Multiple masking steps

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H01L2224/11902

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11902Multiple masking steps

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,037,897
- Issue date Jun 15, 2021
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,510,700
- Issue date Dec 17, 2019
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for assembly of semiconductor structures in...
- Patent number 10,396,269
- Issue date Aug 27, 2019
- Massachusetts Institute of Technology
- William D. Oliver
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Interconnect structure and semiconductor structures for assembly of...
- Patent number 10,242,968
- Issue date Mar 26, 2019
- Massachusetts Institute of Technology
- Rabindra N. Das
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnect structures and methods for fabricating interconnect st...
- Patent number 10,121,754
- Issue date Nov 6, 2018
- Massachusetts Institute of Technology
- William D. Oliver
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reducing solder pad topology differences by planarization
- Patent number 9,935,069
- Issue date Apr 3, 2018
- Lumileds LLC
- Jipu Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming pillar bumps on semiconductor wafers
- Patent number 9,831,201
- Issue date Nov 28, 2017
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,685,419
- Issue date Jun 20, 2017
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with solder ball revealed through laser
- Patent number 9,570,413
- Issue date Feb 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,466,583
- Issue date Oct 11, 2016
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal contact for semiconductor device
- Patent number 9,379,077
- Issue date Jun 28, 2016
- Nantong Fujitsu Microelectronics Co., Ltd.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-component integrated circuit contacts
- Patent number 9,337,162
- Issue date May 10, 2016
- Micron Technology, Inc.
- William M. Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip with pyramid or cone-shaped conductive pads...
- Patent number 9,269,683
- Issue date Feb 23, 2016
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,123,628
- Issue date Sep 1, 2015
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,053,991
- Issue date Jun 9, 2015
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder collapse free bumping process of semiconductor device
- Patent number 8,980,739
- Issue date Mar 17, 2015
- Samsung Electronics Co., Ltd.
- Moon-gi Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die terminal
- Patent number 8,970,031
- Issue date Mar 3, 2015
- HSIO Technologies, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump, method for forming the bump, and method for mounting substrat...
- Patent number 8,962,471
- Issue date Feb 24, 2015
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,922,010
- Issue date Dec 30, 2014
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming protective coating over...
- Patent number 8,912,650
- Issue date Dec 16, 2014
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for fabricating the same
- Patent number 8,836,146
- Issue date Sep 16, 2014
- QUALCOMM Incorporated
- Chien-Kang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molded solder process for forming solder bumps on substrates
- Patent number 8,820,612
- Issue date Sep 2, 2014
- International Business Machines Corporation
- Claudius Feger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit chip with pyramid or cone-shaped conductive pads...
- Patent number 8,766,439
- Issue date Jul 1, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional wafer stacking with vertical interconnects
- Patent number 8,741,737
- Issue date Jun 3, 2014
- Board of Regents, The University of Texas System
- Dan O. Popa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming an integrated circuit device
- Patent number 8,716,123
- Issue date May 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and manufacturing method thereof
- Patent number 8,697,566
- Issue date Apr 15, 2014
- ChipMOS Technologies Inc.
- Chung-Pang Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mock bump system for flip chip integrated circuits
- Patent number 8,633,586
- Issue date Jan 21, 2014
- Stats Chippac Ltd.
- Oh Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making conductive post with footing profile
- Patent number 8,598,030
- Issue date Dec 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal face contact structure and method of making same
- Patent number 8,497,578
- Issue date Jul 30, 2013
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molded solder process for forming solder bumps on substrates
- Patent number 8,496,159
- Issue date Jul 30, 2013
- International Business Machines Corporation
- Claudius Feger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device
- Publication number 20200098713
- Publication date Mar 26, 2020
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20180301429
- Publication date Oct 18, 2018
- ROHM CO., LTD.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS FOR FABRICATING INTERCONNECT ST...
- Publication number 20170133336
- Publication date May 11, 2017
- Massachusetts Institute of Technology
- William D. Oliver
- B82 - NANO-TECHNOLOGY
Information Patent Application
Semiconductor Device
- Publication number 20160336288
- Publication date Nov 17, 2016
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE WETTING PROCESS TO INCREASE SOLDER JOINT STANDOFF
- Publication number 20140362550
- Publication date Dec 11, 2014
- Leilei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20140332954
- Publication date Nov 13, 2014
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
- Publication number 20140295619
- Publication date Oct 2, 2014
- Tanaka Kikinzoku Kogyo K.K.
- TOSHINORI OGASHIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Connectors and Methods for Forming the Same
- Publication number 20140256126
- Publication date Sep 11, 2014
- Chun-Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP WITH PYRAMID OR CONE-SHAPED CONDUCTIVE PADS...
- Publication number 20140187034
- Publication date Jul 3, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, ELECTRONIC APPARATUS INCLUDING THE SAME, AND...
- Publication number 20140159235
- Publication date Jun 12, 2014
- Fujitsu Limited
- Muneyuki Odaira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140145327
- Publication date May 29, 2014
- Samsung Electronics Co., Ltd.
- Hyung-Jun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN INTEGRATED CIRCUIT DEVICE
- Publication number 20140051244
- Publication date Feb 20, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20130256881
- Publication date Oct 3, 2013
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protective Coating Over...
- Publication number 20130228919
- Publication date Sep 5, 2013
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER OR CIRCUIT BOARD AND JOINING STRUCTURE OF WAFER OR CIRCUIT BOARD
- Publication number 20130140067
- Publication date Jun 6, 2013
- Elpida Memory, Inc.
- Masakazu Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-COMPONENT INTEGRATED CIRCUIT CONTACTS
- Publication number 20130001780
- Publication date Jan 3, 2013
- Micron Technology, Inc.
- William M. Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protective Coating Over...
- Publication number 20120326297
- Publication date Dec 27, 2012
- STATS ChipPAC, Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON SUBSTRATES
- Publication number 20120305631
- Publication date Dec 6, 2012
- International Business Machines Corporation
- Claudius Feger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON SUBSTRATES
- Publication number 20120305633
- Publication date Dec 6, 2012
- International Business Machines Corporation
- Claudius Feger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER COLLAPSE FREE BUMPING PROCESS OF SEMICONDUCTOR DEVICE
- Publication number 20120295434
- Publication date Nov 22, 2012
- Samsung Electronics Co., Ltd.
- Moon-gi CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20120248605
- Publication date Oct 4, 2012
- Renesas Electronics Corporation
- Toshihide Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120153460
- Publication date Jun 21, 2012
- CHIPMOS TECHNOLOGIES INC.
- Chung-Pang Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Arrangement and a Method of Manufacturing a Substrate Arr...
- Publication number 20120126419
- Publication date May 24, 2012
- Vaidyanathan Kripesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A REFRACTORY...
- Publication number 20120115324
- Publication date May 10, 2012
- RENESAS ELECTRONICS CORPORATION
- Toshiyuki TAKEWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20120049367
- Publication date Mar 1, 2012
- Kabushiki Kaisha Toshiba
- Tatsuo MIGITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE TERMINAL
- Publication number 20120049342
- Publication date Mar 1, 2012
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR MAKING CONDUCTIVE POST WITH FOOTING PROFILE
- Publication number 20120040524
- Publication date Feb 16, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC MICROELECTRONIC DEVICE ATTACHMENT
- Publication number 20110281375
- Publication date Nov 17, 2011
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
- Publication number 20110272802
- Publication date Nov 10, 2011
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP WITH PYRAMID OR CONE-SHAPED CONDUCTIVE PADS...
- Publication number 20110140271
- Publication date Jun 16, 2011
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS

Multiple masking steps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device

Interconnect structures for assembly of semiconductor structures in...

Interconnect structure and semiconductor structures for assembly of...

Interconnect structures and methods for fabricating interconnect st...

Reducing solder pad topology differences by planarization

Methods for forming pillar bumps on semiconductor wafers

Semiconductor device

Packages with solder ball revealed through laser

Semiconductor device

Metal contact for semiconductor device

Multi-component integrated circuit contacts

Integrated circuit chip with pyramid or cone-shaped conductive pads...

Semiconductor device

Semiconductor device

Solder collapse free bumping process of semiconductor device

Semiconductor die terminal

Bump, method for forming the bump, and method for mounting substrat...

Semiconductor device

Semiconductor device and method of forming protective coating over...

Chip package and method for fabricating the same

Injection molded solder process for forming solder bumps on substrates

Integrated circuit chip with pyramid or cone-shaped conductive pads...

Three-dimensional wafer stacking with vertical interconnects

Method of forming an integrated circuit device

Bump structure and manufacturing method thereof

Mock bump system for flip chip integrated circuits

Process for making conductive post with footing profile

Terminal face contact structure and method of making same

Injection molded solder process for forming solder bumps on substrates

Patents Applicationslast 30 patents

Semiconductor Device

Semiconductor Device

INTERCONNECT STRUCTURES AND METHODS FOR FABRICATING INTERCONNECT ST...

Semiconductor Device

SELECTIVE WETTING PROCESS TO INCREASE SOLDER JOINT STANDOFF

Semiconductor Device

BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...

Electrical Connectors and Methods for Forming the Same

INTEGRATED CIRCUIT CHIP WITH PYRAMID OR CONE-SHAPED CONDUCTIVE PADS...

ELECTRONIC COMPONENT, ELECTRONIC APPARATUS INCLUDING THE SAME, AND...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD OF FORMING AN INTEGRATED CIRCUIT DEVICE

Semiconductor Device

Semiconductor Device and Method of Forming Protective Coating Over...

WAFER OR CIRCUIT BOARD AND JOINING STRUCTURE OF WAFER OR CIRCUIT BOARD

MULTI-COMPONENT INTEGRATED CIRCUIT CONTACTS

Semiconductor Device and Method of Forming Protective Coating Over...

INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON SUBSTRATES

INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON SUBSTRATES

SOLDER COLLAPSE FREE BUMPING PROCESS OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF

Substrate Arrangement and a Method of Manufacturing a Substrate Arr...

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A REFRACTORY...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DIE TERMINAL

PROCESS FOR MAKING CONDUCTIVE POST WITH FOOTING PROFILE

MAGNETIC MICROELECTRONIC DEVICE ATTACHMENT

BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...

INTEGRATED CIRCUIT CHIP WITH PYRAMID OR CONE-SHAPED CONDUCTIVE PADS...