Multiple layers

Industry

CPC
H01L21/76832

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76832Multiple layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with liner structure
- Patent number 12,315,808
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,315,734
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Li-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and manufacturing method thereof
- Patent number 12,315,761
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having high breakdown voltage etch-stop layer
- Patent number 12,315,812
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device including porous dielect...
- Patent number 12,308,245
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Jongcheon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for semiconductor device having gate spacer pr...
- Patent number 12,308,238
- Issue date May 20, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chih Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate stack treatment
- Patent number 12,300,549
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chandrashekhar Prakash Savant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with self-aligned vias
- Patent number 12,293,944
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface oxidation control of metal gates using capping layer
- Patent number 12,293,916
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,288,715
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition method to form air gaps
- Patent number 12,283,520
- Issue date Apr 22, 2025
- ASM IP Holding B.V.
- Chiyu Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,283,481
- Issue date Apr 22, 2025
- United Microelectronics Corp.
- Yu Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manfacturing semiconductor device for reducing partcle-i...
- Patent number 12,278,142
- Issue date Apr 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Li-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming contact features in field-effect transistors
- Patent number 12,272,605
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,272,561
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Li-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removing polymer through treatment
- Patent number 12,272,595
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,261,117
- Issue date Mar 25, 2025
- Fuji Electric Co., Ltd.
- Masaharu Yamaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer line structure
- Patent number 12,255,145
- Issue date Mar 18, 2025
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,255,095
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Kai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reduced contact resistance and methods of...
- Patent number 12,255,096
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,255,139
- Issue date Mar 18, 2025
- Samsung Electronics Co., Ltd.
- Anthony Dongick Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cap structure for interconnect dielectrics and methods of fabrication
- Patent number 12,249,577
- Issue date Mar 11, 2025
- Intel Corporation
- Shashi Vyas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection structures for bonded wafers
- Patent number 12,243,772
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ssu-Chiang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 12,243,779
- Issue date Mar 4, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Shuangshuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including insulation patterns with different...
- Patent number 12,237,385
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Bongkwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked capacitor structure and manufacturing method thereof
- Patent number 12,230,670
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,230,567
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure having air gap and methods of formin...
- Patent number 12,230,537
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including active contacts and support conta...
- Patent number 12,224,240
- Issue date Feb 11, 2025
- Micron Technology, Inc.
- S M Istiaque Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 12,218,005
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsia-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BONDING PATTERN
- Publication number 20250183098
- Publication date Jun 5, 2025
- SK HYNIX INC.
- Byung Wook BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING ACTIVE CONTACTS AND SUPPORT CONTACTS
- Publication number 20250174558
- Publication date May 29, 2025
- Micron Technology, Inc.
- S M Istiaque Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELL, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF MEMORY...
- Publication number 20250176442
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149438
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ren WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH EMBEDDED BACKSIDE CAPACITORS
- Publication number 20250142901
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND LOW PARAS...
- Publication number 20250140605
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250140608
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsia-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING...
- Publication number 20250140646
- Publication date May 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING...
- Publication number 20250140651
- Publication date May 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132200
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Lung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE
- Publication number 20250132247
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Lin TENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250133800
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hwei-Jay CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED SURFACE PRE-TREATMENT FOR SEMICONDUCTOR DEVICE BONDING STR...
- Publication number 20250125194
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Amram Eitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20250118597
- Publication date Apr 10, 2025
- NANYA TECHNOLOGY CORPORATION
- Li Han LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118594
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...
- Publication number 20250118595
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYERS FOR INTERCONNECTS
- Publication number 20250112156
- Publication date Apr 3, 2025
- Intel Corporation
- Gowtham Sriram JAWAHARRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250112088
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH STOP LAYERS
- Publication number 20250105055
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ren Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-NITRIDE TRANSISTOR WITH TOP AND BOTTOM CAP LAYERS WITH ETCH STOP
- Publication number 20250098274
- Publication date Mar 20, 2025
- Finwave Semiconductor, Inc.
- Dongfei Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME
- Publication number 20250089273
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250087579
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Sanghyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20250087535
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- HWEI-JAY CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE
- Publication number 20250079295
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250069989
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chih HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING FERROELECTRIC CAPACITOR AND METHOD F...
- Publication number 20250072003
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING LOW-RESISTANCE VIA CONTACT
- Publication number 20250054858
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Kai Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING CAP LAYER OF TWO-DIMENSIONAL MATE...
- Publication number 20250054810
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250046653
- Publication date Feb 6, 2025
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA FORMATION TO ENLARGE ELECTROCHEMICAL PLATING...
- Publication number 20250038076
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Ling Shih
- H01 - BASIC ELECTRIC ELEMENTS

Multiple layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with liner structure

Method for manufacturing semiconductor device

Interconnection structure and manufacturing method thereof

Semiconductor structure having high breakdown voltage etch-stop layer

Method of fabricating semiconductor device including porous dielect...

Method and structure for semiconductor device having gate spacer pr...

Gate stack treatment

Semiconductor device with self-aligned vias

Surface oxidation control of metal gates using capping layer

Semiconductor device and manufacturing method thereof

Selective deposition method to form air gaps

Method for manufacturing semiconductor device

Method for manfacturing semiconductor device for reducing partcle-i...

Methods of forming contact features in field-effect transistors

Method for manufacturing semiconductor device

Removing polymer through treatment

Semiconductor device and method of manufacturing the same

Multi-layer line structure

Semiconductor structure and manufacturing method thereof

Semiconductor device with reduced contact resistance and methods of...

Semiconductor devices

Cap structure for interconnect dielectrics and methods of fabrication

Protection structures for bonded wafers

Semiconductor structure and method for manufacturing semiconductor...

Semiconductor devices including insulation patterns with different...

Stacked capacitor structure and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Semiconductor device structure having air gap and methods of formin...

Microelectronic devices including active contacts and support conta...

Integrated circuit device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BONDING PATTERN

MICROELECTRONIC DEVICES INCLUDING ACTIVE CONTACTS AND SUPPORT CONTACTS

MEMORY CELL, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF MEMORY...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES WITH EMBEDDED BACKSIDE CAPACITORS

INTERCONNECT STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND LOW PARAS...

INTEGRATED CIRCUIT STRUCTURE

SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING...

SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

INTERCONNECTION STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

IMPROVED SURFACE PRE-TREATMENT FOR SEMICONDUCTOR DEVICE BONDING STR...

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...

BARRIER LAYERS FOR INTERCONNECTS

SEMICONDUCTOR STRUCTURE

ETCH STOP LAYERS

III-NITRIDE TRANSISTOR WITH TOP AND BOTTOM CAP LAYERS WITH ETCH STOP

INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

INTERCONNECTION STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE INCLUDING FERROELECTRIC CAPACITOR AND METHOD F...

SEMICONDUCTOR STRUCTURE HAVING LOW-RESISTANCE VIA CONTACT

SEMICONDUCTOR STRUCTURE INCLUDING CAP LAYER OF TWO-DIMENSIONAL MATE...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

THROUGH-SUBSTRATE VIA FORMATION TO ENLARGE ELECTROCHEMICAL PLATING...