Membership
Tour
Register
Log in
Nickel [Ni] as principal constituent
Follow
Industry
CPC
H01L2224/13155
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/13155
Nickel [Ni] as principal constituent
Industries
Overview
Organizations
People
Information
Impact
Please log in for detailed analytics
Patents Grants
last 30 patents
Information
Patent Grant
Package structure including stacked pillar portions and method for...
Patent number
12,368,123
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jung-Hua Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Joint structure in semiconductor package and manufacturing method t...
Patent number
12,368,132
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Kuan-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
12,362,272
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company Ltd.
Tung-Jiun Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device and method for UBM/RDL routing
Patent number
12,322,727
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Tsan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing electronic device with reduced substrate wa...
Patent number
12,315,741
Issue date
May 27, 2025
Innolux Corporation
Chuan-Ming Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of forming same
Patent number
12,293,991
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid bonding structures, semiconductor devices having the same, a...
Patent number
12,288,765
Issue date
Apr 29, 2025
Samsung Electronics Co., Ltd.
Kunmo Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
12,288,764
Issue date
Apr 29, 2025
Amkor Technology Singapore Holding Pte Ltd.
Gyu Wan Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal-bump sidewall protection
Patent number
12,272,663
Issue date
Apr 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jung-Hua Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and manufacturing methods thereof
Patent number
12,266,847
Issue date
Apr 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yung-Ping Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of forming the same
Patent number
12,261,102
Issue date
Mar 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Li-Ling Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages with an intermetallic layer
Patent number
12,255,167
Issue date
Mar 18, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming the same
Patent number
12,237,282
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Huan Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package device
Patent number
12,230,558
Issue date
Feb 18, 2025
Innolux Corporation
Hsueh-Hsuan Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor interconnect structures with conductive elements, and...
Patent number
12,211,814
Issue date
Jan 28, 2025
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure
Patent number
12,191,287
Issue date
Jan 7, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
Patent number
12,183,655
Issue date
Dec 31, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yang-Che Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro bump, method for forming micro bump, chip interconnection str...
Patent number
12,176,311
Issue date
Dec 24, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Zengyan Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and methods of manufacturing
Patent number
12,165,980
Issue date
Dec 10, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Single-shot encapsulation
Patent number
12,166,001
Issue date
Dec 10, 2024
Semtech Corporation
Kok Khoon Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding structures and methods for forming the same
Patent number
12,148,725
Issue date
Nov 19, 2024
AG MATERIALS TECHNOLOGY CO., LTD.
Tung-Han Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device assembly with die support structures
Patent number
12,148,727
Issue date
Nov 19, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of forming same
Patent number
12,142,560
Issue date
Nov 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chung-Shi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated chip for standard logic performance improvement having a...
Patent number
12,142,569
Issue date
Nov 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Min-Feng Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated fan-out package and the methods of manufacturing
Patent number
12,142,597
Issue date
Nov 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming semiconductor package and semiconductor package
Patent number
12,125,776
Issue date
Oct 22, 2024
Yibu Semiconductor Co., Ltd.
Weiping Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor bonding structures and methods
Patent number
12,119,238
Issue date
Oct 15, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Tse Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing semiconductor device
Patent number
12,119,323
Issue date
Oct 15, 2024
Kioxia Corporation
Soichi Homma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a structure
Patent number
12,107,069
Issue date
Oct 1, 2024
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Nohora-Lizeth Caicedo Panqueva
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure
Patent number
12,100,697
Issue date
Sep 24, 2024
Advanced Semiconductor Engineering, Inc.
Chang-Yu Lin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
TREATMENT PROCESS FOR WAFER BONDING PROCESSES
Publication number
20250239564
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Tsu Chung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
Publication number
20250239561
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages and Methods of Forming Same
Publication number
20250233115
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
Publication number
20250233083
Publication date
Jul 17, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Young Do KWEON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making a Molded IPD-CoW
Publication number
20250226334
Publication date
Jul 10, 2025
STATS ChipPAC Pte Ltd.
Kai Chong Chan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME
Publication number
20250226269
Publication date
Jul 10, 2025
Taiwan Semiconductor Manufacturing company Ltd.
MING-CHUNG WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20250226343
Publication date
Jul 10, 2025
Innolux Corporation
Chia-Ping Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CORE BALL AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20250226344
Publication date
Jul 10, 2025
MK ELECTRON CO., LTD.
Jae Yeol SON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
Publication number
20250218998
Publication date
Jul 3, 2025
Intel Corporation
Bohan SHAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED STRUCTURE
Publication number
20250210561
Publication date
Jun 26, 2025
TDK Corporation
Tomohisa MITOSE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...
Publication number
20250210608
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Lipu Kris Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH HIGH CAPA...
Publication number
20250201768
Publication date
Jun 19, 2025
Intel Corporation
Sagar Suthram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES FOR HIGH CAPAC...
Publication number
20250201793
Publication date
Jun 19, 2025
Intel Corporation
Sagar Suthram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
Publication number
20250201686
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Li-Ling Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
Publication number
20250201753
Publication date
Jun 19, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20250201747
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Tzu-Shiun Sheu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
Publication number
20250183217
Publication date
Jun 5, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE BUMP AND METHOD FOR FABRICATING THE SAME
Publication number
20250174587
Publication date
May 29, 2025
Siliconware Precision Industries Co., Ltd.
Yen-Hao SU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VIAS WITH SELECTED GRAIN DISTRIBUTION
Publication number
20250167046
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Pang Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20250167092
Publication date
May 22, 2025
Advanced Semiconductor Engineering, Inc.
Yung-Li LU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF PACKAGE DEVICE
Publication number
20250157904
Publication date
May 15, 2025
InnoLux Corporation
Hsueh-Hsuan Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...
Publication number
20250157971
Publication date
May 15, 2025
Institute of Semiconductors, Guangdong Academy of Sciences
Chuan HU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250149456
Publication date
May 8, 2025
Samsung Electronics Co., Ltd.
Young-Ja KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20250140671
Publication date
May 1, 2025
Innolux Corporation
Cheng-Chi Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE
Publication number
20250132260
Publication date
Apr 24, 2025
Ping-Jung Yang
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20250132214
Publication date
Apr 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH COMPRESSIBLE BONDS AND METHODS...
Publication number
20250125309
Publication date
Apr 17, 2025
Taiwan Semiconductor Manufacturing Company Limited
Kai-Hsiang Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Forming Semiconductor Package and Semiconductor Package
Publication number
20250118649
Publication date
Apr 10, 2025
Yibu Semiconductor Co., Ltd.
Weiping LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY EN...
Publication number
20250118690
Publication date
Apr 10, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Wen-Yi Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER-LEVEL CHIP SCALE PACKAGE TRANSIENT VOLTAGE SUPPRESSION DIODE...
Publication number
20250113508
Publication date
Apr 3, 2025
TEXAS INSTRUMENTS INCORPORATED
Thomas Kronenberg
H01 - BASIC ELECTRIC ELEMENTS