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H01L2224/03902

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/03902Multiple masking steps

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Patents Grantslast 30 patents

Information Patent Grant
Passive component structure and manufacturing method thereof
- Patent number 9,761,555
- Issue date Sep 12, 2017
- Xintec Inc.
- Jiun-Yen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device provided with tin diffusion inhibiting layer,...
- Patent number 8,237,277
- Issue date Aug 7, 2012
- Casio Computer Co., Ltd.
- Hiroyasu Jobetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device having electrode for...
- Patent number 8,093,148
- Issue date Jan 10, 2012
- Fujitsu Semiconductor Limited
- Yutaka Makino
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP WITH PATTERNED UNDERBUMP METALLIZATION
- Publication number 20120261812
- Publication date Oct 18, 2012
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PROVIDED WITH TIN DIFFUSION INHIBITING LAYER,...
- Publication number 20110233769
- Publication date Sep 29, 2011
- CASIO COMPUTER CO., LTD.
- Hiroyasu Jobetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING ELECTRODE FOR...
- Publication number 20100081269
- Publication date Apr 1, 2010
- Fujitsu Microelectronics Limited
- Yutaka Makino
- H01 - BASIC ELECTRIC ELEMENTS