Multilayer masks

Industry

CPC
H01L2224/03474

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/03474Multilayer masks

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bond pad protection for harsh media applications
- Patent number 10,262,897
- Issue date Apr 16, 2019
- Melexis Technologies NV
- Appolonius Jacobus Van Der Wiel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level device and method with cantilever pillar structure
- Patent number 9,806,047
- Issue date Oct 31, 2017
- Maxim Integrated Products, Inc.
- Karthik Thambidurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of same
- Patent number 9,704,805
- Issue date Jul 11, 2017
- Renesas Electronics Corporation
- Hisao Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of same
- Patent number 9,343,395
- Issue date May 17, 2016
- Renesas Electronics Corporation
- Hisao Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an interconnect structur...
- Patent number 9,252,094
- Issue date Feb 2, 2016
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming compliant conductive int...
- Patent number 9,245,834
- Issue date Jan 26, 2016
- STATS ChipPAC, Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages having bumps and methods of manufacturin...
- Patent number 9,209,146
- Issue date Dec 8, 2015
- SK Hynix Inc.
- Seung Jee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages having bumps and methods of manufacturin...
- Patent number 8,907,487
- Issue date Dec 9, 2014
- SK Hynix Inc.
- Seung Jee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 8,575,749
- Issue date Nov 5, 2013
- Panasonic Corporation
- Shinya Tsujimoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SAME
- Publication number 20140021618
- Publication date Jan 23, 2014
- Hisao SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURIN...
- Publication number 20130334683
- Publication date Dec 19, 2013
- SK HYNIX INC.
- Seung Jee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Compliant Conductive Int...
- Publication number 20130241071
- Publication date Sep 19, 2013
- STATS ChipPAC, Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Interconnect Structur...
- Publication number 20120273938
- Publication date Nov 1, 2012
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20120256312
- Publication date Oct 11, 2012
- PANASONIC CORPORATION
- Shinya TSUJIMOTO
- H01 - BASIC ELECTRIC ELEMENTS

Multilayer masks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bond pad protection for harsh media applications

Wafer level device and method with cantilever pillar structure

Semiconductor device and manufacturing method of same

Semiconductor device and manufacturing method of same

Semiconductor device and method of forming an interconnect structur...

Semiconductor device and method of forming compliant conductive int...

Electronic device packages having bumps and methods of manufacturin...

Electronic device packages having bumps and methods of manufacturin...

Semiconductor device and method for fabricating the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SAME

ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURIN...

Semiconductor Device and Method of Forming Compliant Conductive Int...

Semiconductor Device and Method of Forming an Interconnect Structur...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME