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LOW-STRESS PASSIVATION LAYER
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Publication number 20240136291
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Publication date Apr 25, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Hsiang-Ku SHEN
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240112949
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Publication date Apr 4, 2024
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Samsung Electronics Co., Ltd.
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Sung Jin KANG
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H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED CIRCUIT DEVICE
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Publication number 20240096796
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Publication date Mar 21, 2024
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Samsung Electronics Co., Ltd.
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Yongjin KIM
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H01 - BASIC ELECTRIC ELEMENTS
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MULTI-LAYER LINE STRUCTURE
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Publication number 20240088040
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Publication date Mar 14, 2024
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DAI NIPPON PRINTING CO., LTD.
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Hiroshi Kudo
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H01 - BASIC ELECTRIC ELEMENTS
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DUAL ETCH-STOP LAYER STRUCTURE
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Publication number 20240063057
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Publication date Feb 22, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Hsi-Wen Tien
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR STRUCTURE
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Publication number 20240047272
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Publication date Feb 8, 2024
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Taiwan Semiconductor Manufacturing company Ltd.
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I-MING CHANG
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240047579
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Publication date Feb 8, 2024
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Samsung Electronics Co., Ltd.
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Seonhaeng LEE
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H01 - BASIC ELECTRIC ELEMENTS
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SELF-ALIGNED CONTACT STRUCTURES
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Publication number 20240021707
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Publication date Jan 18, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Li-Zhen Yu
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H01 - BASIC ELECTRIC ELEMENTS
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