Multilayers with layers of different types

Industry

CPC
H05K1/036

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/036Multilayers with layers of different types

Industries

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 12,349,273
- Issue date Jul 1, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric, copper clad laminate, circuit board, method for manufac...
- Patent number 12,336,096
- Issue date Jun 17, 2025
- Nippon Pillar Packing Co., Ltd.
- Manami Noda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, cured product, prepreg, metal foil-clad laminate...
- Patent number 12,325,770
- Issue date Jun 10, 2025
- Mitsubishi Gas Chemical Company, Inc.
- Yuji Nakashima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 12,328,814
- Issue date Jun 10, 2025
- TANAZAWA HAKKOSHA CO., LTD.
- Keiichiro Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Preparation method for copper clad laminate having low dielectric c...
- Patent number 12,311,646
- Issue date May 27, 2025
- JIANGMEN DEZHONGTAI ENGINEERING PLASTICS TECHNOLOGY CO., LTD.
- Yonghua Liang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Insulating layer for multilayer printed circuit board, multilayer p...
- Patent number 12,313,973
- Issue date May 27, 2025
- LG Chem, Ltd.
- Jeong Wook Mun
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Laminate, single-sided metal-clad laminated sheet, and multi-layer...
- Patent number 12,309,919
- Issue date May 20, 2025
- Kaneka Corporation
- Kanji Shimoosako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure for display device
- Patent number 12,302,507
- Issue date May 13, 2025
- AUO CORPORATION
- Chi-Sheng Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temporary carrier and method for manufacturing coreless substrate t...
- Patent number 12,302,508
- Issue date May 13, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer board and manufacturing method thereof
- Patent number 12,295,098
- Issue date May 6, 2025
- AZOTEK CO., LTD.
- Hung-Jung Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Component carrier with partially metallized hole using anti-plating...
- Patent number 12,295,108
- Issue date May 6, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Jiangfeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, prepreg, resin-equipped film, resin- equipped me...
- Patent number 12,286,500
- Issue date Apr 29, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Taichi Nakashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate, laminate with buildup layer, laminate with metal foil, an...
- Patent number 12,284,755
- Issue date Apr 22, 2025
- SEKISUI KASEI CO., LTD.
- Koichiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 12,279,368
- Issue date Apr 15, 2025
- Ibiden Co., Ltd.
- Satoru Kawai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fiber sheet, and layered body, circuit board and electronic board u...
- Patent number 12,273,996
- Issue date Apr 8, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomohiro Fukao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Trim element comprising a functional layer made of carbon material
- Patent number 12,263,795
- Issue date Apr 1, 2025
- Faurecia Interieur Industrie
- Godefroy Beau
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Fluororesin composition, fluororesin sheet, laminate and substrate...
- Patent number 12,267,954
- Issue date Apr 1, 2025
- Daikin Industries, Ltd.
- Hirokazu Komori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Curable compositions
- Patent number 12,258,445
- Issue date Mar 25, 2025
- AGC Multi Material America, Inc.
- Laibao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable device and display panel and sensor and electronic device
- Patent number 12,245,368
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Yeongjun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,238,852
- Issue date Feb 25, 2025
- Avary Holding (Shenzhen) Co., Limited.
- Ying Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board dielectric molding, machining and electrolyti...
- Patent number 12,219,698
- Issue date Feb 4, 2025
- INFINITUM ELECTRIC INC.
- Edward C. Carignan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Circuit board
- Patent number 12,219,700
- Issue date Feb 4, 2025
- LG Innotek Co., Ltd
- Yong Suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, film with resin, sheet of metal foil wi...
- Patent number 12,209,160
- Issue date Jan 28, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Nii
- B32 - LAYERED PRODUCTS
Information Patent Grant
Component carrier having a double dielectric layer and method of ma...
- Patent number 12,207,399
- Issue date Jan 21, 2025
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass cloth, prepreg, and printed wiring board
- Patent number 12,193,155
- Issue date Jan 7, 2025
- Asahi Kasei Kabushiki Kaisha
- Hiroyuki Honma
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Grant
Flexible wiring board
- Patent number 12,185,458
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Ryo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulation structures and printed circuit board including the same
- Patent number 12,167,532
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Hyejin Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Curable resin, curable resin composition, and cured product
- Patent number 12,157,793
- Issue date Dec 3, 2024
- DIC Corporation
- Ryuichi Matsuoka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit board
- Patent number 12,160,955
- Issue date Dec 3, 2024
- LG Innotek Co., Ltd
- Dong Sun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,160,949
- Issue date Dec 3, 2024
- FUJIFILM Corporation
- Genya Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, PREPREG OBTAINED USING SAME, RESIN-COATED FILM,...
- Publication number 20250230279
- Publication date Jul 17, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Hiroaki UMEHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS CLOTH, PREPREG, AND PRINTED WIRING BOARD
- Publication number 20250234457
- Publication date Jul 17, 2025
- Asahi Kasei Kabushiki Kaisha
- Amane HIROSE
- D03 - WEAVING
Information Patent Application
Wearable Device for Sports Headwear
- Publication number 20250227839
- Publication date Jul 10, 2025
- HEAD IMPACT TRAUMA LIMITED
- David Euan Murray BOWEN
- A42 - HEADWEAR
Information Patent Application
RESIN COMPOSITION, PREPREG, FILM WITH RESIN, SHEET OF METAL FOIL WI...
- Publication number 20250223423
- Publication date Jul 10, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Akito HASHIMOTO
- B32 - LAYERED PRODUCTS
Information Patent Application
PHOTOSENSITIVE MULTILAYER RESIN FILM, PRINTED WIRING BOARD, SEMICON...
- Publication number 20250227853
- Publication date Jul 10, 2025
- Resonac Corporation
- Ryo YUKIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND PREPARATION METHOND THEREFOR
- Publication number 20250220825
- Publication date Jul 3, 2025
- TRIPLE WIN TECHNOLOGY (SHENZHEN) CO.LTD.
- YUN-YEN LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laminate for a Printed Circuit Board
- Publication number 20250212325
- Publication date Jun 26, 2025
- Ticona LLC
- Xiaowei Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND ARTICLE MADE THEREFROM
- Publication number 20250188262
- Publication date Jun 12, 2025
- Elite Electronic Material (kunShan) Co., Ltd.
- Jun DU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ORGANIC-TO-INORGANIC BONDING METHODS AND STRUCTURES
- Publication number 20250185163
- Publication date Jun 5, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Oliver Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG AND USES OF THE SAME
- Publication number 20250176100
- Publication date May 29, 2025
- TAIWAN UNION TECHNOLOGY CORPORATION
- Jui-Hsiang TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AIR-PERMEABLE STRETCHABLE CIRCUIT WHICH CAN BE ACTIVATED BY STAMPIN...
- Publication number 20250176110
- Publication date May 29, 2025
- SOOCHOW UNIVERSITY
- Feng YAN
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Application
ALTERNATIVE FOR FR-4 MATERIAL
- Publication number 20250168976
- Publication date May 22, 2025
- Papershell AB
- Anders BREITHOLTZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORE SUBSTRATE FOR WIRING BOARDS AND METHOD FOR PRODUCING SAME, AND...
- Publication number 20250168975
- Publication date May 22, 2025
- Resonac Corporation
- Masataka NISHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIPHENYL(METH)ACRYLAMIDE-CONTAINING THERMOSETTING RESIN COMPOSITION...
- Publication number 20250163200
- Publication date May 22, 2025
- Nippon Soda Co., Ltd.
- Taiki YAMATE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION AND USES OF THE SAME
- Publication number 20250163269
- Publication date May 22, 2025
- TAIWAN UNION TECHNOLOGY CORPORATION
- TSUNG-HSIEN LIN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20250159803
- Publication date May 15, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Youngwoong Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ECO-FRIENDLY PRINTED CIRCUIT BOARD FOR HIGH TEMPERATURE AND LOW TEM...
- Publication number 20250151193
- Publication date May 8, 2025
- SANDISK TECHNOLOGIES, INC.
- Vigneshwarram Kumaresan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND PRODUCT THEREOF
- Publication number 20250136804
- Publication date May 1, 2025
- Elite Electronic Material (Zhongshan) Co., Ltd.
- Zhilong HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD DIELECTRIC MOLDING, MACHINING AND WIRE INSERTION
- Publication number 20250133654
- Publication date Apr 24, 2025
- INFINITUM ELECTRIC INC.
- Edward C. CARIGNAN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
THERMOSETTING COMPOSITIONS, CURED COMPOSITIONS, AND PREPREGS AND LA...
- Publication number 20250115751
- Publication date Apr 10, 2025
- Isola USA Corp.
- Teck Kai Wong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION
- Publication number 20250084205
- Publication date Mar 13, 2025
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki IGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD SUBSTRATE, PRINTED WIRING BOARD, AND MULTILAYE...
- Publication number 20250071894
- Publication date Feb 27, 2025
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE, FABRIC SENSOR, WEARABLE ELECTRONIC DEVICE INCLUDING TH...
- Publication number 20250063654
- Publication date Feb 20, 2025
- Yale University
- LINA SANCHEZ-BOTERO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250056721
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Cheng-Jia LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLAME-RETARDANT COMPOSITION
- Publication number 20250051645
- Publication date Feb 13, 2025
- Chang Chun Plastics Co., Ltd.
- An-Pang TU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COPPER CLAD LAMINATE AND USES OF THE SAME
- Publication number 20250056720
- Publication date Feb 13, 2025
- TAIWAN UNION TECHNOLOGY CORPORATION
- Jui-Hsiang TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURABLE POLYMER, CURABLE COMPOSITION, PREPREG, MULTILAYER BODY, MET...
- Publication number 20250043043
- Publication date Feb 6, 2025
- AGC Inc.
- Kazumi HASHIMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ULTRATHIN COMPOSITE DIELECTRICS FOR USE IN PRINTED CIRCUIT BOARDS
- Publication number 20250048548
- Publication date Feb 6, 2025
- AVISHTECH, INC.
- Tarun Amla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIBER WEAVE IN A PRINTED CIRCUIT BOARD SUBSTRATE
- Publication number 20250048549
- Publication date Feb 6, 2025
- Dell Products L.P.
- Sanjay Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURABLE POLYMER, CURABLE COMPOSITION, PREPREG, MULTILAYER BODY, MET...
- Publication number 20250043050
- Publication date Feb 6, 2025
- AGC Inc.
- Kazumi HASHIMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Multilayers with layers of different types

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board

Dielectric, copper clad laminate, circuit board, method for manufac...

Resin composition, cured product, prepreg, metal foil-clad laminate...

Printed wiring board and method for manufacturing printed wiring board

Preparation method for copper clad laminate having low dielectric c...

Insulating layer for multilayer printed circuit board, multilayer p...

Laminate, single-sided metal-clad laminated sheet, and multi-layer...

Circuit board structure for display device

Temporary carrier and method for manufacturing coreless substrate t...

Multilayer board and manufacturing method thereof

Component carrier with partially metallized hole using anti-plating...

Resin composition, prepreg, resin-equipped film, resin- equipped me...

Laminate, laminate with buildup layer, laminate with metal foil, an...

Printed wiring board

Fiber sheet, and layered body, circuit board and electronic board u...

Trim element comprising a functional layer made of carbon material

Fluororesin composition, fluororesin sheet, laminate and substrate...

Curable compositions

Stretchable device and display panel and sensor and electronic device

Circuit board and method for manufacturing the same

Printed circuit board dielectric molding, machining and electrolyti...

Circuit board

Resin composition, prepreg, film with resin, sheet of metal foil wi...

Component carrier having a double dielectric layer and method of ma...

Glass cloth, prepreg, and printed wiring board

Flexible wiring board

Insulation structures and printed circuit board including the same

Curable resin, curable resin composition, and cured product

Circuit board

Wiring board and method for manufacturing wiring board

Patents Applicationslast 30 patents

RESIN COMPOSITION, PREPREG OBTAINED USING SAME, RESIN-COATED FILM,...

GLASS CLOTH, PREPREG, AND PRINTED WIRING BOARD

Wearable Device for Sports Headwear

RESIN COMPOSITION, PREPREG, FILM WITH RESIN, SHEET OF METAL FOIL WI...

PHOTOSENSITIVE MULTILAYER RESIN FILM, PRINTED WIRING BOARD, SEMICON...

RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND PREPARATION METHOND THEREFOR

Laminate for a Printed Circuit Board

RESIN COMPOSITION AND ARTICLE MADE THEREFROM

ORGANIC-TO-INORGANIC BONDING METHODS AND STRUCTURES

PREPREG AND USES OF THE SAME

AIR-PERMEABLE STRETCHABLE CIRCUIT WHICH CAN BE ACTIVATED BY STAMPIN...

ALTERNATIVE FOR FR-4 MATERIAL

CORE SUBSTRATE FOR WIRING BOARDS AND METHOD FOR PRODUCING SAME, AND...

DIPHENYL(METH)ACRYLAMIDE-CONTAINING THERMOSETTING RESIN COMPOSITION...

RESIN COMPOSITION AND USES OF THE SAME

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

ECO-FRIENDLY PRINTED CIRCUIT BOARD FOR HIGH TEMPERATURE AND LOW TEM...

RESIN COMPOSITION AND PRODUCT THEREOF

PRINTED CIRCUIT BOARD DIELECTRIC MOLDING, MACHINING AND WIRE INSERTION

THERMOSETTING COMPOSITIONS, CURED COMPOSITIONS, AND PREPREGS AND LA...

RESIN COMPOSITION

PRINTED WIRING BOARD SUBSTRATE, PRINTED WIRING BOARD, AND MULTILAYE...

STRETCHABLE, FABRIC SENSOR, WEARABLE ELECTRONIC DEVICE INCLUDING TH...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

FLAME-RETARDANT COMPOSITION

COPPER CLAD LAMINATE AND USES OF THE SAME

CURABLE POLYMER, CURABLE COMPOSITION, PREPREG, MULTILAYER BODY, MET...

ULTRATHIN COMPOSITE DIELECTRICS FOR USE IN PRINTED CIRCUIT BOARDS

FIBER WEAVE IN A PRINTED CIRCUIT BOARD SUBSTRATE

CURABLE POLYMER, CURABLE COMPOSITION, PREPREG, MULTILAYER BODY, MET...