb 27, 2024
- AISIN CORPORATION
- Takanobu Naruse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with die including cavities
- Patent number 11,908,699
- Issue date Feb 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167179
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Sangcheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF USING CIRCUIT TEST STRUCTURE
- Publication number 20250164548
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE AND RELATED METHODS
- Publication number 20250167102
- Publication date May 22, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE AND RELATED METHODS
- Publication number 20250167101
- Publication date May 22, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE
- Publication number 20250157877
- Publication date May 15, 2025
- Niterra Co., Ltd.
- Takuya HANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149392
- Publication date May 8, 2025
- Unimicron Technology Corp.
- Chia Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE, ELECTRONIC UNIT, METHOD FOR MANUFACTUR...
- Publication number 20250140703
- Publication date May 1, 2025
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi KUDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ARRANGEMENT STRUCTURE AND METHOD OF MANUFACTUR...
- Publication number 20250112195
- Publication date Apr 3, 2025
- EPISTAR CORPORATION
- Wen-Chien WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLLOW PACKAGE
- Publication number 20250046746
- Publication date Feb 6, 2025
- Mitsubishi Electric Corporation
- Koji MISAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240421018
- Publication date Dec 19, 2024
- Fuji Electric Co., Ltd.
- Kazuma KAWAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCLOSURE
- Publication number 20240417244
- Publication date Dec 19, 2024
- SCHOTT AG
- Jens Ulrich Thomas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240395734
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tien-Wei CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...
- Publication number 20240395792
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE AND METHOD OF MANUFA...
- Publication number 20240387307
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FOR IMPLEMENTING FLIP-CHIP DIES IN WIREBONDED CIRCUIT AS...
- Publication number 20240379518
- Publication date Nov 14, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Nicholas L. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND BONDING METHOD
- Publication number 20240379610
- Publication date Nov 14, 2024
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240355900
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Man-Nung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SIDEWALL COATINGS AND RELATED METHODS
- Publication number 20240332025
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR BONDING TRANSPARENT CONDUCTOR SUBSTRATES
- Publication number 20240312951
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD AND LAYERED PLATE
- Publication number 20240304462
- Publication date Sep 12, 2024
- Resonac Corporation
- Masaya TOBA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240282684
- Publication date Aug 22, 2024
- Resonac Corporation
- Kazuyuki MITSUKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR AN INTEGRATED CIRCUIT AND MANUFACTURING METHOD
- Publication number 20240258184
- Publication date Aug 1, 2024
- STMicroelectronics (Grenoble 2) SAS
- Jerome LOPEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20240222254
- Publication date Jul 4, 2024
- Shinko Electric Industries Co., Ltd.
- Kenichi Koi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS
- Publication number 20240203744
- Publication date Jun 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE AND RELATED METHODS
- Publication number 20240203864
- Publication date Jun 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark GRISWOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH INTERPOSER ENCAPSULATED BY AN ENCAPSULANT
- Publication number 20240170396
- Publication date May 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR ACCOMMODATING ELECTRONIC COMPONENT, ELECTRONIC APPARATU...
- Publication number 20240145318
- Publication date May 2, 2024
- KYOCERA CORPORATION
- Takuo KISAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240128173
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Ji-Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRAM, PROPOSAL DEVICE, AND PROPOSAL METHOD
- Publication number 20240095421
- Publication date Mar 21, 2024
- Resonac Corporation
- Shunsuke KURAHASHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT TEST STRUCTURE AND METHOD OF USING
- Publication number 20240094282
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fang CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Reinforcing resin composition, electronic component, method for man...

Semiconductor package

Circuit test structure and method of using

Package for an integrated circuit and manufacturing method

Semiconductor package stress balance structures and related methods

Through electrode substrate, electronic unit, method for manufactur...

SOI substrate and related methods

Semiconductor device

Electronic component module, and method of manufacturing electronic...

Integrated circuit assemblies with direct chip attach to circuit bo...

Component manufacturing device and component manufacturing method

Semiconductor device

Through electrode substrate and semiconductor device

Semiconductor package with stiffener structure and method forming t...

Copper/ceramic joined body and insulating circuit substrate

Method of manufacturing a supporting glass substrate

Semiconductor device packages, packaging methods, and packaged semi...

Display device and method for bonding the same

Semiconductor device and bonding method

Semiconductor device, power converter, and method of manufacturing...

Module

Die sidewall coatings and related methods

Substrate having a recessed portion for an electronic component

Substrate for mounting electronic element, electronic device, and e...

Substrate and method for manufacturing the same

Package for integrated circuit and manufacturing method

Substrate comprising interconnects in a core layer configured for s...

SOI substrate and related methods

Semiconductor device

Semiconductor packages with die including cavities

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

METHOD OF USING CIRCUIT TEST STRUCTURE

SOI SUBSTRATE AND RELATED METHODS

SOI SUBSTRATE AND RELATED METHODS

SEMICONDUCTOR SUBSTRATE

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

THROUGH ELECTRODE SUBSTRATE, ELECTRONIC UNIT, METHOD FOR MANUFACTUR...

SEMICONDUCTOR DEVICE ARRANGEMENT STRUCTURE AND METHOD OF MANUFACTUR...

HOLLOW PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ENCLOSURE

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...

SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE AND METHOD OF MANUFA...

INTERPOSER FOR IMPLEMENTING FLIP-CHIP DIES IN WIREBONDED CIRCUIT AS...

SEMICONDUCTOR DEVICE AND BONDING METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DIE SIDEWALL COATINGS AND RELATED METHODS

SYSTEM AND METHOD FOR BONDING TRANSPARENT CONDUCTOR SUBSTRATES

METHOD FOR MANUFACTURING WIRING BOARD AND LAYERED PLATE

SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE FOR AN INTEGRATED CIRCUIT AND MANUFACTURING METHOD

ELECTRONIC APPARATUS

SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS

SOI SUBSTRATE AND RELATED METHODS

PACKAGE STRUCTURE WITH INTERPOSER ENCAPSULATED BY AN ENCAPSULANT

PACKAGE FOR ACCOMMODATING ELECTRONIC COMPONENT, ELECTRONIC APPARATU...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

PROGRAM, PROPOSAL DEVICE, AND PROPOSAL METHOD

CIRCUIT TEST STRUCTURE AND METHOD OF USING