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H01L21/4857
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/4857
Multilayer substrates
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Patents Grants
last 30 patents
Information
Patent Grant
Method for forming a semiconductor package structure
Patent number
11,978,698
Issue date
May 7, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Zengyan Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and formation method of package containing chip structure...
Patent number
11,978,722
Issue date
May 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shu-Shen Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die with embedded communication cavity
Patent number
11,978,948
Issue date
May 7, 2024
Intel Corporation
Vijay K. Nair
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device multilevel package substrate for improved electro...
Patent number
11,978,699
Issue date
May 7, 2024
Texas Instruments Incorporated
Sylvester Ankamah-Kusi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Encapsulated package including device dies connected via interconne...
Patent number
11,978,714
Issue date
May 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Kuo-Chiang Ting
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate having porous dielectric layer
Patent number
11,973,017
Issue date
Apr 30, 2024
Texas Instruments Incorporated
Jaimal Mallory Williamson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,973,037
Issue date
Apr 30, 2024
Powertech Technology Inc.
Shang-Yu Chang Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,973,042
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Jingu Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
11,973,001
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shu-Shen Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composite substrate and method for manufacturing same, and circuit...
Patent number
11,973,002
Issue date
Apr 30, 2024
DENKA COMPANY LIMITED
Atsushi Sakai
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method of manufacturing substrate structure with filling material f...
Patent number
11,973,014
Issue date
Apr 30, 2024
Siliconware Precision Industries Co., Ltd.
Chang-Fu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and method of manufacturing the same
Patent number
11,973,039
Issue date
Apr 30, 2024
Advanced Semiconductor Engineering, Inc.
Chia-Hao Sung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chiplet first architecture for die tiling applications
Patent number
11,973,041
Issue date
Apr 30, 2024
Intel Corporation
Srinivas Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure with improved antenna patterns performance
Patent number
11,973,038
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Fang-Yu Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,967,549
Issue date
Apr 23, 2024
Samsung Electronics Co., Ltd.
Jung Ho Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer stacking structure and manufacturing method thereof
Patent number
11,967,558
Issue date
Apr 23, 2024
Powerchip Semiconductor Manufacturing Corporation
Shou-Zen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Info packages including thermal dissipation blocks
Patent number
11,967,591
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Yu-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor device and method for fabricating a packaged...
Patent number
11,967,562
Issue date
Apr 23, 2024
Infineon Technologies AG
Horst Theuss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optical lithography system and method of using the same
Patent number
11,960,211
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,961,742
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laminate sheet and method of use thereof
Patent number
11,961,771
Issue date
Apr 16, 2024
Mitsui Mining & Smelting Co., Ltd.
Yoshinori Matsuura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna apparatus and method
Patent number
11,961,809
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Feng-Wei Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Size and efficiency of dies
Patent number
11,961,804
Issue date
Apr 16, 2024
Intel Corporation
Mathew J. Manusharow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method
Patent number
11,961,814
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chien-Hsun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate manufacturing method for realizing three-dimensional pack...
Patent number
11,961,743
Issue date
Apr 16, 2024
Zhuhai ACCESS Semiconductor Co., Ltd.
Xianming Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package device and method of manufacturing the same
Patent number
11,956,897
Issue date
Apr 9, 2024
Advanced Semiconductor Engineering, Inc.
Ming-Ze Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package device
Patent number
11,955,433
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming vertical interconnect st...
Patent number
11,955,467
Issue date
Apr 9, 2024
STATS ChipPAC Pte. Ltd.
Junghwan Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method
Patent number
11,955,442
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure
Patent number
11,948,881
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Hsi-Kuei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC INTERCONNECT AND METHOD OF FORMING THE SAME
Publication number
20240145365
Publication date
May 2, 2024
Intel Corporation
Bok Eng CHEAH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT PACKAGING FOR A MULTICHIP PACKAGE
Publication number
20240145457
Publication date
May 2, 2024
Micron Technology, Inc.
Faxing CHE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
Publication number
20240145361
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
WONBIN SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240145396
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Sehoon JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240145397
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Jeongho LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND ASSOCIATED METHODS WITH SOLDER MASK OPEN...
Publication number
20240145405
Publication date
May 2, 2024
Micron Technology, Inc.
Avishesh Dhakal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER POWER CORRIDOR
Publication number
20240145394
Publication date
May 2, 2024
Intel Corporation
Poh Boon KHOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20240136293
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE
Publication number
20240136299
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY
Publication number
20240136270
Publication date
Apr 25, 2024
International Business Machines Corporation
Francesco PREDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240136201
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Yuseon HEO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
Publication number
20240138071
Publication date
Apr 25, 2024
IBIDEN CO., LTD.
Shogo FUKUI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
InFO-POP Structures with TIVs Having Cavities
Publication number
20240136298
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Dp., Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED C...
Publication number
20240128202
Publication date
Apr 18, 2024
Intel Corporation
Gianni SIGNORINI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20240128206
Publication date
Apr 18, 2024
Advanced Semiconductor Engineering, Inc.
Peng YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS
Publication number
20240128205
Publication date
Apr 18, 2024
Intel Corporation
Debendra MALLIK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240128179
Publication date
Apr 18, 2024
Unimicron Technology Corp.
Jyun-Hong CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240128184
Publication date
Apr 18, 2024
Innolux Corporation
Ker-Yih Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240128232
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Ding Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID CHIP CARRIER PACKAGE
Publication number
20240128170
Publication date
Apr 18, 2024
TEXAS INSTRUMENTS INCORPORATED
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS
Publication number
20240128181
Publication date
Apr 18, 2024
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIELECTRIC INTERPOSER WITH ELECTRICAL-CONNECTION CUT-IN
Publication number
20240128182
Publication date
Apr 18, 2024
Micron Technology, Inc.
Chin Hui Chong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR AND METHOD FOR FORMING THE SAME
Publication number
20240128196
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wen-Shiang Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CORROSION REDUCTION AT LIQUID METAL/METAL INTERFACES BY SELECTIVE I...
Publication number
20240120246
Publication date
Apr 11, 2024
Meta Platforms Technologies, LLC
Omar Awartani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME
Publication number
20240120265
Publication date
Apr 11, 2024
LG Innotek Co., Ltd.
Sang Young LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240120288
Publication date
Apr 11, 2024
Advanced Semiconductor Engineering, Inc.
Chih-Hsin LAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME
Publication number
20240120243
Publication date
Apr 11, 2024
LG Innotek Co., Ltd.
Jong Bae SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSERS FOR MICROELECTRONIC DEVICES
Publication number
20240120283
Publication date
Apr 11, 2024
Micron Technology, Inc.
Owen Fay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package having component carrier with cavity and electronic compone...
Publication number
20240113037
Publication date
Apr 4, 2024
AT&S Austria Technologie & Systemtechnik AG
Gerald Weis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
Publication number
20240112970
Publication date
Apr 4, 2024
Intel Corporation
Hanyu Song
H01 - BASIC ELECTRIC ELEMENTS