Multilayers with layers of different types

Industry

CPC
H05K1/036

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/036Multilayers with layers of different types

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Curable compositions
- Patent number 12,258,445
- Issue date Mar 25, 2025
- AGC Multi Material America, Inc.
- Laibao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable device and display panel and sensor and electronic device
- Patent number 12,245,368
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Yeongjun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,238,852
- Issue date Feb 25, 2025
- Avary Holding (Shenzhen) Co., Limited.
- Ying Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board dielectric molding, machining and electrolyti...
- Patent number 12,219,698
- Issue date Feb 4, 2025
- INFINITUM ELECTRIC INC.
- Edward C. Carignan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Circuit board
- Patent number 12,219,700
- Issue date Feb 4, 2025
- LG Innotek Co., Ltd
- Yong Suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, film with resin, sheet of metal foil wi...
- Patent number 12,209,160
- Issue date Jan 28, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Nii
- B32 - LAYERED PRODUCTS
Information Patent Grant
Component carrier having a double dielectric layer and method of ma...
- Patent number 12,207,399
- Issue date Jan 21, 2025
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass cloth, prepreg, and printed wiring board
- Patent number 12,193,155
- Issue date Jan 7, 2025
- Asahi Kasei Kabushiki Kaisha
- Hiroyuki Honma
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Grant
Flexible wiring board
- Patent number 12,185,458
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Ryo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulation structures and printed circuit board including the same
- Patent number 12,167,532
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Hyejin Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Curable resin, curable resin composition, and cured product
- Patent number 12,157,793
- Issue date Dec 3, 2024
- DIC Corporation
- Ryuichi Matsuoka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit board
- Patent number 12,160,955
- Issue date Dec 3, 2024
- LG Innotek Co., Ltd
- Dong Sun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,160,949
- Issue date Dec 3, 2024
- FUJIFILM Corporation
- Genya Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, resin sheet, multilayer printed wiring board, an...
- Patent number 12,133,339
- Issue date Oct 29, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yune Kumazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing package substrate for mounting semiconductor d...
- Patent number 12,119,277
- Issue date Oct 15, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sock for monitoring human lower limb and foot performance
- Patent number 12,115,000
- Issue date Oct 15, 2024
- Sportscientia Pte. Ltd.
- Panayiotis Lazou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-dielectric printed circuit board
- Patent number 12,120,811
- Issue date Oct 15, 2024
- Intel Corporation
- Arvind S
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, film with resin, metal foil with resin,...
- Patent number 12,098,257
- Issue date Sep 24, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirosuke Saito
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board
- Patent number 12,101,878
- Issue date Sep 24, 2024
- LG Innotek Co., Ltd
- Dong Hwa Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer board and manufacturing method thereof
- Patent number 12,058,811
- Issue date Aug 6, 2024
- AZOTEK CO., LTD.
- Hung-Jung Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin multilayer substrate
- Patent number 12,052,818
- Issue date Jul 30, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi Kasuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 12,048,089
- Issue date Jul 23, 2024
- AT&SAustria Technologie & Systemtechnik
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-treated glass cloth, prepreg, and printed wiring board
- Patent number 12,041,727
- Issue date Jul 16, 2024
- Nitto Boseki Co., LTD
- Kazutaka Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board manufacturing apparatus
- Patent number 12,041,731
- Issue date Jul 16, 2024
- HAESUNG DS CO., LTD
- Sang Min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,036,776
- Issue date Jul 16, 2024
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electromagnetic interference shielding composite and electronic dev...
- Patent number 12,035,516
- Issue date Jul 9, 2024
- Research & Business Foundation Sungkyunkwan University
- Jae Do Nam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, film with resin, metal foil with resin,...
- Patent number 12,024,590
- Issue date Jul 2, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Mikio Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Prepreg, metal-clad laminate, and wiring board
- Patent number 12,022,611
- Issue date Jun 25, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yasunori Hoshino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for mounting electronic element, electronic device, and e...
- Patent number 12,004,293
- Issue date Jun 4, 2024
- Kyocera Corporation
- Yukio Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of printed circuit board dielectric molding and electrolytic...
- Patent number 12,004,306
- Issue date Jun 4, 2024
- INFINITUM ELECTRIC INC.
- Edward C. Carignan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION
- Publication number 20250084205
- Publication date Mar 13, 2025
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki IGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD SUBSTRATE, PRINTED WIRING BOARD, AND MULTILAYE...
- Publication number 20250071894
- Publication date Feb 27, 2025
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE, FABRIC SENSOR, WEARABLE ELECTRONIC DEVICE INCLUDING TH...
- Publication number 20250063654
- Publication date Feb 20, 2025
- Yale University
- LINA SANCHEZ-BOTERO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLAME-RETARDANT COMPOSITION
- Publication number 20250051645
- Publication date Feb 13, 2025
- Chang Chun Plastics Co., Ltd.
- An-Pang TU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250056721
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Cheng-Jia LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CLAD LAMINATE AND USES OF THE SAME
- Publication number 20250056720
- Publication date Feb 13, 2025
- TAIWAN UNION TECHNOLOGY CORPORATION
- Jui-Hsiang TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURABLE POLYMER, CURABLE COMPOSITION, PREPREG, MULTILAYER BODY, MET...
- Publication number 20250043043
- Publication date Feb 6, 2025
- AGC Inc.
- Kazumi HASHIMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ULTRATHIN COMPOSITE DIELECTRICS FOR USE IN PRINTED CIRCUIT BOARDS
- Publication number 20250048548
- Publication date Feb 6, 2025
- AVISHTECH, INC.
- Tarun Amla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIBER WEAVE IN A PRINTED CIRCUIT BOARD SUBSTRATE
- Publication number 20250048549
- Publication date Feb 6, 2025
- Dell Products L.P.
- Sanjay Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURABLE POLYMER, CURABLE COMPOSITION, PREPREG, MULTILAYER BODY, MET...
- Publication number 20250043050
- Publication date Feb 6, 2025
- AGC Inc.
- Kazumi HASHIMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTIL...
- Publication number 20250040059
- Publication date Jan 30, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Tomoyuki KAWAHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILM AND LAMINATE
- Publication number 20250034424
- Publication date Jan 30, 2025
- FUJIFILM CORPORATION
- Miyoko HARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FILM AND LAMINATE
- Publication number 20250026957
- Publication date Jan 23, 2025
- FUJIFILM CORPORATION
- Miyoko HARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD AND ELECTRICAL CONTACT ELEMENT
- Publication number 20250031305
- Publication date Jan 23, 2025
- Rohde& Schwarz GmbH & Co. KG
- Mathias NAGEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND DISPLAY MODULE
- Publication number 20250024607
- Publication date Jan 16, 2025
- Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Rong GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BIODEGRADABLE COMPOSITE MATERIAL
- Publication number 20250019505
- Publication date Jan 16, 2025
- CTK RESEARCH AND DEVELOPMENT CANADA LTD.
- Jitendra Panda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250008651
- Publication date Jan 2, 2025
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIELECTRIC SHEET, SUBSTRATE FOR HIGH FREQUENCY PRINTED WIRING BOARD...
- Publication number 20240422902
- Publication date Dec 19, 2024
- Sumitomo Electric Industries, Ltd.
- Shingo KAIMORI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FILM, LAMINATE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240407090
- Publication date Dec 5, 2024
- FUJIFILM CORPORATION
- Yasuyuki SASADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF IMPROVED POWER INTEGRITY FOR MMWAVE PHASED ARRAY ANTENNAS...
- Publication number 20240405427
- Publication date Dec 5, 2024
- Jabil Inc.
- Ian Jeffery Timmins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...
- Publication number 20240397636
- Publication date Nov 28, 2024
- NVIDIA Corporation
- Oren STEINBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE...
- Publication number 20240376243
- Publication date Nov 14, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yuji NAKASHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE LAMINATE MATERIAL
- Publication number 20240381528
- Publication date Nov 14, 2024
- THE CHEMOURS COMPANY FC, LLC
- RONG LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, PREPREG USING SAME, FILM WITH RESIN, METAL FOIL...
- Publication number 20240368323
- Publication date Nov 7, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Hirosuke SAITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD OF SAME, FILM, AND LAMINATE
- Publication number 20240373550
- Publication date Nov 7, 2024
- FUJIFILM CORPORATION
- Yasuyuki SASADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE FILMS FOR MOBILE ELECTRONIC DEVICE COMPONENTS
- Publication number 20240373551
- Publication date Nov 7, 2024
- CYTEC INDUSTRIES INC.
- Nan Chen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240365467
- Publication date Oct 31, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20240357741
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Yeonkyung CHUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board Structure and Printed Circuit Board Detection...
- Publication number 20240341030
- Publication date Oct 10, 2024
- Advanced ACEBIOTEK CO., LTD.
- Yi-Ping Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE BOARD MATERIAL AND FLEXIBLE PRINTED CIRCUIT
- Publication number 20240341031
- Publication date Oct 10, 2024
- AAC MICROTECH (CHANGZHOU) CO., LTD.
- Guohui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Multilayers with layers of different types

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Curable compositions

Stretchable device and display panel and sensor and electronic device

Circuit board and method for manufacturing the same

Printed circuit board dielectric molding, machining and electrolyti...

Circuit board

Resin composition, prepreg, film with resin, sheet of metal foil wi...

Component carrier having a double dielectric layer and method of ma...

Glass cloth, prepreg, and printed wiring board

Flexible wiring board

Insulation structures and printed circuit board including the same

Curable resin, curable resin composition, and cured product

Circuit board

Wiring board and method for manufacturing wiring board

Resin composition, resin sheet, multilayer printed wiring board, an...

Method for producing package substrate for mounting semiconductor d...

Sock for monitoring human lower limb and foot performance

Multi-dielectric printed circuit board

Resin composition, prepreg, film with resin, metal foil with resin,...

Circuit board

Multilayer board and manufacturing method thereof

Resin multilayer substrate

Laminated component carrier with a thermoplastic structure

Surface-treated glass cloth, prepreg, and printed wiring board

Multilayer circuit board manufacturing apparatus

Resin multilayer substrate and method for manufacturing resin multi...

Electromagnetic interference shielding composite and electronic dev...

Resin composition, prepreg, film with resin, metal foil with resin,...

Prepreg, metal-clad laminate, and wiring board

Substrate for mounting electronic element, electronic device, and e...

Method of printed circuit board dielectric molding and electrolytic...

Patents Applicationslast 30 patents

RESIN COMPOSITION

PRINTED WIRING BOARD SUBSTRATE, PRINTED WIRING BOARD, AND MULTILAYE...

STRETCHABLE, FABRIC SENSOR, WEARABLE ELECTRONIC DEVICE INCLUDING TH...

FLAME-RETARDANT COMPOSITION

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

COPPER CLAD LAMINATE AND USES OF THE SAME

CURABLE POLYMER, CURABLE COMPOSITION, PREPREG, MULTILAYER BODY, MET...

ULTRATHIN COMPOSITE DIELECTRICS FOR USE IN PRINTED CIRCUIT BOARDS

FIBER WEAVE IN A PRINTED CIRCUIT BOARD SUBSTRATE

CURABLE POLYMER, CURABLE COMPOSITION, PREPREG, MULTILAYER BODY, MET...

METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTIL...

FILM AND LAMINATE

FILM AND LAMINATE

METHOD AND ELECTRICAL CONTACT ELEMENT

CIRCUIT BOARD AND DISPLAY MODULE

BIODEGRADABLE COMPOSITE MATERIAL

PRINTED WIRING BOARD

DIELECTRIC SHEET, SUBSTRATE FOR HIGH FREQUENCY PRINTED WIRING BOARD...

FILM, LAMINATE, AND METHOD OF MANUFACTURING THE SAME

METHOD OF IMPROVED POWER INTEGRITY FOR MMWAVE PHASED ARRAY ANTENNAS...

METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...

RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE...

FLEXIBLE LAMINATE MATERIAL

RESIN COMPOSITION, PREPREG USING SAME, FILM WITH RESIN, METAL FOIL...

WIRING BOARD, MANUFACTURING METHOD OF SAME, FILM, AND LAMINATE

COMPOSITE FILMS FOR MOBILE ELECTRONIC DEVICE COMPONENTS

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME

Printed Circuit Board Structure and Printed Circuit Board Detection...

COMPOSITE BOARD MATERIAL AND FLEXIBLE PRINTED CIRCUIT