Multilayer circuits

Industry

CPC
H05K1/0298

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0298Multilayer circuits

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Single circuit board assembly with logic and power components
- Patent number 12,324,093
- Issue date Jun 3, 2025
- Steering Solutions IP Holding Corporation
- Ryan D. Yaklin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Circuit board local electromagnetic shielding
- Patent number 12,317,409
- Issue date May 27, 2025
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board and printed wiring board
- Patent number 12,317,425
- Issue date May 27, 2025
- Ibiden Co., Ltd.
- Atsushi Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a device substrate
- Patent number 12,317,423
- Issue date May 27, 2025
- AUO Corporation
- Chun-Yueh Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 12,309,915
- Issue date May 20, 2025
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board having embedded electronic component and method for m...
- Patent number 12,309,918
- Issue date May 20, 2025
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Ming-Hsun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board with offset connection pads and inclined i...
- Patent number 12,306,210
- Issue date May 20, 2025
- Kyocera Corporation
- Hitoshi Tega
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,309,923
- Issue date May 20, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit carrier and manufacturing method thereof and package structure
- Patent number 12,309,943
- Issue date May 20, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 12,302,493
- Issue date May 13, 2025
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production method for multilayer wiring board
- Patent number 12,302,504
- Issue date May 13, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and image forming apparatus
- Patent number 12,295,096
- Issue date May 6, 2025
- Canon Kabushiki Kaisha
- Takeshi Honda
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Printed circuit board and storage device including the same
- Patent number 12,295,095
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Sunhong Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board including bonding layer, having conductive pa...
- Patent number 12,295,100
- Issue date May 6, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Yoon Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 12,295,099
- Issue date May 6, 2025
- Shinko Electric Industries Co., Ltd.
- Yuta Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,289,828
- Issue date Apr 29, 2025
- Murata Manufacturing Co., Ltd.
- Kosuke Nishio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer resin substrate and electronic component
- Patent number 12,289,826
- Issue date Apr 29, 2025
- Murata Manufacturing Co., Ltd.
- Takako Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed board and electronic device
- Patent number 12,289,827
- Issue date Apr 29, 2025
- Kioxia Corporation
- Yuta Tsubouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 12,289,829
- Issue date Apr 29, 2025
- Ibiden Co., Ltd.
- Jun Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device comprising stacked circuit members
- Patent number 12,289,825
- Issue date Apr 29, 2025
- Japan Aviation Electronics Industry, Limited
- Shinji Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,289,838
- Issue date Apr 29, 2025
- Ibiden Co., Ltd.
- Yasuki Kimishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for localized repair of graphene-coated lamination stacks a...
- Patent number 12,289,839
- Issue date Apr 29, 2025
- Mellanox Technologies, Ltd.
- Elad Mentovich
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Hybrid circuit board
- Patent number 12,282,053
- Issue date Apr 22, 2025
- COBHAM ADVANCED ELECTRONIC SOLUTIONS INC.
- Mark Bates
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive substrate and carrier plate wiring structure with filter...
- Patent number 12,279,377
- Issue date Apr 15, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Autoclavable electronics unit for an endoscope, method for producin...
- Patent number 12,279,379
- Issue date Apr 15, 2025
- OLYMPUS WINTER & IBE & GMBH
- Sven Pabst
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display module, display apparatus, and method of manufacturing the...
- Patent number 12,278,225
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Jongsu Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board and producing method thereof
- Patent number 12,279,367
- Issue date Apr 15, 2025
- Nitto Denko Corporation
- Rihito Fukushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for transmitting signal in high-frequency ban...
- Patent number 12,279,365
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Eunseok Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board assembly and electronic device comprising same
- Patent number 12,279,371
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Gyeongmin Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate module with filter function
- Patent number 12,273,994
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Noriaki Okuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE...
- Publication number 20250185167
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Kyeongho KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR AN INTERMEDIATE DEVICE STRUCTURE
- Publication number 20250185139
- Publication date Jun 5, 2025
- LIGHTING DEFENSE GROUP, LLC
- Daniel S. Spiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250176099
- Publication date May 29, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME
- Publication number 20250168965
- Publication date May 22, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Gyumook Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250159800
- Publication date May 15, 2025
- AaltoSemi Inc.
- Min-Yao CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM
- Publication number 20250158619
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMBRANE CIRCUIT BOARD
- Publication number 20250159797
- Publication date May 15, 2025
- CHICONY ELECTRONICS CO., LTD.
- CHIH-HUNG LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20250159799
- Publication date May 15, 2025
- KYOCERA CORPORATION
- Yuki TAKESHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250159798
- Publication date May 15, 2025
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Satoshi KIYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250157910
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR OPTIMIZING METAL WEIGHT OF CONDUCTIVE LAYER...
- Publication number 20250151208
- Publication date May 8, 2025
- Dell Products L.P.
- Steven R. ETHRIDGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ECO-FRIENDLY PRINTED CIRCUIT BOARD FOR HIGH TEMPERATURE AND LOW TEM...
- Publication number 20250151193
- Publication date May 8, 2025
- SANDISK TECHNOLOGIES, INC.
- Vigneshwarram Kumaresan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCED PRINTED CIRCUIT BOARD EXPANSION IN INTEGRATED SENSOR-LENS A...
- Publication number 20250142191
- Publication date May 1, 2025
- GoPro, Inc.
- Ian Copeland Griggs
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20250133655
- Publication date Apr 24, 2025
- TRIPOD (WUXI) ELECTRONIC CO., LTD.
- CHI SUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250126707
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Won Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING CIRCUIT BOARD
- Publication number 20250126723
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250126711
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Eun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250126712
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Young Kuk Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20250125269
- Publication date Apr 17, 2025
- LG Innotek Co., Ltd.
- Se Woong NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-COPLANAR PARALLEL RESISTANCE-REDUCING CIRCUIT STRUCTURE
- Publication number 20250126706
- Publication date Apr 17, 2025
- AAC MICROTECH (CHANGZHOU) CO., LTD.
- Guohui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD HAVING WATERPROOF STRUCTURE AND FOLD...
- Publication number 20250120015
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jihoon KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ELEMENT ASSEMBLY, IMAGE SENSOR MODULE, CAMERA MODULE AND...
- Publication number 20250120011
- Publication date Apr 10, 2025
- LARGAN INDUSTRIAL OPTICS CO., LTD.
- Ti Lun LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20250120014
- Publication date Apr 10, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Youngwoong Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250112562
- Publication date Apr 3, 2025
- Hitachi Astemo, Ltd.
- Junpei KUSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250106992
- Publication date Mar 27, 2025
- InnoLux Corporation
- Chen-Kuan KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20250106991
- Publication date Mar 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250098071
- Publication date Mar 20, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jung Hyun CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, LIGHT-EMITTING SUBSTRATE, BACKLIGHT MODULE, AND DISP...
- Publication number 20250098064
- Publication date Mar 20, 2025
- BOE TECHNOLOGY GROUP CO., LTD.
- Nianqi YAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250095885
- Publication date Mar 20, 2025
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, CIRCUIT BOARD STRUCTURE AND MANUFACTURING MET...
- Publication number 20250096198
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Multilayer circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Single circuit board assembly with logic and power components

Circuit board local electromagnetic shielding

Method for manufacturing printed wiring board and printed wiring board

Method of manufacturing a device substrate

Mating backplane for high speed, high density electrical connector

Circuit board having embedded electronic component and method for m...

Multilayer circuit board with offset connection pads and inclined i...

Printed circuit board and method for manufacturing the same

Circuit carrier and manufacturing method thereof and package structure

Wiring substrate

Production method for multilayer wiring board

Circuit board and image forming apparatus

Printed circuit board and storage device including the same

Printed circuit board including bonding layer, having conductive pa...

Wiring board

Circuit board

Multilayer resin substrate and electronic component

Printed board and electronic device

Printed wiring board

Device comprising stacked circuit members

Wiring substrate and method for manufacturing wiring substrate

Process for localized repair of graphene-coated lamination stacks a...

Hybrid circuit board

Conductive substrate and carrier plate wiring structure with filter...

Autoclavable electronics unit for an endoscope, method for producin...

Display module, display apparatus, and method of manufacturing the...

Wiring circuit board and producing method thereof

Printed circuit board for transmitting signal in high-frequency ban...

Printed circuit board assembly and electronic device comprising same

Multilayer substrate module with filter function

Patents Applicationslast 30 patents

FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE...

SYSTEMS AND METHODS FOR AN INTERMEDIATE DEVICE STRUCTURE

PRINTED CIRCUIT BOARD

CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM

MEMBRANE CIRCUIT BOARD

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

PRINTED WIRING BOARD

CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME

SYSTEMS AND METHODS FOR OPTIMIZING METAL WEIGHT OF CONDUCTIVE LAYER...

ECO-FRIENDLY PRINTED CIRCUIT BOARD FOR HIGH TEMPERATURE AND LOW TEM...

REDUCED PRINTED CIRCUIT BOARD EXPANSION IN INTEGRATED SENSOR-LENS A...

CIRCUIT BOARD STRUCTURE

PRINTED CIRCUIT BOARD

METHOD FOR FORMING CIRCUIT BOARD

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD

NON-COPLANAR PARALLEL RESISTANCE-REDUCING CIRCUIT STRUCTURE

FLEXIBLE PRINTED CIRCUIT BOARD HAVING WATERPROOF STRUCTURE AND FOLD...

ELECTRONIC ELEMENT ASSEMBLY, IMAGE SENSOR MODULE, CAMERA MODULE AND...

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

PRINTED CIRCUIT BOARD

CIRCUIT BOARD, LIGHT-EMITTING SUBSTRATE, BACKLIGHT MODULE, AND DISP...

ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE, CIRCUIT BOARD STRUCTURE AND MANUFACTURING MET...