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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
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H01L2224/02251
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor chip having a through electrode and semiconductor pac...
Patent number
12,027,482
Issue date
Jul 2, 2024
Samsung Electronics Co., Ltd.
Jeonggi Jin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bump structure and method of manufacturing bump structure
Patent number
11,923,326
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ching-Yu Chang
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
11,830,832
Issue date
Nov 28, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Tung-Jiun Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating semiconductor device with stress relief stru...
Patent number
11,791,294
Issue date
Oct 17, 2023
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bump structure and method of manufacturing bump structure
Patent number
11,456,266
Issue date
Sep 27, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Ching-Yu Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
10,957,664
Issue date
Mar 23, 2021
Taiwan Semiconductor Manufacturing Company Ltd.
Tung-Jiun Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure having a composite barrier layer
Patent number
10,665,556
Issue date
May 26, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Chun-Yu Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device containing and method of providing carbon covered copper layer
Patent number
10,546,826
Issue date
Jan 28, 2020
Intel IP Corporation
Georg Seidemann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display apparatus
Patent number
10,431,606
Issue date
Oct 1, 2019
Samsung Display Co., Ltd.
Jangmi Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
Patent number
10,388,618
Issue date
Aug 20, 2019
ABLIC INC.
Takeshi Morita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
Patent number
10,297,562
Issue date
May 21, 2019
ABLIC INC.
Kaku Igarashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
Patent number
10,249,584
Issue date
Apr 2, 2019
ABLIC INC.
Takeshi Morita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and fabricating method thereof
Patent number
10,115,686
Issue date
Oct 30, 2018
Taiwan Semiconductor Manufacturing Company Ltd.
Wei-Li Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composite bond structure in stacked semiconductor structure
Patent number
10,062,656
Issue date
Aug 28, 2018
Taiwan Semiconductor Manufacturing Co., Ltd
Chao-Ching Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit chip and integrated circuit wafer with guard ring
Patent number
10,026,699
Issue date
Jul 17, 2018
Synaptics Japan GK
Atsushi Obuchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display apparatus
Patent number
9,899,429
Issue date
Feb 20, 2018
Samsung Display Co., Ltd.
Jangmi Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure with composite barrier layer under redistri...
Patent number
9,824,987
Issue date
Nov 21, 2017
Taiwan Semiconductor Manufacturing Co., Ltd
Chun-Yu Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging device having plural microstructures disposed proximate t...
Patent number
9,607,959
Issue date
Mar 28, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuo Lung Pan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYER AND METHOD THEREFOR
Publication number
20250038138
Publication date
Jan 30, 2025
NXP B.V.
Ting Hsun Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
Publication number
20240387421
Publication date
Nov 21, 2024
Samsung Electronics Co., Ltd.
Hyungsun JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP HAVING A THROUGH ELECTRODE AND SEMICONDUCTOR PAC...
Publication number
20240321794
Publication date
Sep 26, 2024
Samsung Electronics Co., Ltd.
Jeonggi Jin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
Publication number
20240258252
Publication date
Aug 1, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Yu CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package Including Step Seal Ring and Methods Forming...
Publication number
20230386908
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Sheng-Han Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OXIDE AND CARBON LAYERS AT A SURFACE OF A SUBSTRATE FOR HYBRID BONDING
Publication number
20230187395
Publication date
Jun 15, 2023
Intel Corporation
Nafees A. KABIR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20230010936
Publication date
Jan 12, 2023
Samsung Electronics Co., Ltd.
JEONGGI JIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
Publication number
20220406741
Publication date
Dec 22, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Yu CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH STRESS RELIEF STRU...
Publication number
20220102303
Publication date
Mar 31, 2022
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20210210447
Publication date
Jul 8, 2021
Taiwan Semiconductor Manufacturing company Ltd.
TUNG-JIUN WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
Publication number
20210134746
Publication date
May 6, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Ching-Yu CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Publication number
20210125948
Publication date
Apr 29, 2021
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20200381378
Publication date
Dec 3, 2020
Taiwan Semiconductor Manufacturing company Ltd.
TUNG-JIUN WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE CONTAINING AND METHOD OF PROVIDING CARBON COVERED COPPER LAYER
Publication number
20200006263
Publication date
Jan 2, 2020
Intel IP Corporation
Georg Seidemann
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
Publication number
20190189575
Publication date
Jun 20, 2019
ABLIC INC.
Takeshi MORITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES
Publication number
20190027453
Publication date
Jan 24, 2019
Samsung Electronics Co., Ltd.
YONG HO KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
Publication number
20180269170
Publication date
Sep 20, 2018
ABLIC Inc.
Kaku IGARASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
Publication number
20180269169
Publication date
Sep 20, 2018
ABLIC Inc.
Takeshi MORITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY APPARATUS
Publication number
20180151600
Publication date
May 31, 2018
SAMSUNG DISPLAY CO., LTD.
Jangmi Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20180068963
Publication date
Mar 8, 2018
Taiwan Semiconductor Manufacturing Co., Ltd.
Chun-Yu WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITE BOND STRUCTURE IN STACKED SEMICONDUCTOR STRUCTURE
Publication number
20180047682
Publication date
Feb 15, 2018
Taiwan Semiconductor Manufacturing Co., Ltd.
Chao-Ching Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LARGE SCALE INTEGRATED CIRCUIT CHIP AND LARGE SCALE INTEGRATED CIRC...
Publication number
20170278805
Publication date
Sep 28, 2017
Synaptics Japan GK
Atsushi OBUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATING METHOD THEREOF
Publication number
20170278809
Publication date
Sep 28, 2017
Taiwan Semiconductor Manufacturing company Ltd.
WEI-LI HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE WITH COMPOSITE BARRIER LAYER UNDER REDISTRI...
Publication number
20160322316
Publication date
Nov 3, 2016
Taiwan Semiconductor Manufacturing Co., Ltd.
Chun-Yu WU
H01 - BASIC ELECTRIC ELEMENTS