Multilead component

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CPC
Y10T29/53183

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T29/00Metal working

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Y10T29/53183Multilead component

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Cable processing machine apparatus
- Patent number 12,080,981
- Issue date Sep 3, 2024
- Komax Holding AG
- Alois Conte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrations and methods of making thereof
- Patent number 12,068,231
- Issue date Aug 20, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clinch mechanism for assembling a printed circuit board with electr...
- Patent number 11,903,137
- Issue date Feb 13, 2024
- Universal Instruments Corporation
- Koenraad Alexander Gieskes
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Stacking integrated circuits containing serializer and deserializer...
- Patent number 11,894,342
- Issue date Feb 6, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component supply device and surface mounting machine
- Patent number 11,606,891
- Issue date Mar 14, 2023
- Yamaha Hatsudoki Kabushiki Kaisha
- Tomoharu Kurayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure and method for making thereof
- Patent number 11,569,208
- Issue date Jan 31, 2023
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead cutting system
- Patent number 11,570,939
- Issue date Jan 31, 2023
- FUJI CORPORATION
- Kazuya Degura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for inspecting insertion states of plurality of pins include...
- Patent number 11,547,033
- Issue date Jan 3, 2023
- Koh Young Technology Inc.
- Dae Sung Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic insertion apparatus
- Patent number 11,523,552
- Issue date Dec 6, 2022
- Delta Electronics, Inc.
- Yuan-Kun Hsiao
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Scalable semiconductor interposer integration
- Patent number 11,302,617
- Issue date Apr 12, 2022
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting component
- Patent number 11,202,374
- Issue date Dec 14, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideaki Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Information processing apparatus, mounting apparatus, information p...
- Patent number 11,039,559
- Issue date Jun 15, 2021
- FUJI CORPORATION
- Takuya Nagaishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounter
- Patent number 11,013,161
- Issue date May 18, 2021
- FUJI CORPORATION
- Daisuke Nakayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure and a method of making thereof
- Patent number 10,964,676
- Issue date Mar 30, 2021
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking integrated circuits containing serializer and deserializer...
- Patent number 10,847,499
- Issue date Nov 24, 2020
- BroadPak Corporation
- Farhang Yazdani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Component chuck device and component mounting device
- Patent number 10,687,450
- Issue date Jun 16, 2020
- FUJI CORPORATION
- Junichi Yamamuro
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Stacking integrated circuits containing serializer and deserializer...
- Patent number 10,522,516
- Issue date Dec 31, 2019
- BroadPak Corporation
- Farhang Yazdani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Scalable semiconductor interposer integration
- Patent number 10,515,886
- Issue date Dec 24, 2019
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting method and electronic component mount...
- Patent number 10,492,350
- Issue date Nov 26, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Dai Yokoyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Working apparatus and working method
- Patent number 10,327,367
- Issue date Jun 18, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Minoru Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacking integrated circuits containing serializer and deserializer...
- Patent number 10,236,275
- Issue date Mar 19, 2019
- BroadPak Corporation
- Farhang Yazdani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Insertion head, component insertion device, and component mounting...
- Patent number 10,051,744
- Issue date Aug 14, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideaki Watanabe
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Insertion head, component insertion device, and component mounting...
- Patent number 10,051,745
- Issue date Aug 14, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideaki Watanabe
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Semiconductor structure and a method of making thereof
- Patent number 10,026,720
- Issue date Jul 17, 2018
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting electronic component
- Patent number 9,992,918
- Issue date Jun 5, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideaki Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate-related-operation apparatus
- Patent number 9,913,384
- Issue date Mar 6, 2018
- Fuji Machine Mfg. Co., Ltd.
- Seigo Kodama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor interposer integration
- Patent number 9,893,004
- Issue date Feb 13, 2018
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for mounting electronic component
- Patent number 9,867,320
- Issue date Jan 9, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideaki Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive ball mounting device
- Patent number 9,832,884
- Issue date Nov 28, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chi Won Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting device for mounting multi-segmented flexible printed circu...
- Patent number 9,820,385
- Issue date Nov 14, 2017
- Samsung Display Co., Ltd.
- Joon-Sam Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE
- Publication number 20240355722
- Publication date Oct 24, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SYSTEM INTEGRATION
- Publication number 20240128238
- Publication date Apr 18, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D HETEROGENEOUS INTEGRATIONS AND METHODS OF MAKING THEREOF
- Publication number 20230041977
- Publication date Feb 9, 2023
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED SEMICONDUCTOR STRUCTURES
- Publication number 20230026177
- Publication date Jan 26, 2023
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE SEMICONDUCTOR INTEGRATION AND METHOD FOR MAKING THEREOF
- Publication number 20220293575
- Publication date Sep 15, 2022
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATIONS AND METHODS OF MAKING THEREOF
- Publication number 20220189864
- Publication date Jun 16, 2022
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING THEREOF
- Publication number 20210242185
- Publication date Aug 5, 2021
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE SEMICONDUCTOR INTEGRATION
- Publication number 20210175162
- Publication date Jun 10, 2021
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING INTEGRATED CIRCUITS CONTAINING SERIALIZER AND DESERIALIZER...
- Publication number 20210035955
- Publication date Feb 4, 2021
- BroadPak Corporation
- Farhang YAZDANI
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
SCALABLE SEMICONDUCTOR INTERPOSER INTEGRATION
- Publication number 20200144170
- Publication date May 7, 2020
- BroadPak Corporation
- Farhang YAZDANI
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
SCALABLE SEMICONDUCTOR INTERPOSER INTEGRATION
- Publication number 20180068938
- Publication date Mar 8, 2018
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR PRECISE ASSEMBLY OF LIGHT RECEIVER ON SUBSTRATE
- Publication number 20140215814
- Publication date Aug 7, 2014
- CHIH-CHEN LAI
- F21 - LIGHTING
Information Patent Application
MOUNTING HEAD AND COMPONENT MOUNTING APPARATUS
- Publication number 20140215812
- Publication date Aug 7, 2014
- PANASONIC CORPORATION
- Shinji Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUID STORAGE AND DISPENSING SYSTEM INCLUDING DYNAMIC FLUID MONITOR...
- Publication number 20140041440
- Publication date Feb 13, 2014
- Advanced Technology Materials, Inc.
- James DIETZ
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE-RELATED-OPERATION PERFORMING APPARATUS AND SUBSTRATE-RELA...
- Publication number 20140026410
- Publication date Jan 30, 2014
- FUJI MACHINE MFG. CO., LTD.
- Seigo Kodama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE BOND SYSTEM
- Publication number 20130232775
- Publication date Sep 12, 2013
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHIH-CHEN LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PLACING A COMPONENT ON A SUBSTRATE
- Publication number 20130097835
- Publication date Apr 25, 2013
- Johannes Hubertus Antonius Van de Rijdt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PIN ADJUSTER FOR ELECTRONIC COMPONENT
- Publication number 20130067736
- Publication date Mar 21, 2013
- ASKEY COMPUTER CORP.
- KUO-CHAN PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin Foil Semiconductor Package
- Publication number 20130019469
- Publication date Jan 24, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS, COATING APPARATUS, MOUNTING METHOD, COATING MET...
- Publication number 20130014386
- Publication date Jan 17, 2013
- SONY CORPORATION
- Hiroshi Baba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING APPARATUS
- Publication number 20130008019
- Publication date Jan 10, 2013
- Juki Corporation
- Tomotaka Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MO...
- Publication number 20120317802
- Publication date Dec 20, 2012
- PANASONIC CORPORATION
- Shinji Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR DELIVERING SEMICONDUCTOR COMPONENTS TO A SUBSTRATE DU...
- Publication number 20120301251
- Publication date Nov 29, 2012
- ASM Technology Singapore Pte Ltd
- Kui Kam LAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT MOUNTING APPARATUS AND SUBSTRATE CONVEYANCE METHOD IN COM...
- Publication number 20120272511
- Publication date Nov 1, 2012
- PANASONIC CORPORATION
- Takeyuki Kawase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT SUPPLYING APPARATUS AND SURFACE MOUNTING APPARATUS
- Publication number 20120266457
- Publication date Oct 25, 2012
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Naoki Hanamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING DEVICE AND SUBSTRATE MANUFACTURING METHOD
- Publication number 20120246929
- Publication date Oct 4, 2012
- SONY CORPORATION
- Takeshi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUCTION NOZZLE, MOUNTING APPARATUS, METHOD FOR MOUNTING ELECTRONIC...
- Publication number 20120246927
- Publication date Oct 4, 2012
- SONY CORPORATION
- Tetsuya Kano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING APPARATUS, ELECTRONIC COMPONENT PLACEMENT METHOD, AND SUBS...
- Publication number 20120246928
- Publication date Oct 4, 2012
- SONY CORPORATION
- Keisuke Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEST CARRIER
- Publication number 20120235699
- Publication date Sep 20, 2012
- Advantest Corporation
- Kiyoto Nakamura
- G01 - MEASURING TESTING
Information Patent Application
REPROGRAMMABLE CIRCUIT BOARD WITH ALIGNMENT-INSENSITIVE SUPPORT FOR...
- Publication number 20120206889
- Publication date Aug 16, 2012
- Richard Norman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Multilead component

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cable processing machine apparatus

3D integrations and methods of making thereof

Clinch mechanism for assembling a printed circuit board with electr...

Stacking integrated circuits containing serializer and deserializer...

Component supply device and surface mounting machine

Semiconductor structure and method for making thereof

Lead cutting system

Method for inspecting insertion states of plurality of pins include...

Automatic insertion apparatus

Scalable semiconductor interposer integration

Method of mounting component

Information processing apparatus, mounting apparatus, information p...

Electronic component mounter

Semiconductor structure and a method of making thereof

Stacking integrated circuits containing serializer and deserializer...

Component chuck device and component mounting device

Stacking integrated circuits containing serializer and deserializer...

Scalable semiconductor interposer integration

Electronic component mounting method and electronic component mount...

Working apparatus and working method

Stacking integrated circuits containing serializer and deserializer...

Insertion head, component insertion device, and component mounting...

Insertion head, component insertion device, and component mounting...

Semiconductor structure and a method of making thereof

Method for mounting electronic component

Substrate-related-operation apparatus

Semiconductor interposer integration

Apparatus for mounting electronic component

Conductive ball mounting device

Mounting device for mounting multi-segmented flexible printed circu...

Patents Applicationslast 30 patents

APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE

3D SYSTEM INTEGRATION

3D HETEROGENEOUS INTEGRATIONS AND METHODS OF MAKING THEREOF

ENHANCED SEMICONDUCTOR STRUCTURES

SECURE SEMICONDUCTOR INTEGRATION AND METHOD FOR MAKING THEREOF

3D INTEGRATIONS AND METHODS OF MAKING THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING THEREOF

SECURE SEMICONDUCTOR INTEGRATION

STACKING INTEGRATED CIRCUITS CONTAINING SERIALIZER AND DESERIALIZER...

SCALABLE SEMICONDUCTOR INTERPOSER INTEGRATION

SCALABLE SEMICONDUCTOR INTERPOSER INTEGRATION

DEVICE FOR PRECISE ASSEMBLY OF LIGHT RECEIVER ON SUBSTRATE

MOUNTING HEAD AND COMPONENT MOUNTING APPARATUS

FLUID STORAGE AND DISPENSING SYSTEM INCLUDING DYNAMIC FLUID MONITOR...

SUBSTRATE-RELATED-OPERATION PERFORMING APPARATUS AND SUBSTRATE-RELA...

DIE BOND SYSTEM

METHOD FOR PLACING A COMPONENT ON A SUBSTRATE

PIN ADJUSTER FOR ELECTRONIC COMPONENT

Thin Foil Semiconductor Package

MOUNTING APPARATUS, COATING APPARATUS, MOUNTING METHOD, COATING MET...

ELECTRONIC COMPONENT MOUNTING APPARATUS

ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MO...

APPARATUS FOR DELIVERING SEMICONDUCTOR COMPONENTS TO A SUBSTRATE DU...

COMPONENT MOUNTING APPARATUS AND SUBSTRATE CONVEYANCE METHOD IN COM...

COMPONENT SUPPLYING APPARATUS AND SURFACE MOUNTING APPARATUS

COMPONENT MOUNTING DEVICE AND SUBSTRATE MANUFACTURING METHOD

SUCTION NOZZLE, MOUNTING APPARATUS, METHOD FOR MOUNTING ELECTRONIC...

MOUNTING APPARATUS, ELECTRONIC COMPONENT PLACEMENT METHOD, AND SUBS...

TEST CARRIER

REPROGRAMMABLE CIRCUIT BOARD WITH ALIGNMENT-INSENSITIVE SUPPORT FOR...