Nickel [Ni] as principal constituent

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H01L2224/05255

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05255Nickel [Ni] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Electronic apparatus and method for manufacturing electronic apparatus
- Patent number 9,754,904
- Issue date Sep 5, 2017
- Fujitsu Limited
- Masaru Morita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS
- Publication number 20170047302
- Publication date Feb 16, 2017
- Fujitsu Limited
- Masaru Morita
- H01 - BASIC ELECTRIC ELEMENTS