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Nickel [Ni] as principal constituent
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CPC
H01L2224/83655
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/83655
Nickel [Ni] as principal constituent
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Patents Grants
last 30 patents
Information
Patent Grant
Method and apparatus for forming contacts on an integrated circuit...
Patent number
10,685,931
Issue date
Jun 16, 2020
CATLAM LLC
Kenneth S. Bahl
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Integrated circuit wafer integration with catalytic laminate or adh...
Patent number
9,922,951
Issue date
Mar 20, 2018
Sierra Circuits, Inc.
Kenneth S. Bahl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light-reflective anisotropic conductive paste and light-emitting de...
Patent number
8,710,662
Issue date
Apr 29, 2014
Sony Corporation & Information Device Corporation
Hideaki Umakoshi
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Electronic device
Patent number
8,217,403
Issue date
Jul 10, 2012
Napra Co., Ltd
Shigenobu Sekine
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Method and Apparatus for forming Contacts on an Integrated Circuit...
Publication number
20180158793
Publication date
Jun 7, 2018
SIERRA CIRCUITS, INC.
Kenneth S. Bahl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT-REFLECTIVE ANISOTROPIC CONDUCTIVE PASTE AND LIGHT-EMITTING DE...
Publication number
20120248495
Publication date
Oct 4, 2012
SONY CHEMICAL & INFORMATION DEVICE CORPORATION
Hideaki Umakoshi
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...