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Multilayers with layers of different types
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H05K1/036
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Parent Industries
H
ELECTRICITY
H05
Electric techniques
H05K
PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K1/00
Printed circuits
Current Industry
H05K1/036
Multilayers with layers of different types
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Patents Grants
last 30 patents
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Patent Grant
Printed wiring board and method for manufacturing printed wiring board
Patent number
11,979,982
Issue date
May 7, 2024
TANAZAWA HAKKOSHA CO., LTD.
Keiichiro Yamamoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thermosetting resin composition, prepreg containing same, metal foi...
Patent number
11,975,507
Issue date
May 7, 2024
Shengyi Technology Co., Ltd.
Zhenwen Chen
B32 - LAYERED PRODUCTS
Information
Patent Grant
Resin composition, prepreg for printed circuit and metal-coated lam...
Patent number
11,970,591
Issue date
Apr 30, 2024
Shengyi Technology Co., Ltd.
Yundong Meng
B32 - LAYERED PRODUCTS
Information
Patent Grant
Circuit board
Patent number
11,974,388
Issue date
Apr 30, 2024
LG Innotek Co., Ltd
Byeong Kyun Choi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method to manufacture conductive anodic filament-resistant microvias
Patent number
11,968,780
Issue date
Apr 23, 2024
International Business Machines Corporation
Kyle Indukummar Giesen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Photosensitive element, resin composition for forming barrier layer...
Patent number
11,960,208
Issue date
Apr 16, 2024
Resonac Corporation
Masakazu Kume
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer resin substrate, and method of manufacturing multilayer...
Patent number
11,963,294
Issue date
Apr 16, 2024
Murata Manufacturing Co., Ltd.
Tomohiro Furumura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Fluororesin composition, fluororesin sheet, laminate and substrate...
Patent number
11,963,297
Issue date
Apr 16, 2024
Daikin Industries, Ltd.
Hirokazu Komori
B32 - LAYERED PRODUCTS
Information
Patent Grant
Copper-clad laminate
Patent number
11,950,376
Issue date
Apr 2, 2024
Mitsui Mining & Smelting Co., Ltd.
Toshihiro Hosoi
B32 - LAYERED PRODUCTS
Information
Patent Grant
Laminate
Patent number
11,946,143
Issue date
Apr 2, 2024
Arisawa Mfg. Co., Ltd.
Kenji Nakamura
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Laminate, printed wiring board, semiconductor package, and method f...
Patent number
11,938,688
Issue date
Mar 26, 2024
Resonac Corporation
Noriaki Murakami
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Thermosetting composition, prepreg, metal foil-clad laminate, resin...
Patent number
11,939,447
Issue date
Mar 26, 2024
Mitsubishi Gas Chemical Company, Inc.
Yoshihiro Nakazumi
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Method for manufacturing multilayer substrate and multilayer substrate
Patent number
11,924,980
Issue date
Mar 5, 2024
Murata Manufacturing Co., Ltd.
Yusuke Kamitsubo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Fluoride-based resin prepreg and circuit substrate using the same
Patent number
11,903,127
Issue date
Feb 13, 2024
Nan Ya Plastics Corporation
Te-Chao Liao
B32 - LAYERED PRODUCTS
Information
Patent Grant
Structure for embedding and packaging multiple devices by layer and...
Patent number
11,903,133
Issue date
Feb 13, 2024
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board substrate comprising a coated boron nitride
Patent number
11,895,768
Issue date
Feb 6, 2024
ROGERS CORPORATION
Eui Kyoon Kim
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Metal-clad laminate, printed circuit board, and method of manufactu...
Patent number
11,889,623
Issue date
Jan 30, 2024
Kaneka Corporation
Shusuke Yoshihara
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Continuous interconnects between heterogeneous materials
Patent number
11,882,653
Issue date
Jan 23, 2024
Liquid Wire Inc.
Mark William Ronay
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Laminate, metal foil-clad laminate, laminate having patterned metal...
Patent number
11,877,396
Issue date
Jan 16, 2024
Mitsubishi Gas Chemical Company, Inc.
Syunsuke Hirano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper-clad laminate plate, resin-attached copper foil, and circuit...
Patent number
11,866,536
Issue date
Jan 9, 2024
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Yuki Kitai
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method for forming through-hole, and substrate for flexible printed...
Patent number
11,856,695
Issue date
Dec 26, 2023
Nippon Mektron, Ltd.
Toshihiro Higashira
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Metal-clad laminate, printed circuit board, and method for manufact...
Patent number
11,840,047
Issue date
Dec 12, 2023
Taiwan Union Technology Corporation
Shi-Ing Huang
B32 - LAYERED PRODUCTS
Information
Patent Grant
Composite and copper clad laminate made therefrom
Patent number
11,839,024
Issue date
Dec 5, 2023
DUPONT ELECTRONICS, INC.
Yu-Cheng Chen
B32 - LAYERED PRODUCTS
Information
Patent Grant
Fingerprint sensor and button combinations and methods of making same
Patent number
11,829,565
Issue date
Nov 28, 2023
Synaptics Incorporated
Brett Dunlap
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Multilayer resin substrate and method of manufacturing multilayer r...
Patent number
11,832,384
Issue date
Nov 28, 2023
Murata Manufacturing Co., Ltd.
Takahiro Baba
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Prepreg, metal-clad laminate, and wiring board
Patent number
11,820,105
Issue date
Nov 21, 2023
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Mikio Sato
B32 - LAYERED PRODUCTS
Information
Patent Grant
Package substrate manufacturing method
Patent number
11,825,607
Issue date
Nov 21, 2023
Montage Technology (Kunshan) Co., Ltd.
Meng Mei
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Resin composition and article made therefrom
Patent number
11,820,894
Issue date
Nov 21, 2023
ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD.
Teng Xu
B32 - LAYERED PRODUCTS
Information
Patent Grant
Metal-clad laminate and manufacturing method of the same
Patent number
11,818,838
Issue date
Nov 14, 2023
Taiwan Union Technology Corporation
Wen-Ren Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer printed wiring board, multilayer metal-clad laminated bo...
Patent number
11,818,835
Issue date
Nov 14, 2023
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Hiroaki Takahashi
B32 - LAYERED PRODUCTS
Patents Applications
last 30 patents
Information
Patent Application
RESIN COMPOSITION AND USES THEREOF
Publication number
20240150567
Publication date
May 9, 2024
TAIWAN UNION TECHNOLOGY CORPORATION
JEN-CHI CHIANG
B32 - LAYERED PRODUCTS
Information
Patent Application
PRINTED CIRCUIT BOARD
Publication number
20240155764
Publication date
May 9, 2024
Samsung Electro-Mechanics Co., Ltd.
Seong Ho CHOI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Glass Cloth and Method of Manufacture
Publication number
20240140863
Publication date
May 2, 2024
Shin-Etsu Chemical Co., Ltd.
Hajime ITOKAWA
B32 - LAYERED PRODUCTS
Information
Patent Application
INTERMEDIATE CIRCUIT BOARD AND INTERMEDIATE ELECTRICAL CONNECTOR
Publication number
20240147605
Publication date
May 2, 2024
HIROSE ELECTRIC CO., LTD.
Xingyu CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL
Publication number
20240147633
Publication date
May 2, 2024
DAIWA CO., LTD.
Eiji YOSHIMURA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC SUBSTRATE
Publication number
20240138058
Publication date
Apr 25, 2024
LG Innotek Co., Ltd.
Heun PARK
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD UNWOVEN FABRIC, CIRCUIT BOARD PREPREG USING SAME AND...
Publication number
20240125050
Publication date
Apr 18, 2024
DUPONT SAFETY & CONSTRUCTION, INC.
Yuhei Nishimori
D21 - PAPER-MAKING PRODUCTION OF CELLULOSE
Information
Patent Application
CIRCUIT BOARD
Publication number
20240130042
Publication date
Apr 18, 2024
Murata Manufacturing Co., Ltd.
Kumiko ISHIKAWA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
GLASS FABRIC, PREPREG, AND PRINTED CIRCUIT BOARD
Publication number
20240121894
Publication date
Apr 11, 2024
Asahi Kasei Kabushiki Kaisha
Amane HIROSE
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Biodegradable Composite Material for Electronic Devices and Electri...
Publication number
20240110057
Publication date
Apr 4, 2024
Dmitriy Khrustalev
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
THERMOSETTING RESIN COMPOSITION AND APPLICATION THEREOF
Publication number
20240110027
Publication date
Apr 4, 2024
SHENGYI TECHNOLOGY CO., LTD.
Cheng LUO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, METAL-CLAD LAMI...
Publication number
20240092958
Publication date
Mar 21, 2024
Koji MORITA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN- EQUIPPED ME...
Publication number
20240092962
Publication date
Mar 21, 2024
Panasonic Intellectual Property Management Co., Ltd.
Taichi NAKASHIMA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MODIFIED RESIN COMPOSITION, PREPARATION METHOD THEREFOR AND USE THE...
Publication number
20240059888
Publication date
Feb 22, 2024
GUANGDONG HINNO-TECH CO., LTD.
Xiaolong QI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME
Publication number
20240061537
Publication date
Feb 22, 2024
SYNAPTICS INCORPORATED
Brett Dunlap
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
LAMINATE, LAMINATE WITH BUILDUP LAYER, LAMINATE WITH METAL FOIL, AN...
Publication number
20240057252
Publication date
Feb 15, 2024
SEKISUI KASEI CO., LTD.
Koichiro OKAMOTO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT
Publication number
20240052093
Publication date
Feb 15, 2024
DIC CORPORATION
Ryuichi MATSUOKA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FLUORORESIN
Publication number
20240043614
Publication date
Feb 8, 2024
CHEMOURS-MITSUI FLUOROPRODUCTS CO., LTD.
GEN EGASHIRA
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE AND RESIN COATED COPPER...
Publication number
20240043654
Publication date
Feb 8, 2024
LG Innotek Co., Ltd.
Byeong Kyun CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRU...
Publication number
20240043635
Publication date
Feb 8, 2024
Denka Company Limited
Yusuke MASUDA
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRUD...
Publication number
20240032191
Publication date
Jan 25, 2024
Denka Company Limited
Yusuke MASUDA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
Publication number
20240032208
Publication date
Jan 25, 2024
Samsung Electro-Mechanics Co., Ltd.
Tae Hong MIN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CURABLE RESIN COMPOSITION, SEMICONDUCTOR ENCAPSULATION MATERIAL, AD...
Publication number
20230416466
Publication date
Dec 28, 2023
Shin-Etsu Chemical Co., Ltd.
Yoshihiro TSUTSUMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLUOROPLASTIC SUBSTRATE FOR HIGH-SPEED COMMUNICATIONS AND COPPER-CL...
Publication number
20230416482
Publication date
Dec 28, 2023
Shin-Etsu Chemical Co., Ltd.
Toshio Shiobara
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
WIRING CIRCUIT BOARD
Publication number
20230422397
Publication date
Dec 28, 2023
Nitto Denko Corporation
Takahiro IKEDA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGE, FOR EXAMPLE AN OPTICAL PACKAGE, FOR AN INTEGRATED CIRCUIT
Publication number
20230403791
Publication date
Dec 14, 2023
STMicroelectronics (Grenoble 2) SAS
Romain COFFY
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD TO MANUFACTURE CONDUCTIVE ANODIC FILAMENT-RESISTANT MICROVIAS
Publication number
20230397331
Publication date
Dec 7, 2023
International Business Machines Corporation
Kyle Indukummar Giesen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
POLYMER FILM WITH ADHESIVE LAYER, LAMINATE, AND METHOD FOR PRODUCIN...
Publication number
20230392053
Publication date
Dec 7, 2023
FUJIFILM CORPORATION
Genya TANAKA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD AND SUBSTRATE INCLUDING ELECTRONIC COMPONENT...
Publication number
20230354513
Publication date
Nov 2, 2023
Samsung Electro-Mechanics Co., Ltd.
Dae Jung BYUN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CONNECTORS FOR INTEGRATING CONDUCTIVE THREADS TO NON-COMPATIBLE ELE...
Publication number
20230354516
Publication date
Nov 2, 2023
Nextiles, Inc.
George L. SUN
D03 - WEAVING