Multilayers with layers of different types

Industry

CPC
H05K1/036

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/036Multilayers with layers of different types

Industries

Patents Grantslast 30 patents

Information Patent Grant
Resin composition, resin sheet, multilayer printed wiring board, an...
- Patent number 12,133,339
- Issue date Oct 29, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yune Kumazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing package substrate for mounting semiconductor d...
- Patent number 12,119,277
- Issue date Oct 15, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sock for monitoring human lower limb and foot performance
- Patent number 12,115,000
- Issue date Oct 15, 2024
- Sportscientia Pte. Ltd.
- Panayiotis Lazou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-dielectric printed circuit board
- Patent number 12,120,811
- Issue date Oct 15, 2024
- Intel Corporation
- Arvind S
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, film with resin, metal foil with resin,...
- Patent number 12,098,257
- Issue date Sep 24, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirosuke Saito
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board
- Patent number 12,101,878
- Issue date Sep 24, 2024
- LG Innotek Co., Ltd
- Dong Hwa Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer board and manufacturing method thereof
- Patent number 12,058,811
- Issue date Aug 6, 2024
- AZOTEK CO., LTD.
- Hung-Jung Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin multilayer substrate
- Patent number 12,052,818
- Issue date Jul 30, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi Kasuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 12,048,089
- Issue date Jul 23, 2024
- AT&SAustria Technologie & Systemtechnik
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-treated glass cloth, prepreg, and printed wiring board
- Patent number 12,041,727
- Issue date Jul 16, 2024
- Nitto Boseki Co., LTD
- Kazutaka Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board manufacturing apparatus
- Patent number 12,041,731
- Issue date Jul 16, 2024
- HAESUNG DS CO., LTD
- Sang Min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,036,776
- Issue date Jul 16, 2024
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electromagnetic interference shielding composite and electronic dev...
- Patent number 12,035,516
- Issue date Jul 9, 2024
- Research & Business Foundation Sungkyunkwan University
- Jae Do Nam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, film with resin, metal foil with resin,...
- Patent number 12,024,590
- Issue date Jul 2, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Mikio Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Prepreg, metal-clad laminate, and wiring board
- Patent number 12,022,611
- Issue date Jun 25, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yasunori Hoshino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for mounting electronic element, electronic device, and e...
- Patent number 12,004,293
- Issue date Jun 4, 2024
- Kyocera Corporation
- Yukio Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of printed circuit board dielectric molding and electrolytic...
- Patent number 12,004,306
- Issue date Jun 4, 2024
- INFINITUM ELECTRIC INC.
- Edward C. Carignan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Conductive film and manufacturing method thereof
- Patent number 11,991,823
- Issue date May 21, 2024
- San Fang Chemical Industry Co., Ltd.
- Chih-Yi Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,979,982
- Issue date May 7, 2024
- TANAZAWA HAKKOSHA CO., LTD.
- Keiichiro Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition, prepreg containing same, metal foi...
- Patent number 11,975,507
- Issue date May 7, 2024
- Shengyi Technology Co., Ltd.
- Zhenwen Chen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, prepreg for printed circuit and metal-coated lam...
- Patent number 11,970,591
- Issue date Apr 30, 2024
- Shengyi Technology Co., Ltd.
- Yundong Meng
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board
- Patent number 11,974,388
- Issue date Apr 30, 2024
- LG Innotek Co., Ltd
- Byeong Kyun Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to manufacture conductive anodic filament-resistant microvias
- Patent number 11,968,780
- Issue date Apr 23, 2024
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive element, resin composition for forming barrier layer...
- Patent number 11,960,208
- Issue date Apr 16, 2024
- Resonac Corporation
- Masakazu Kume
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer resin substrate, and method of manufacturing multilayer...
- Patent number 11,963,294
- Issue date Apr 16, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiro Furumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluororesin composition, fluororesin sheet, laminate and substrate...
- Patent number 11,963,297
- Issue date Apr 16, 2024
- Daikin Industries, Ltd.
- Hirokazu Komori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper-clad laminate
- Patent number 11,950,376
- Issue date Apr 2, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Toshihiro Hosoi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Laminate
- Patent number 11,946,143
- Issue date Apr 2, 2024
- Arisawa Mfg. Co., Ltd.
- Kenji Nakamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Laminate, printed wiring board, semiconductor package, and method f...
- Patent number 11,938,688
- Issue date Mar 26, 2024
- Resonac Corporation
- Noriaki Murakami
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Thermosetting composition, prepreg, metal foil-clad laminate, resin...
- Patent number 11,939,447
- Issue date Mar 26, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yoshihiro Nakazumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE...
- Publication number 20240376243
- Publication date Nov 14, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yuji NAKASHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE LAMINATE MATERIAL
- Publication number 20240381528
- Publication date Nov 14, 2024
- THE CHEMOURS COMPANY FC, LLC
- RONG LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, PREPREG USING SAME, FILM WITH RESIN, METAL FOIL...
- Publication number 20240368323
- Publication date Nov 7, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Hirosuke SAITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD OF SAME, FILM, AND LAMINATE
- Publication number 20240373550
- Publication date Nov 7, 2024
- FUJIFILM CORPORATION
- Yasuyuki SASADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE FILMS FOR MOBILE ELECTRONIC DEVICE COMPONENTS
- Publication number 20240373551
- Publication date Nov 7, 2024
- CYTEC INDUSTRIES INC.
- Nan Chen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240365467
- Publication date Oct 31, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20240357741
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Yeonkyung CHUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board Structure and Printed Circuit Board Detection...
- Publication number 20240341030
- Publication date Oct 10, 2024
- Advanced ACEBIOTEK CO., LTD.
- Yi-Ping Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE BOARD MATERIAL AND FLEXIBLE PRINTED CIRCUIT
- Publication number 20240341031
- Publication date Oct 10, 2024
- AAC MICROTECH (CHANGZHOU) CO., LTD.
- Guohui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
USE OF INORGANIC THIN NON-WOVEN DIELECTRICS IN PRINTED CIRCUIT BOARDS
- Publication number 20240341032
- Publication date Oct 10, 2024
- AVISHTECH, INC.
- Tarun Amla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD DIELECTRIC MOLDING OR MACHINING AND ELECTROLY...
- Publication number 20240334595
- Publication date Oct 3, 2024
- INFINITUM ELECTRIC INC.
- Edward C. CARIGNAN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PRINTED CIRCUIT BOARD DIELECTRIC MOLDING, MACHINING AND ELECTROLYTI...
- Publication number 20240334594
- Publication date Oct 3, 2024
- INFINITUM ELECTRIC, INC.
- Edward C. Carignan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CURABLE RESIN COMPOSITION AND CURED PRODUCT
- Publication number 20240317916
- Publication date Sep 26, 2024
- DIC CORPORATION
- Ryuichi Matsuoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240324100
- Publication date Sep 26, 2024
- AZOTEK CO., LTD.
- Hung-Jung LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
NOVEL (METH)ACRYLAMIDE POLYMER, RESIN COMPOSITION CONTAINING SAME,...
- Publication number 20240309138
- Publication date Sep 19, 2024
- Nippon Soda Co., Ltd.
- Taiki YAMATE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION AND USES THEREOF
- Publication number 20240301189
- Publication date Sep 12, 2024
- TAIWAN UNION TECHNOLOGY CORPORATION
- Jen-Chi CHIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL WITH RESIN, META...
- Publication number 20240301173
- Publication date Sep 12, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Kouichi AOKI
- B32 - LAYERED PRODUCTS
Information Patent Application
POLYISOCYANURATE-PREPREGS AND FIBER COMPOSITE COMPONENTS PRODUCED T...
- Publication number 20240301154
- Publication date Sep 12, 2024
- COVESTRO DEUTSCHLAND AG
- Xingchen Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD AND LAYERED PLATE
- Publication number 20240304462
- Publication date Sep 12, 2024
- Resonac Corporation
- Masaya TOBA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240306293
- Publication date Sep 12, 2024
- HAMILTON SUNDSTRAND CORPORATION
- Andrew Edward PAGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND APPLICATION THEREOF
- Publication number 20240287282
- Publication date Aug 29, 2024
- Shengyi Technology Co., Ltd.
- Naidong SHE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, CURED PRODUCT, SHEET-LIKE LAMINATE MATERIAL, RES...
- Publication number 20240287360
- Publication date Aug 29, 2024
- AJINOMOTO CO., INC.
- Kenji KAWAI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COMPOSITIONS CONTAINING POLYORGANOSILOXANES HAVING POLYPHENYLENE ET...
- Publication number 20240279402
- Publication date Aug 22, 2024
- Wacker Chemie AG
- Frank SANDMEYER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240284604
- Publication date Aug 22, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Myungju Gi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB STACK WITH EMBEDDED COMPONENT PACKAGE AND SINTERED VIAS
- Publication number 20240276637
- Publication date Aug 15, 2024
- Microchip Technology Caldicot Limited
- George Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO LIGHT-EMITTING PACKAGE
- Publication number 20240268019
- Publication date Aug 8, 2024
- Lextar Electronics Corporation
- Hsin-Lun SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
- Publication number 20240260183
- Publication date Aug 1, 2024
- SAN FANG CHEMICAL INDUSTRY CO., LTD.
- CHIH-YI LIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PREPREG, LAMINATED PLATE, METAL-CLAD LAMINATED PLATE, PRINTED WIRIN...
- Publication number 20240247120
- Publication date Jul 25, 2024
- Shunsuke TONOUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20240244744
- Publication date Jul 18, 2024
- TANAZAWA HAKKOSHA CO., LTD.
- Keiichiro YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SUBSTRATE
- Publication number 20240237199
- Publication date Jul 11, 2024
- LG Innotek Co., Ltd.
- Heun PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Multilayers with layers of different types

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Resin composition, resin sheet, multilayer printed wiring board, an...

Method for producing package substrate for mounting semiconductor d...

Sock for monitoring human lower limb and foot performance

Multi-dielectric printed circuit board

Resin composition, prepreg, film with resin, metal foil with resin,...

Circuit board

Multilayer board and manufacturing method thereof

Resin multilayer substrate

Laminated component carrier with a thermoplastic structure

Surface-treated glass cloth, prepreg, and printed wiring board

Multilayer circuit board manufacturing apparatus

Resin multilayer substrate and method for manufacturing resin multi...

Electromagnetic interference shielding composite and electronic dev...

Resin composition, prepreg, film with resin, metal foil with resin,...

Prepreg, metal-clad laminate, and wiring board

Substrate for mounting electronic element, electronic device, and e...

Method of printed circuit board dielectric molding and electrolytic...

Conductive film and manufacturing method thereof

Printed wiring board and method for manufacturing printed wiring board

Thermosetting resin composition, prepreg containing same, metal foi...

Resin composition, prepreg for printed circuit and metal-coated lam...

Circuit board

Method to manufacture conductive anodic filament-resistant microvias

Photosensitive element, resin composition for forming barrier layer...

Multilayer resin substrate, and method of manufacturing multilayer...

Fluororesin composition, fluororesin sheet, laminate and substrate...

Copper-clad laminate

Laminate

Laminate, printed wiring board, semiconductor package, and method f...

Thermosetting composition, prepreg, metal foil-clad laminate, resin...

Patents Applicationslast 30 patents

RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE...

FLEXIBLE LAMINATE MATERIAL

RESIN COMPOSITION, PREPREG USING SAME, FILM WITH RESIN, METAL FOIL...

WIRING BOARD, MANUFACTURING METHOD OF SAME, FILM, AND LAMINATE

COMPOSITE FILMS FOR MOBILE ELECTRONIC DEVICE COMPONENTS

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME

Printed Circuit Board Structure and Printed Circuit Board Detection...

COMPOSITE BOARD MATERIAL AND FLEXIBLE PRINTED CIRCUIT

USE OF INORGANIC THIN NON-WOVEN DIELECTRICS IN PRINTED CIRCUIT BOARDS

PRINTED CIRCUIT BOARD DIELECTRIC MOLDING OR MACHINING AND ELECTROLY...

PRINTED CIRCUIT BOARD DIELECTRIC MOLDING, MACHINING AND ELECTROLYTI...

CURABLE RESIN COMPOSITION AND CURED PRODUCT

MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF

NOVEL (METH)ACRYLAMIDE POLYMER, RESIN COMPOSITION CONTAINING SAME,...

RESIN COMPOSITION AND USES THEREOF

THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL WITH RESIN, META...

POLYISOCYANURATE-PREPREGS AND FIBER COMPOSITE COMPONENTS PRODUCED T...

METHOD FOR MANUFACTURING WIRING BOARD AND LAYERED PLATE

PRINTED CIRCUIT BOARD

RESIN COMPOSITION AND APPLICATION THEREOF

RESIN COMPOSITION, CURED PRODUCT, SHEET-LIKE LAMINATE MATERIAL, RES...

COMPOSITIONS CONTAINING POLYORGANOSILOXANES HAVING POLYPHENYLENE ET...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

PCB STACK WITH EMBEDDED COMPONENT PACKAGE AND SINTERED VIAS

MICRO LIGHT-EMITTING PACKAGE

CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

PREPREG, LAMINATED PLATE, METAL-CLAD LAMINATED PLATE, PRINTED WIRIN...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

ELECTRONIC SUBSTRATE