Multiple layers

Industry

CPC
H01L21/76832

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76832Multiple layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor structure comprising a gap an...
- Patent number 12,368,074
- Issue date Jul 22, 2025
- CHANGXI MEMORY TECHNOLOGIES, INC.
- Ting Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and methods of forming the same
- Patent number 12,368,076
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures for reducing electrical shorts and methods of fo...
- Patent number 12,368,097
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming dielectric sidewall and bottom dielectric isolation in Fork...
- Patent number 12,363,977
- Issue date Jul 15, 2025
- International Business Machines Corporation
- Julien Frougier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembled dielectric on metal rie lines to increase reliability
- Patent number 12,362,231
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating inductor module
- Patent number 12,363,921
- Issue date Jul 15, 2025
- United Microelectronics Corporation
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of performing chemical-mechanical polishing process in semi...
- Patent number 12,362,233
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring structure
- Patent number 12,354,975
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electron migration control in interconnect structures
- Patent number 12,354,907
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of etching metals in semiconductor devices
- Patent number 12,354,881
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer features
- Patent number 12,354,959
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 12,347,772
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of forming the same
- Patent number 12,347,726
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect line for semiconductor device
- Patent number 12,341,057
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,341,097
- Issue date Jun 24, 2025
- Samsung Electronics Co., Ltd.
- Sangshin Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having air cavity
- Patent number 12,341,059
- Issue date Jun 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,334,395
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure including graphite and method forming same
- Patent number 12,334,397
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory structure including low dielectric constant capping layer
- Patent number 12,328,868
- Issue date Jun 10, 2025
- NANYA TECHNOLOGY CORPORATION
- Jhen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with liner structure
- Patent number 12,315,808
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,315,734
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Li-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and manufacturing method thereof
- Patent number 12,315,761
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having high breakdown voltage etch-stop layer
- Patent number 12,315,812
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device including porous dielect...
- Patent number 12,308,245
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Jongcheon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for semiconductor device having gate spacer pr...
- Patent number 12,308,238
- Issue date May 20, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chih Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate stack treatment
- Patent number 12,300,549
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chandrashekhar Prakash Savant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with self-aligned vias
- Patent number 12,293,944
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface oxidation control of metal gates using capping layer
- Patent number 12,293,916
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,288,715
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition method to form air gaps
- Patent number 12,283,520
- Issue date Apr 22, 2025
- ASM IP Holding B.V.
- Chiyu Zhu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING CONTACT FEATURES IN FIELD-EFFECT TRANSISTORS
- Publication number 20250241052
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Hsiung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE STACK TREATMENT
- Publication number 20250241055
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chandrashekhar Prakash Savant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELF-ALIGNED VIAS
- Publication number 20250239487
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250233016
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- JHENG-HONG JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250218865
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hua CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20250210524
- Publication date Jun 26, 2025
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210413
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250192036
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Anthony Dongick LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BONDING PATTERN
- Publication number 20250183098
- Publication date Jun 5, 2025
- SK HYNIX INC.
- Byung Wook BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING ACTIVE CONTACTS AND SUPPORT CONTACTS
- Publication number 20250174558
- Publication date May 29, 2025
- Micron Technology, Inc.
- S M Istiaque Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELL, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF MEMORY...
- Publication number 20250176442
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149438
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ren WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH EMBEDDED BACKSIDE CAPACITORS
- Publication number 20250142901
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND LOW PARAS...
- Publication number 20250140605
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250140608
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsia-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING...
- Publication number 20250140646
- Publication date May 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING...
- Publication number 20250140651
- Publication date May 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE
- Publication number 20250132247
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Lin TENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132200
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Lung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250133800
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hwei-Jay CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED SURFACE PRE-TREATMENT FOR SEMICONDUCTOR DEVICE BONDING STR...
- Publication number 20250125194
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Amram Eitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20250118597
- Publication date Apr 10, 2025
- NANYA TECHNOLOGY CORPORATION
- Li Han LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118594
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...
- Publication number 20250118595
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYERS FOR INTERCONNECTS
- Publication number 20250112156
- Publication date Apr 3, 2025
- Intel Corporation
- Gowtham Sriram JAWAHARRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250112088
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH STOP LAYERS
- Publication number 20250105055
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ren Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-NITRIDE TRANSISTOR WITH TOP AND BOTTOM CAP LAYERS WITH ETCH STOP
- Publication number 20250098274
- Publication date Mar 20, 2025
- Finwave Semiconductor, Inc.
- Dongfei Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME
- Publication number 20250089273
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250087579
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Sanghyun Park
- H01 - BASIC ELECTRIC ELEMENTS

Multiple layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of semiconductor structure comprising a gap an...

Interconnect structure and methods of forming the same

Contact structures for reducing electrical shorts and methods of fo...

Forming dielectric sidewall and bottom dielectric isolation in Fork...

Self-assembled dielectric on metal rie lines to increase reliability

Method for fabricating inductor module

Methods of performing chemical-mechanical polishing process in semi...

Guard ring structure

Electron migration control in interconnect structures

Methods of etching metals in semiconductor devices

Redistribution layer features

Semiconductor devices and methods of manufacturing thereof

Interconnect structures and methods of forming the same

Interconnect line for semiconductor device

Semiconductor devices

Semiconductor device having air cavity

Semiconductor structure and method for forming the same

Interconnect structure including graphite and method forming same

Memory structure including low dielectric constant capping layer

Semiconductor device with liner structure

Method for manufacturing semiconductor device

Interconnection structure and manufacturing method thereof

Semiconductor structure having high breakdown voltage etch-stop layer

Method of fabricating semiconductor device including porous dielect...

Method and structure for semiconductor device having gate spacer pr...

Gate stack treatment

Semiconductor device with self-aligned vias

Surface oxidation control of metal gates using capping layer

Semiconductor device and manufacturing method thereof

Selective deposition method to form air gaps

Patents Applicationslast 30 patents

METHODS OF FORMING CONTACT FEATURES IN FIELD-EFFECT TRANSISTORS

GATE STACK TREATMENT

SEMICONDUCTOR DEVICE WITH SELF-ALIGNED VIAS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MULTI-LAYER LINE STRUCTURE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BONDING PATTERN

MICROELECTRONIC DEVICES INCLUDING ACTIVE CONTACTS AND SUPPORT CONTACTS

MEMORY CELL, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF MEMORY...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES WITH EMBEDDED BACKSIDE CAPACITORS

INTERCONNECT STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND LOW PARAS...

INTEGRATED CIRCUIT STRUCTURE

SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING...

SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING...

INTERCONNECTION STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

IMPROVED SURFACE PRE-TREATMENT FOR SEMICONDUCTOR DEVICE BONDING STR...

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...

BARRIER LAYERS FOR INTERCONNECTS

SEMICONDUCTOR STRUCTURE

ETCH STOP LAYERS

III-NITRIDE TRANSISTOR WITH TOP AND BOTTOM CAP LAYERS WITH ETCH STOP

INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE