Multibank DRAM [MDRAM]

Follow

Industry

CPC
H01L2924/14364

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/14364Multibank DRAM [MDRAM]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of stacking semiconductor die in mo...
- Patent number 9,252,032
- Issue date Feb 2, 2016
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die in mo...
- Patent number 8,263,435
- Issue date Sep 11, 2012
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Stacking Semiconductor Die in Mo...
- Publication number 20120299174
- Publication date Nov 29, 2012
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking Semiconductor Die in Mo...
- Publication number 20120104624
- Publication date May 3, 2012
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS