Multiple stacked thin films not being formed in openings in dielectrics

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H01L2221/1078

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

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H01L2221/1078Multiple stacked thin films not being formed in openings in dielectrics

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Patents Grantslast 30 patents

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Multiple stacked thin films not being formed in openings in dielectrics

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring board and method of manufacturing the same

Semiconductor device and its manufacturing method

Semiconductor device and its manufacturing method

Interconnection structure

Aluminum interconnection apparatus

Electrical interconnection structure and fabrication method thereof

Aluminum interconnection apparatus

Semiconductor structure and method for making same

Semiconductor device and method for making same

Semiconductor device and method for making same

Semiconductor device and method for making same

Aluminum interconnection apparatus

Lateral connection for a via-less thin film resistor

Semiconductor device and manufacturing method thereof

Subtractive metal multi-layer barrier layer for interconnect structure

Multi-layer via-less thin film resistor

Via-less thin film resistor with a dielectric cap

Semiconductor device and manufacturing method thereof

Multilayered barrier metal thin-films

Interconnection structure having oxygen trap pattern in semiconduct...

Semiconductor device having metal wirings of laminated structure

Semiconductor device and manufacturing method thereof

Wiring, display device and method of manufacturing the same

Method of manufacturing semiconductor device

Electromigration resistant aluminum-based metal interconnect structure

Semiconductor device and method for producing the same

Semiconductor device having improved metal wiring

Electromigration resistant aluminum-based metal interconnect structure

Atomic layer deposition metallic contacts, gates and diffusion barr...

Barrier metal film production apparatus, barrier metal film product...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

NANOWIRE-BASED INTERCONNECTS FOR SUB-MILLIMETER WAVE INTEGRATED CIR...

INTEGRATED ELECTRONIC DEVICE WITH A PAD STRUCTURE INCLUDING A BARRI...

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

Aluminum Interconnection Apparatus

Aluminum Interconnection Apparatus

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

VIA-LESS THIN FILM RESISTOR WITH A DIELECTRIC CAP

LATERAL CONNECTION FOR A VIA-LESS THIN FILM RESISTOR

MULTI-LAYER VIA-LESS THIN FILM RESISTOR

ELECTROMIGRATION RESISTANT ALUMINUM-BASED METAL INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICE HAVING METAL WIRINGS OF LAMINATED STRUCTURE

METHOD AND SYSTEM FOR MAKING THIN METAL FILMS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ELECTROMIGRATION RESISTANT ALUMINUM-BASED METAL INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

BARRIER METAL FILM PRODUCTION APPARATUS, BARRIER METAL FILM PRODUCT...

Semiconductor Device and Method for Making Same

WIRING, DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

BARRIER METAL FILM PRODUCTION APPARATUS, BARRIER METAL FILM PRODUCT...

TUNGSTEN LINER FOR ALUMINUM-BASED ELECTROMIGRATION RESISTANT INTERC...

INTERCONNECTION STRUCTURE HAVING OXYGEN TRAP PATTERN IN SEMICONDUCT...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Electrically Conductive Line

Method and system for making thin metal films

Electrical Interconnect Structures Having Carbon Nanotubes Therein...

SEMICONDUCTOR DEVICE HAVING METAL WIRINGS OF LAMINATED STRUCTURE