Neptunium [Np]

Industry

CPC
H01L2924/01093

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01093Neptunium [Np]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 10,312,217
- Issue date Jun 4, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an interposer with microspring contacts
- Patent number 9,967,982
- Issue date May 8, 2018
- Palo Alto Research Center Incorporated
- Eugene M. Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,391,143
- Issue date Jul 12, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic devices including two or more substrates electrically co...
- Patent number 9,345,135
- Issue date May 17, 2016
- Micron Technology, Inc.
- Roy E. Meade
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,331,149
- Issue date May 3, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Structures and methods for improving solder bump connections in sem...
- Patent number 9,087,754
- Issue date Jul 21, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,082,627
- Issue date Jul 14, 2015
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Structures and methods for improving solder bump connections in sem...
- Patent number 8,916,464
- Issue date Dec 23, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for enabling ESD protection on 3-D stacked devices
- Patent number 8,847,360
- Issue date Sep 30, 2014
- QUALCOMM Incorporated
- Kenneth Kaskoun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices including two or more substrates electrically co...
- Patent number 8,837,212
- Issue date Sep 16, 2014
- Micron Technology, Inc.
- Roy E. Meade
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 8,802,506
- Issue date Aug 12, 2014
- Dow Corning Toray Company, Ltd.
- Minoru Isshiki
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic devices formed of two or more substrates connected toget...
- Patent number 8,570,798
- Issue date Oct 29, 2013
- Micron Technology, Inc.
- Roy E. Meade
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Microsprings partially embedded in a laminate structure and methods...
- Patent number 8,519,534
- Issue date Aug 27, 2013
- Palo Alto Research Center Incorporated
- Eugene M. Chow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing board with built-in electronic elements
- Patent number 8,225,503
- Issue date Jul 24, 2012
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for disposing a component
- Patent number 8,187,667
- Issue date May 29, 2012
- Panasonic Corporation
- Hidekazu Arase
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multi-chip module
- Patent number 8,188,596
- Issue date May 29, 2012
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a matrix of individual electronic components a...
- Patent number 8,168,478
- Issue date May 1, 2012
- Commissariat a l'Energie Atomique
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting a component
- Patent number 8,163,329
- Issue date Apr 24, 2012
- Panasonic Corporation
- Hidekazu Arase
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 8,153,505
- Issue date Apr 10, 2012
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Systems and methods for enabling ESD protection on 3-D stacked devices
- Patent number 8,080,862
- Issue date Dec 20, 2011
- Qualcomm Incorporate
- Kenneth Kaskoun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor structure and method of making the same
- Patent number 8,058,142
- Issue date Nov 15, 2011
- BeSang Inc.
- Sang-Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a matrix of individual electronic components a...
- Patent number 8,058,656
- Issue date Nov 15, 2011
- Commissariat a l'Energie Atomique
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 8,053,329
- Issue date Nov 8, 2011
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Structure of UBM and solder bumps and methods of fabrication
- Patent number 8,003,512
- Issue date Aug 23, 2011
- International Business Machines Corporation
- Luc L. Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for improving solder bump connections in sem...
- Patent number 7,985,671
- Issue date Jul 26, 2011
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices formed of two or more substrates bonded together...
- Patent number 7,969,774
- Issue date Jun 28, 2011
- Micron Technology, Inc.
- Roy E. Meade
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Electronic devices including solder bumps on compliant dielectric l...
- Patent number 7,932,615
- Issue date Apr 26, 2011
- Amkor Technology, Inc.
- Glenn A. Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack semiconductor package including an interposer chip having an...
- Patent number 7,928,555
- Issue date Apr 19, 2011
- Samsung Electronics Co., Ltd.
- Tae-hun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 7,871,898
- Issue date Jan 18, 2011
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Component mounting method
- Patent number 7,867,563
- Issue date Jan 11, 2011
- Panasonic Corporation
- Hidekazu Arase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICES INCLUDING TWO OR MORE SUBSTRATES ELECTRICALLY CO...
- Publication number 20140340861
- Publication date Nov 20, 2014
- Roy E. Meade
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20140206176
- Publication date Jul 24, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20140203407
- Publication date Jul 24, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES INCLUDING TWO OR MORE SUBSTRATES ELECTRICALLY CO...
- Publication number 20140029225
- Publication date Jan 30, 2014
- Micron Technology, Inc.
- Roy E. Meade
- B82 - NANO-TECHNOLOGY
Information Patent Application
Method of Producing an Interposer with Microspring Contacts
- Publication number 20130232782
- Publication date Sep 12, 2013
- Palo Alto Research Center Incorporated
- Eugene M. Chow
- G01 - MEASURING TESTING
Information Patent Application
Method For Low Temperature Bonding And Bonded Structure
- Publication number 20120097638
- Publication date Apr 26, 2012
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microsprings Partially Embedded In A Laminate Structure And Methods...
- Publication number 20120068331
- Publication date Mar 22, 2012
- Palo Alto Research Center Incorporated
- Eugene M. Chow
- G01 - MEASURING TESTING
Information Patent Application
Systems and Methods for Enabling Esd Protection on 3-D Stacked Devices
- Publication number 20120061804
- Publication date Mar 15, 2012
- QUALCOMM Incorporated
- Kenneth Kaskoun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A MATRIX OF INDIVIDUAL ELECTRONIC COMPONENTS A...
- Publication number 20110300487
- Publication date Dec 8, 2011
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES FORMED OF TWO OR MORE SUBSTRATES CONNECTED TOGET...
- Publication number 20110233774
- Publication date Sep 29, 2011
- Micron Technology, Inc.
- Roy E. Meade
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR DISPOSING A COMPONENT
- Publication number 20110229642
- Publication date Sep 22, 2011
- PANASONIC CORPORATION
- Hidekazu ARASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING A COMPONENT
- Publication number 20110203731
- Publication date Aug 25, 2011
- PANASONIC CORPORATION
- Hidekazu ARASE
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND AND BONDED STRUCTURE
- Publication number 20110067803
- Publication date Mar 24, 2011
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT MOUNTING METHOD
- Publication number 20100266769
- Publication date Oct 21, 2010
- PANASONIC CORPORATION
- Hidekazu ARASE
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICES FORMED OF TWO OR MORE SUBSTRATES BONDED TOGETHER...
- Publication number 20100232220
- Publication date Sep 16, 2010
- Micron Technology, Inc.
- Roy E. Meade
- G11 - INFORMATION STORAGE
Information Patent Application
Method Of Manufacturing A Semiconductor Device And A Semiconductor...
- Publication number 20100213623
- Publication date Aug 26, 2010
- Minoru Isshiki
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
NOVEL STRUCTURE OF UBM AND SOLDER BUMPS AND METHODS OF FABRICATION
- Publication number 20100193949
- Publication date Aug 5, 2010
- International Business Machines Corporation
- Luc L. Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURI...
- Publication number 20100190334
- Publication date Jul 29, 2010
- Sang-Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures and Methods for Improving Solder Bump Connections in Sem...
- Publication number 20100164104
- Publication date Jul 1, 2010
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures and Methods for Improving Solder Bump Connections in Sem...
- Publication number 20100164096
- Publication date Jul 1, 2010
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20100163169
- Publication date Jul 1, 2010
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT WITH EMBEDDED MEMORY
- Publication number 20100133695
- Publication date Jun 3, 2010
- Sang-Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Enabling ESD Protection on 3-D Stacked Devices
- Publication number 20100059869
- Publication date Mar 11, 2010
- QUALCOMM Incorporated
- Kenneth Kaskoun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL TRANSISTOR WITH INTEGRATED ISOLATION
- Publication number 20090309155
- Publication date Dec 17, 2009
- Aram H. Mkhitarian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20090267233
- Publication date Oct 29, 2009
- Sang-Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20090267211
- Publication date Oct 29, 2009
- Samsung Electronics Co., Ltd.
- Hyun-Soo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20090263953
- Publication date Oct 22, 2009
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BOARD WITH BUILT-IN ELECTRONIC ELEMENTS
- Publication number 20090199399
- Publication date Aug 13, 2009
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A MATRIX OF INDIVIDUAL ELECTRONIC COMPONENTS A...
- Publication number 20090085045
- Publication date Apr 2, 2009
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Layer Structure And Method Of Making The Same
- Publication number 20080265360
- Publication date Oct 30, 2008
- Sang-Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS

Neptunium [Np]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for low temperature bonding and bonded structure

Method of producing an interposer with microspring contacts

Method for low temperature bonding and bonded structure

Electronic devices including two or more substrates electrically co...

Method for low temperature bonding and bonded structure

Structures and methods for improving solder bump connections in sem...

Method for low temperature bonding and bonded structure

Structures and methods for improving solder bump connections in sem...

Systems and methods for enabling ESD protection on 3-D stacked devices

Electronic devices including two or more substrates electrically co...

Method of manufacturing a semiconductor device and a semiconductor...

Electronic devices formed of two or more substrates connected toget...

Microsprings partially embedded in a laminate structure and methods...

Method for manufacturing board with built-in electronic elements

Method for disposing a component

Multi-chip module

Method for producing a matrix of individual electronic components a...

Method for mounting a component

Method for low temperature bonding and bonded structure

Systems and methods for enabling ESD protection on 3-D stacked devices

Bonded semiconductor structure and method of making the same

Method for producing a matrix of individual electronic components a...

Method for low temperature bonding and bonded structure

Structure of UBM and solder bumps and methods of fabrication

Structures and methods for improving solder bump connections in sem...

Electronic devices formed of two or more substrates bonded together...

Electronic devices including solder bumps on compliant dielectric l...

Stack semiconductor package including an interposer chip having an...

Method for low temperature bonding and bonded structure

Component mounting method

Patents Applicationslast 30 patents

ELECTRONIC DEVICES INCLUDING TWO OR MORE SUBSTRATES ELECTRICALLY CO...

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

ELECTRONIC DEVICES INCLUDING TWO OR MORE SUBSTRATES ELECTRICALLY CO...

Method of Producing an Interposer with Microspring Contacts

Method For Low Temperature Bonding And Bonded Structure

Microsprings Partially Embedded In A Laminate Structure And Methods...

Systems and Methods for Enabling Esd Protection on 3-D Stacked Devices

METHOD FOR PRODUCING A MATRIX OF INDIVIDUAL ELECTRONIC COMPONENTS A...

ELECTRONIC DEVICES FORMED OF TWO OR MORE SUBSTRATES CONNECTED TOGET...

METHOD FOR DISPOSING A COMPONENT

METHOD FOR MOUNTING A COMPONENT

METHOD FOR LOW TEMPERATURE BONDING AND AND BONDED STRUCTURE

COMPONENT MOUNTING METHOD

ELECTRONIC DEVICES FORMED OF TWO OR MORE SUBSTRATES BONDED TOGETHER...

Method Of Manufacturing A Semiconductor Device And A Semiconductor...

NOVEL STRUCTURE OF UBM AND SOLDER BUMPS AND METHODS OF FABRICATION

THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURI...

Structures and Methods for Improving Solder Bump Connections in Sem...

Structures and Methods for Improving Solder Bump Connections in Sem...

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

ELECTRONIC CIRCUIT WITH EMBEDDED MEMORY

Systems and Methods for Enabling ESD Protection on 3-D Stacked Devices

VERTICAL TRANSISTOR WITH INTEGRATED ISOLATION

BONDED SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING THE SAME

WAFER LEVEL PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

METHOD FOR MANUFACTURING BOARD WITH BUILT-IN ELECTRONIC ELEMENTS

METHOD FOR PRODUCING A MATRIX OF INDIVIDUAL ELECTRONIC COMPONENTS A...

Semiconductor Layer Structure And Method Of Making The Same