Nickel [Ni] as principal constituent

Industry

CPC
H01L2224/37155

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/37155Nickel [Ni] as principal constituent

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Clip and related methods
- Patent number 10,121,763
- Issue date Nov 6, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip and related methods
- Patent number 9,911,712
- Issue date Mar 6, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package and method thereof
- Patent number 9,685,430
- Issue date Jun 20, 2017
- Alpha and Omega Semiconductor Incorporated
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 9,443,760
- Issue date Sep 13, 2016
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip device including a substrate
- Patent number 9,385,107
- Issue date Jul 5, 2016
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,362,240
- Issue date Jun 7, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module including a discrete device mounted on a DCB substrate
- Patent number 9,147,637
- Issue date Sep 29, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 8,916,968
- Issue date Dec 23, 2014
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangements, a chip package and a method for manufacturing a...
- Patent number 8,853,835
- Issue date Oct 7, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric device package and method of making an electric device pac...
- Patent number 8,824,145
- Issue date Sep 2, 2014
- Infineon Technologies AG
- Khalil Hosseini
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electrical connecting strap for semiconductor components
- Patent number 4,502,750
- Issue date Mar 5, 1985
- Brown, Boveri & Cie AG
- Arno Neidig
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL CONNECTION MEMBER, ELECTRICAL CONNECTION STRUCTURE, AND...
- Publication number 20210257327
- Publication date Aug 19, 2021
- Hitachi Metals, Ltd.
- Junya NISHINA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CLIP AND RELATED METHODS
- Publication number 20180197836
- Publication date Jul 12, 2018
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A...
- Publication number 20140097528
- Publication date Apr 10, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electric Device Package and Method of Making an Electric Device Pac...
- Publication number 20130329365
- Publication date Dec 12, 2013
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Multichip Power Semiconductor Device
- Publication number 20130256856
- Publication date Oct 3, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module Including a Discrete Device Mounted on a DCB Substrate
- Publication number 20130161801
- Publication date Jun 27, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130062743
- Publication date Mar 14, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kwang Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS

Nickel [Ni] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for electrically contacting a component by galvanic connecti...

Clip and related methods

Clip and related methods

Embedded package and method thereof

Multichip power semiconductor device

Multichip device including a substrate

Electronic device

Module including a discrete device mounted on a DCB substrate

Multichip power semiconductor device

Chip arrangements, a chip package and a method for manufacturing a...

Electric device package and method of making an electric device pac...

Electrical connecting strap for semiconductor components

Patents Applicationslast 30 patents

ELECTRICAL CONNECTION MEMBER, ELECTRICAL CONNECTION STRUCTURE, AND...

CLIP AND RELATED METHODS

CHIP ARRANGEMENTS, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A...

Electric Device Package and Method of Making an Electric Device Pac...

Multichip Power Semiconductor Device

Module Including a Discrete Device Mounted on a DCB Substrate

POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME