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Multilayer circuits

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  • H05K1/0298
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/0298Multilayer circuits
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    POWER MODULE
    • Publication number 20250081346
    • Publication date Mar 6, 2025
    • Hyundai Motor Company
    • Se Yoon JEONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20250081338
    • Publication date Mar 6, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Ho JEONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTI-LAYER ELECTRICAL STRUCTURES
    • Publication number 20250081339
    • Publication date Mar 6, 2025
    • Qorvo US, Inc.
    • Jerry Holt
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HIGH SPEED CAMERA INTERFACE PCB FLOOR PLAN FOR AUTONOMOUS VEHICLES
    • Publication number 20250081336
    • Publication date Mar 6, 2025
    • Apollo Autonomous Driving USA LLC
    • Yun JI
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    BRIDGE PRINTED CIRCUIT BOARD EMBEDDED WITHIN ANOTHER PRINTED CIRCUI...
    • Publication number 20250081348
    • Publication date Mar 6, 2025
    • Intel Corporation
    • Arumanayagam RAJASEKAR
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250081337
    • Publication date Mar 6, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Young Kuk KO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR STEP-SOLDERING
    • Publication number 20250065449
    • Publication date Feb 27, 2025
    • SENJU METAL INDUSTRY CO., LTD.
    • Takashi SAITO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250071898
    • Publication date Feb 27, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Eun LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
    • Publication number 20250071912
    • Publication date Feb 27, 2025
    • InnoLux Corporation
    • Ming-Chih TSAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BODY AND CONNECTOR-ATTACHED CIRCUIT BODY
    • Publication number 20250071900
    • Publication date Feb 27, 2025
    • YAZAKI CORPORATION
    • Hidehiko Shimizu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20250063661
    • Publication date Feb 20, 2025
    • Sumitomo Electric Industries, Ltd.
    • Kenji TAKAHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250063666
    • Publication date Feb 20, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Dae Jung BYUN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MANUFACTURING METHOD OF CIRCUIT BOARD
    • Publication number 20250056712
    • Publication date Feb 13, 2025
    • Unimicron Technology Corp.
    • Jun-Rui Huang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC ASSEMBLY
    • Publication number 20250056717
    • Publication date Feb 13, 2025
    • VALEO COMFORT AND DRIVING ASSISTANCE
    • Matthias Wellens
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CERAMIC SUBSTRATE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, WIRI...
    • Publication number 20250056719
    • Publication date Feb 13, 2025
    • KYOCERA CORPORATION
    • Koutarou NAKAMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20250056718
    • Publication date Feb 13, 2025
    • IBIDEN CO., LTD.
    • Atsushi ISHIDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250056727
    • Publication date Feb 13, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Ho JEONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DAMPENING GOLD FINGER RESONANCE
    • Publication number 20250048547
    • Publication date Feb 6, 2025
    • Dell Products L.P.
    • Arun Chada
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250048534
    • Publication date Feb 6, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Jin Uk LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD WITH REDUCED VIA STRIPING
    • Publication number 20250040045
    • Publication date Jan 30, 2025
    • Dell Products L.P.
    • Sandor FARKAS
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTIL...
    • Publication number 20250040059
    • Publication date Jan 30, 2025
    • Panasonic Intellectual Property Management Co., Ltd.
    • Tomoyuki KAWAHARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CAPACITIVE ELEMENT, CIRCUIT CARRIER HAVING THE SAME AND FABRICATION...
    • Publication number 20250040051
    • Publication date Jan 30, 2025
    • Unimicron Technology Corp.
    • Chun Hung KUO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250031303
    • Publication date Jan 23, 2025
    • LG Innotek Co., Ltd.
    • Dong Keon LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BUS BAR LINK FOR BATTERY CELL INTERCONNECTIONS IN A BATTERY MODULE
    • Publication number 20250018798
    • Publication date Jan 16, 2025
    • CPS Technology Holdings LLC
    • Matthew R. TYLER
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    CERAMIC WIRING MEMBER
    • Publication number 20250024592
    • Publication date Jan 16, 2025
    • NGK Electronics Devices, Inc.
    • Hiroshi KOUNO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SCREEN PROTECTOR
    • Publication number 20250024604
    • Publication date Jan 16, 2025
    • SANE Products Inc.
    • Pei-Hsun LU
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    IMPEDANCE TUNING OF MICROSTRIP TRACES
    • Publication number 20250024589
    • Publication date Jan 16, 2025
    • Dell Products L.P.
    • Sandor FARKAS
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT,...
    • Publication number 20250024595
    • Publication date Jan 16, 2025
    • Canon Kabushiki Kaisha
    • MASANORI KIKUCHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CERAMIC WIRING MEMBER
    • Publication number 20250024599
    • Publication date Jan 16, 2025
    • NGK Electronics Devices, Inc.
    • Hiroshi KOUNO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20250016909
    • Publication date Jan 9, 2025
    • Sumitomo Electric Industries, Ltd.
    • Shun IGARASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR