Multilayer circuits

Industry

CPC
H05K1/0298

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0298Multilayer circuits

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Surface-treated copper foil and copper clad laminate
- Patent number 12,168,834
- Issue date Dec 17, 2024
- Chang Chun Petrochemical Co., Ltd.
- Jian-Ming Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Lighting strip
- Patent number 12,169,059
- Issue date Dec 17, 2024
- SIGNIFY HOLDING, B.V.
- Andrew Christanto
- F21 - LIGHTING
Information Patent Grant
Flexible printed circuit board having waterproof structure and fold...
- Patent number 12,167,531
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Jihoon Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulation structures and printed circuit board including the same
- Patent number 12,167,532
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Hyejin Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Stepped electronic substrate for integrated circuit packages
- Patent number 12,165,983
- Issue date Dec 10, 2024
- Intel Corporation
- Eleanor Patricia Paras Rabadam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 12,167,545
- Issue date Dec 10, 2024
- Murata Manufacturing Co., Ltd.
- Takayuki Shimamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,160,953
- Issue date Dec 3, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Providing a lower inductance path in a routing substrate for a capa...
- Patent number 12,160,952
- Issue date Dec 3, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,160,949
- Issue date Dec 3, 2024
- FUJIFILM Corporation
- Genya Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,156,329
- Issue date Nov 26, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing photoelectric composite circuit board
- Patent number 12,153,252
- Issue date Nov 26, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Wei-Liang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technologies for power tunnels on circuit boards
- Patent number 12,156,331
- Issue date Nov 26, 2024
- Intel Corporation
- Khai Ern See
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic element mounting substrate, electronic device, and elect...
- Patent number 12,144,114
- Issue date Nov 12, 2024
- Kyocera Corporation
- Kanae Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,144,159
- Issue date Nov 12, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bus bar link for battery cell interconnections in a battery module
- Patent number 12,134,323
- Issue date Nov 5, 2024
- CPS Technology Holdings LLC
- Matthew R. Tyler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electromagnetic interference shields having attentuation interfaces
- Patent number 12,133,322
- Issue date Oct 29, 2024
- Intel Corporation
- Jaejin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for multiple input power distribution to adjac...
- Patent number 12,126,147
- Issue date Oct 22, 2024
- Legrand DPC, LLC
- Carrel W. Ewing
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayer printed circuit board
- Patent number 12,127,341
- Issue date Oct 22, 2024
- Thales
- Geoffroy Aupee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate and memory system
- Patent number 12,127,346
- Issue date Oct 22, 2024
- Kioxia Corporation
- Kazuyuki Niitsuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 12,127,340
- Issue date Oct 22, 2024
- Kyocera Corporation
- Yoshihiro Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,127,343
- Issue date Oct 22, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dong Joo Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Current sensors for power converters
- Patent number 12,126,264
- Issue date Oct 22, 2024
- Apple Inc.
- Brandon Pierquet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 12,120,815
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for double-sided wiring circuit board and doub...
- Patent number 12,114,438
- Issue date Oct 8, 2024
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat removal from silicon photonics chip using a recessed side-by-s...
- Patent number 12,114,416
- Issue date Oct 8, 2024
- Mellanox Technologies, Ltd.
- Elad Mentovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filter device
- Patent number 12,108,527
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Wataru Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with embedded bridge
- Patent number 12,108,532
- Issue date Oct 1, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Moon Seok Heo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,108,530
- Issue date Oct 1, 2024
- Unimicron Technology Corp.
- Kuang-Ching Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and printed circuit board package
- Patent number 12,108,535
- Issue date Oct 1, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kwang Yun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board using thermocouple to dissipate generated heat and me...
- Patent number 12,101,871
- Issue date Sep 24, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Huan-Yu He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD
- Publication number 20240422899
- Publication date Dec 19, 2024
- Intel Corporation
- Srinivas B REDDY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240422900
- Publication date Dec 19, 2024
- KYOCERA CORPORATION
- Noriyuki SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Continuously Extending Vertical Connection S...
- Publication number 20240422907
- Publication date Dec 19, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Markus LEITGEB
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240422901
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Heun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURALLY ENHANCED FILTERING OF CIRCUIT BOARD PLANES
- Publication number 20240422895
- Publication date Dec 19, 2024
- Microsoft Technology Licensing, LLC
- Jason HARRIGAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board
- Publication number 20240422920
- Publication date Dec 19, 2024
- Avary Holding (Shenzhen) Co., Limited.
- WEN-ZHU WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TERMINAL STRUCTURE AND WIRING SUBSTRATE
- Publication number 20240413063
- Publication date Dec 12, 2024
- Shinko Electric Industries Co., Ltd.
- Junichi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY SYSTEM
- Publication number 20240405010
- Publication date Dec 5, 2024
- KIOXIA Corporation
- Hayato MASUBUCHI
- G11 - INFORMATION STORAGE
Information Patent Application
MODULAR HEAT MITIGATION SYSTEM WITH MMWAVE SUPPRESSION FOR ACTIVE E...
- Publication number 20240405448
- Publication date Dec 5, 2024
- Jabil Inc.
- Ian Jeffery Timmins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240397619
- Publication date Nov 28, 2024
- LG Innotek Co., Ltd.
- Sung Wuk RYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD DEVICE
- Publication number 20240397621
- Publication date Nov 28, 2024
- Unimicron Technology Corp.
- Chin-Hsun WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Display Panel and Display Apparatus
- Publication number 20240397626
- Publication date Nov 28, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jiaqin ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240397611
- Publication date Nov 28, 2024
- Mitsubishi Electric Corporation
- Koji MIYAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240389226
- Publication date Nov 21, 2024
- KYOCERA CORPORATION
- Yuhei MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240381533
- Publication date Nov 14, 2024
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE LAMINATE MATERIAL
- Publication number 20240381528
- Publication date Nov 14, 2024
- THE CHEMOURS COMPANY FC, LLC
- RONG LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLIES WITH ALUMINUM PCB SUBSTRATES IN HO...
- Publication number 20240373543
- Publication date Nov 7, 2024
- GUANGZHOU ON-BRIGHT ELECTRONICS CO., LTD.
- XIAOKUI CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...
- Publication number 20240372426
- Publication date Nov 7, 2024
- INFINITUM ELECTRIC INC.
- Rich Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20240373549
- Publication date Nov 7, 2024
- Murata Manufacturing Co., Ltd.
- Tomonori KATSURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VEHICULAR WIRING BOARD
- Publication number 20240365466
- Publication date Oct 31, 2024
- YAZAKI CORPORATION
- Hideaki Kikuchi
- B60 - VEHICLES IN GENERAL
Information Patent Application
CIRCUIT BOARD AND METHOD OF PRODUCING CIRCUIT BOARD
- Publication number 20240365477
- Publication date Oct 31, 2024
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CUR...
- Publication number 20240363604
- Publication date Oct 31, 2024
- pSemi Corporation
- David Giuliano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240365467
- Publication date Oct 31, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...
- Publication number 20240365473
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-HSIEN LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240349426
- Publication date Oct 17, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi SAKURAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE PRINTED WIRING BOARD AND METHOD OF MANUFACTURING COMPOSIT...
- Publication number 20240334597
- Publication date Oct 3, 2024
- Mitsubishi Electric Corporation
- Tatsuya SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240334601
- Publication date Oct 3, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sangho Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING BOARD
- Publication number 20240334607
- Publication date Oct 3, 2024
- Panasonic Automotive Systems Co., Ltd.
- Mitsunori HAYASAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier Method of Manufacturing the Component Carrier and...
- Publication number 20240334617
- Publication date Oct 3, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Hans PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DECOUPLED PCB STRUCTURE TO PARALLEL POWER TRANSISTORS
- Publication number 20240305184
- Publication date Sep 12, 2024
- SCHNEIDER ELECTRIC IT CORPORATION
- Indra Prakash
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Multilayer circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Surface-treated copper foil and copper clad laminate

Lighting strip

Flexible printed circuit board having waterproof structure and fold...

Insulation structures and printed circuit board including the same

Stepped electronic substrate for integrated circuit packages

Multilayer substrate

Circuit board structure and manufacturing method thereof

Providing a lower inductance path in a routing substrate for a capa...

Wiring board and method for manufacturing wiring board

Printed circuit board

Method for manufacturing photoelectric composite circuit board

Technologies for power tunnels on circuit boards

Electronic element mounting substrate, electronic device, and elect...

Module

Bus bar link for battery cell interconnections in a battery module

Electromagnetic interference shields having attentuation interfaces

Method and apparatus for multiple input power distribution to adjac...

Multilayer printed circuit board

Substrate and memory system

Wiring substrate

Printed circuit board

Current sensors for power converters

Multilayer substrate

Manufacturing method for double-sided wiring circuit board and doub...

Heat removal from silicon photonics chip using a recessed side-by-s...

Filter device

Printed circuit board with embedded bridge

Circuit board structure and manufacturing method thereof

Printed circuit board and printed circuit board package

Circuit board using thermocouple to dissipate generated heat and me...

Patents Applicationslast 30 patents

ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD

WIRING BOARD AND MANUFACTURING METHOD FOR THE SAME

Component Carrier With Continuously Extending Vertical Connection S...

PRINTED CIRCUIT BOARD

STRUCTURALLY ENHANCED FILTERING OF CIRCUIT BOARD PLANES

Circuit board

TERMINAL STRUCTURE AND WIRING SUBSTRATE

SEMICONDUCTOR MEMORY SYSTEM

MODULAR HEAT MITIGATION SYSTEM WITH MMWAVE SUPPRESSION FOR ACTIVE E...

PRINTED CIRCUIT BOARD

CIRCUIT BOARD DEVICE

Display Panel and Display Apparatus

WIRING BOARD

WIRING BOARD

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

FLEXIBLE LAMINATE MATERIAL

PRINTED CIRCUIT BOARD ASSEMBLIES WITH ALUMINUM PCB SUBSTRATES IN HO...

AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...

MULTILAYER SUBSTRATE

VEHICULAR WIRING BOARD

CIRCUIT BOARD AND METHOD OF PRODUCING CIRCUIT BOARD

MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CUR...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

COMPOSITE PRINTED WIRING BOARD AND METHOD OF MANUFACTURING COMPOSIT...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

MOUNTING BOARD

Component Carrier Method of Manufacturing the Component Carrier and...

DECOUPLED PCB STRUCTURE TO PARALLEL POWER TRANSISTORS