Nanoparticles

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CPC
H05K2201/0257

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/0257Nanoparticles

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods of dispensing a metallic nanoparticle composition from a no...
- Patent number 12,101,893
- Issue date Sep 24, 2024
- XTPL S.A.
- Mateusz Zając
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Ink composition, method for forming a conductive member, and conduc...
- Patent number 12,091,567
- Issue date Sep 17, 2024
- Kuprion Inc.
- Zhenggang Li
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
- Patent number 12,096,554
- Issue date Sep 17, 2024
- Xerox Corporation
- Naveen Chopra
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Boron nitride nanotube coated substrates for sintering of metallic...
- Patent number 11,993,719
- Issue date May 28, 2024
- National Research Council of Canada
- Chantal Paquet
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Thermal management in circuit board assemblies
- Patent number 11,910,520
- Issue date Feb 20, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Biopolymer-based electromagnetic interference shielding matertals
- Patent number 11,778,794
- Issue date Oct 3, 2023
- SOFTWARE DEFINED TECHNOLOGIES, INC.
- De Yu Zang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Molecular inks
- Patent number 11,525,066
- Issue date Dec 13, 2022
- National Research Council of Canada
- Arnold J. Kell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
- Patent number 11,510,314
- Issue date Nov 22, 2022
- Xerox Corporation
- Naveen Chopra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in circuit board assemblies
- Patent number 11,503,700
- Issue date Nov 15, 2022
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Molecular ink with improved thermal stability
- Patent number 11,472,980
- Issue date Oct 18, 2022
- National Research Council of Canada
- Arnold J. Kell
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Circuit module and manufacturing method for circuit module
- Patent number 11,419,211
- Issue date Aug 16, 2022
- Murata Manufacturing Co., Ltd.
- Kazushige Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Organic-inorganic-hybrid thin film and method of manufacturing the...
- Patent number 11,292,884
- Issue date Apr 5, 2022
- Unid Co., Ltd.
- Chong Kwang Yoon
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Ink composition, method for forming a conductive member, and conduc...
- Patent number 11,274,224
- Issue date Mar 15, 2022
- Kuprion Inc.
- Zhenggang Li
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Resin composition, prepreg, metallic foil-clad laminate, and printe...
- Patent number 11,161,979
- Issue date Nov 2, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Kentaro Nomizu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of manufacturing a polymer printed circuit board
- Patent number 11,102,891
- Issue date Aug 24, 2021
- BGT MATERIALS LIMITED
- Kuo-Hsin Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prepreg, metal-clad laminated board, and printed wiring board
- Patent number 11,059,260
- Issue date Jul 13, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Keiko Kashihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Double-sided and multilayered printed circuit board fabrication usi...
- Patent number 11,039,541
- Issue date Jun 15, 2021
- Nano Dimension Technologies, LTD.
- Sharon Fima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Biopolymer-based electromagnetic interference shielding materials
- Patent number 11,026,358
- Issue date Jun 1, 2021
- SOFTWARE DEFINED TECHNOLOGIES, INC.
- De Yu Zang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Fluorocarbon prepreg and resin composition thereof
- Patent number 11,008,451
- Issue date May 18, 2021
- Nan Ya Plastics Corporation
- Te-Chao Liao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Metal oxide nanoparticle ink composition, method of producing same,...
- Patent number 10,999,934
- Issue date May 4, 2021
- Gachon University of Industry-Academic Cooperation Foundation
- Daeho Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Ink reinforcement for printed electronics
- Patent number 10,934,446
- Issue date Mar 2, 2021
- Indiana University Research and Technology Corporation
- Jong Eun Ryu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Circuit board, electronic circuit device, and production method of...
- Patent number 10,932,373
- Issue date Feb 23, 2021
- Stanley Electric Co., Ltd.
- Akihiko Hanya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluorocarbon resin composition and prepreg and copper foil substrat...
- Patent number 10,889,741
- Issue date Jan 12, 2021
- Nan Ya Plastics Corporation
- Te-Chao Liao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Molecular inks
- Patent number 10,883,011
- Issue date Jan 5, 2021
- Groupe Graham International Inc.
- Arnold Kell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imprinted metallization on polymeric substrates
- Patent number 10,874,020
- Issue date Dec 22, 2020
- The University of Hong Kong
- Wendi Li
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Bio-electrode composition, bio-electrode, and method for manufactur...
- Patent number 10,864,366
- Issue date Dec 15, 2020
- Shin-Etsu Chemical Co., Ltd.
- Jun Hatakeyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Conformal coating composition containing metal nanoparticles to pre...
- Patent number 10,800,930
- Issue date Oct 13, 2020
- International Business Machines Corporation
- Dylan J. Boday
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Composition for sintering, method for producing silver nanoparticle...
- Patent number 10,774,231
- Issue date Sep 15, 2020
- Stanley Electric Co., Ltd.
- Hiroto Fukushima
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Nanowire-based transparent conductors and applications thereof
- Patent number 10,749,048
- Issue date Aug 18, 2020
- Cambrios Film Solutions Corporation
- Pierre-Marc Allemand
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Substrate for power module, circuit board for power module, and pow...
- Patent number 10,720,375
- Issue date Jul 21, 2020
- Sumitomo Bakelite Co., Ltd.
- Shunsuke Mochizuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BIOPOLYMER-BASED ELECTROMAGENTIC INTERFERRENCE SHIELDING MATERIALS
- Publication number 20240237319
- Publication date Jul 11, 2024
- Software Defined Technologies, Inc.
- Michael M. Salour
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Management in Circuit Board Assemblies
- Publication number 20240206048
- Publication date Jun 20, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BIOPOLYMER-BASED ELECTROMAGENTIC INTERFERRENCE SHIELDING MATERIALS
- Publication number 20240138132
- Publication date Apr 25, 2024
- Software Defined Technologies, Inc.
- Michael M. Salour
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HYBRID NANOSILVER/LIQUID METAL INK COMPOSITION AND USES THEREOF
- Publication number 20220418104
- Publication date Dec 29, 2022
- Xerox Corporation
- Naveen CHOPRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DISPENSING A METALLIC NANOPARTICLE COMPOSITION FROM A NO...
- Publication number 20220312596
- Publication date Sep 29, 2022
- XTPL S.A.
- Mateusz ZAJAC
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BIOPOLYMER-BASED ELECTROMAGENTIC INTERFERRENCE SHIELDING MATERIALS
- Publication number 20210400855
- Publication date Dec 23, 2021
- Software Defined Technologies, Inc.
- De Yu Zang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Thermal Management In Circuit Board Assemblies
- Publication number 20210227680
- Publication date Jul 22, 2021
- Kuprion, Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOLECULAR INKS
- Publication number 20210079248
- Publication date Mar 18, 2021
- National Research Council of Canada
- Arnold J. KELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BORON NITRIDE NANOTUBE COATED SUBSTRATES FOR SINTERING OF METALLIC...
- Publication number 20200407565
- Publication date Dec 31, 2020
- National Research Council of Canada
- Chantal PAQUET
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INKJET PRINTING INK
- Publication number 20200385595
- Publication date Dec 10, 2020
- DAICEL CORPORATION
- Yuki IGUCHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
IMPRINTED METALLIZATION ON POLYMERIC SUBSTRATES
- Publication number 20200260590
- Publication date Aug 13, 2020
- The University of Hong Kong
- Wendi LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Thermal Management In Circuit Board Assemblies
- Publication number 20200214121
- Publication date Jul 2, 2020
- Kuprion, Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUOROCARBON RESIN COMPOSITION AND PREPREG AND COPPER FOIL SUBSTRAT...
- Publication number 20200165501
- Publication date May 28, 2020
- Nan Ya Plastics Corporation
- Te-Chao LIAO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FLUOROCARBON PREPREG AND RESIN COMPOSITION THEREOF
- Publication number 20200165434
- Publication date May 28, 2020
- Nan Ya Plastics Corporation
- Te-Chao LIAO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MATERIAL DEPOSITION IN A MAGNETIC FIELD
- Publication number 20200024741
- Publication date Jan 23, 2020
- Coventry University
- Andrew Cobley
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MOLECULAR INK WITH IMPROVED THERMAL STABILITY
- Publication number 20200010706
- Publication date Jan 9, 2020
- National Research Council of Canada
- Arnold J. KELL
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
COMPOSITION FOR SINTERING, METHOD FOR PRODUCING SILVER NANOPARTICLE...
- Publication number 20200010705
- Publication date Jan 9, 2020
- Stanley Electric Co., Ltd
- Hiroto FUKUSHIMA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CIRCUIT MODULE AND MANUFACTURING METHOD FOR CIRCUIT MODULE
- Publication number 20190364660
- Publication date Nov 28, 2019
- MURATA MANUFACTURING CO., LTD.
- Kazushige SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL OXIDE NANOPARTICLE INK COMPOSITION, METHOD OF PRODUCING SAME,...
- Publication number 20190327836
- Publication date Oct 24, 2019
- Gachon University of Industry-Academic Cooperation Foundation
- Daeho Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CIRCUIT BOARD, ELECTRONIC CIRCUIT DEVICE, AND PRODUCTION METHOD OF...
- Publication number 20190281705
- Publication date Sep 12, 2019
- Stanley Electric Co., Ltd
- Akihiko HANYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Management In Circuit Board Assemblies
- Publication number 20190246491
- Publication date Aug 8, 2019
- Kuprion, Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ink Composition, Method For Forming A Conductive Member, And Conduc...
- Publication number 20190225827
- Publication date Jul 25, 2019
- Nanyang Technological University
- Zhenggang LI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ELECTRICALLY CONDUCTIVE PASTE AND WIRING BOARD USING THE SAME
- Publication number 20190185684
- Publication date Jun 20, 2019
- YAZAKI CORPORATION
- Maki YAMADA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BIOPOLYMER-BASED ELECTROMAGENTIC INTERFERENCE SHIELDING MATERIALS
- Publication number 20190191600
- Publication date Jun 20, 2019
- IPITEK, Inc.
- De Yu Zang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method of manufacturing a polymer printed circuit board
- Publication number 20190174637
- Publication date Jun 6, 2019
- BGT Materials Limited
- Kuo-Hsin CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR LOW TEMPERATURE PRINTING OF CONDUCTIVE METAL...
- Publication number 20190132958
- Publication date May 2, 2019
- Datamax-O'Neil Corporation
- Munish Kumar SHARMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DOUBLE-SIDED AND MULTILAYERED PRINTED CIRCUIT BOARD FABRICATION USI...
- Publication number 20190098771
- Publication date Mar 28, 2019
- Nano Dimension Technologies, LTD.
- Sharon Fima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRIC CONNECTION STRUCTURE AND ELECTRIC CONNECTION MEMBER
- Publication number 20190075658
- Publication date Mar 7, 2019
- Japan Aviation Electronics Industry, Limited
- Junya SATO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DRY METHOD OF METALLIZING POLYMER THICK FILM SURFACES
- Publication number 20190029119
- Publication date Jan 24, 2019
- Molex, LLC
- Patrick Weber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INK REINFORCEMENT FOR PRINTED ELECTRONICS
- Publication number 20180371277
- Publication date Dec 27, 2018
- Indiana University Research and Technology Corporation
- Jong Eun Ryu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Nanoparticles

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of dispensing a metallic nanoparticle composition from a no...

Ink composition, method for forming a conductive member, and conduc...

Hybrid nanosilver/liquid metal ink composition and uses thereof

Boron nitride nanotube coated substrates for sintering of metallic...

Thermal management in circuit board assemblies

Biopolymer-based electromagnetic interference shielding matertals

Molecular inks

Hybrid nanosilver/liquid metal ink composition and uses thereof

Thermal management in circuit board assemblies

Molecular ink with improved thermal stability

Circuit module and manufacturing method for circuit module

Organic-inorganic-hybrid thin film and method of manufacturing the...

Ink composition, method for forming a conductive member, and conduc...

Resin composition, prepreg, metallic foil-clad laminate, and printe...

Method of manufacturing a polymer printed circuit board

Prepreg, metal-clad laminated board, and printed wiring board

Double-sided and multilayered printed circuit board fabrication usi...

Biopolymer-based electromagnetic interference shielding materials

Fluorocarbon prepreg and resin composition thereof

Metal oxide nanoparticle ink composition, method of producing same,...

Ink reinforcement for printed electronics

Circuit board, electronic circuit device, and production method of...

Fluorocarbon resin composition and prepreg and copper foil substrat...

Molecular inks

Imprinted metallization on polymeric substrates

Bio-electrode composition, bio-electrode, and method for manufactur...

Conformal coating composition containing metal nanoparticles to pre...

Composition for sintering, method for producing silver nanoparticle...

Nanowire-based transparent conductors and applications thereof

Substrate for power module, circuit board for power module, and pow...

Patents Applicationslast 30 patents

BIOPOLYMER-BASED ELECTROMAGENTIC INTERFERRENCE SHIELDING MATERIALS

Thermal Management in Circuit Board Assemblies

BIOPOLYMER-BASED ELECTROMAGENTIC INTERFERRENCE SHIELDING MATERIALS

HYBRID NANOSILVER/LIQUID METAL INK COMPOSITION AND USES THEREOF

METHODS OF DISPENSING A METALLIC NANOPARTICLE COMPOSITION FROM A NO...

BIOPOLYMER-BASED ELECTROMAGENTIC INTERFERRENCE SHIELDING MATERIALS

Thermal Management In Circuit Board Assemblies

MOLECULAR INKS

BORON NITRIDE NANOTUBE COATED SUBSTRATES FOR SINTERING OF METALLIC...

INKJET PRINTING INK

IMPRINTED METALLIZATION ON POLYMERIC SUBSTRATES

Thermal Management In Circuit Board Assemblies

FLUOROCARBON RESIN COMPOSITION AND PREPREG AND COPPER FOIL SUBSTRAT...

FLUOROCARBON PREPREG AND RESIN COMPOSITION THEREOF

MATERIAL DEPOSITION IN A MAGNETIC FIELD

MOLECULAR INK WITH IMPROVED THERMAL STABILITY

COMPOSITION FOR SINTERING, METHOD FOR PRODUCING SILVER NANOPARTICLE...

CIRCUIT MODULE AND MANUFACTURING METHOD FOR CIRCUIT MODULE

METAL OXIDE NANOPARTICLE INK COMPOSITION, METHOD OF PRODUCING SAME,...

CIRCUIT BOARD, ELECTRONIC CIRCUIT DEVICE, AND PRODUCTION METHOD OF...

Thermal Management In Circuit Board Assemblies

Ink Composition, Method For Forming A Conductive Member, And Conduc...

ELECTRICALLY CONDUCTIVE PASTE AND WIRING BOARD USING THE SAME

BIOPOLYMER-BASED ELECTROMAGENTIC INTERFERENCE SHIELDING MATERIALS

Method of manufacturing a polymer printed circuit board

METHOD AND SYSTEM FOR LOW TEMPERATURE PRINTING OF CONDUCTIVE METAL...

DOUBLE-SIDED AND MULTILAYERED PRINTED CIRCUIT BOARD FABRICATION USI...

ELECTRIC CONNECTION STRUCTURE AND ELECTRIC CONNECTION MEMBER

DRY METHOD OF METALLIZING POLYMER THICK FILM SURFACES

INK REINFORCEMENT FOR PRINTED ELECTRONICS