Nickel [Ni] as principal constituent

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H01L2224/13455

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13455Nickel [Ni] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Polymer layers embedded with metal pads for heat dissipation
- Patent number 11,398,440
- Issue date Jul 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Hsiang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Cu core ball, solder paste, formed solder, Cu core column, and sold...
- Patent number 10,322,472
- Issue date Jun 18, 2019
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Structures and methods to enable a full intermetallic interconnect
- Patent number 10,170,446
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polymer layers embedded with metal pads for heat dissipation
- Patent number 10,109,605
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Hsiang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test structures for post-passivation interconnect
- Patent number 9,099,420
- Issue date Aug 4, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu pillar bump with electrolytic metal sidewall protection
- Patent number 9,006,097
- Issue date Apr 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring design for maintaining signal integrity
- Patent number 8,970,001
- Issue date Mar 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu pillar bump with electrolytic metal sidewall protection
- Patent number 8,492,891
- Issue date Jul 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic conductive resin, and electronic device including elastic c...
- Patent number 7,875,807
- Issue date Jan 25, 2011
- Ricoh Company, Ltd.
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MISSING BUMP PREVENTION FROM GALVANIC CORROSION BY COPPER BUMP SIDE...
- Publication number 20190206822
- Publication date Jul 4, 2019
- Intel Corporation
- Ji Yong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymer Layers Embedded with Metal Pads for Heat Dissipation
- Publication number 20190057946
- Publication date Feb 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Hsiang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymer Layers Embedded with Metal Pads for Heat Dissipation
- Publication number 20140353819
- Publication date Dec 4, 2014
- Hao-Hsiang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Guard Ring Design for Maintaining Signal Integrity
- Publication number 20140183690
- Publication date Jul 3, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test Structures for Post-Passivation Interconnect
- Publication number 20140151698
- Publication date Jun 5, 2014
- TAIWAN SEMICONDUCTOR MANUFACTUING COMPANY, LTD.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION
- Publication number 20130295762
- Publication date Nov 7, 2013
- Wen-Hsiung LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION
- Publication number 20110260317
- Publication date Oct 27, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC CONDUCTIVE RESIN, AND ELECTRONIC DEVICE INCLUDING ELASTIC C...
- Publication number 20070132098
- Publication date Jun 14, 2007
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Elastic conductive resin, and electronic device including elastic c...
- Publication number 20040108133
- Publication date Jun 10, 2004
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Nickel [Ni] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Polymer layers embedded with metal pads for heat dissipation

Sintering materials and attachment methods using same

Cu core ball, solder paste, formed solder, Cu core column, and sold...

Structures and methods to enable a full intermetallic interconnect

Polymer layers embedded with metal pads for heat dissipation

Test structures for post-passivation interconnect

Cu pillar bump with electrolytic metal sidewall protection

Guard ring design for maintaining signal integrity

Cu pillar bump with electrolytic metal sidewall protection

Elastic conductive resin, and electronic device including elastic c...

Patents Applicationslast 30 patents

MISSING BUMP PREVENTION FROM GALVANIC CORROSION BY COPPER BUMP SIDE...

Polymer Layers Embedded with Metal Pads for Heat Dissipation

Polymer Layers Embedded with Metal Pads for Heat Dissipation

Guard Ring Design for Maintaining Signal Integrity

Test Structures for Post-Passivation Interconnect

CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION

CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION

ELASTIC CONDUCTIVE RESIN, AND ELECTRONIC DEVICE INCLUDING ELASTIC C...

Elastic conductive resin, and electronic device including elastic c...