Nickel [Ni] as principal constituent

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H01L2224/29355

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29355Nickel [Ni] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Resin particles, electrically conductive particles, electrically co...
- Patent number 12,122,885
- Issue date Oct 22, 2024
- Sekisui Chemical Co., Ltd.
- Kouki Ookura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 12,119,321
- Issue date Oct 15, 2024
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 12,014,999
- Issue date Jun 18, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and connected structure
- Patent number 11,923,335
- Issue date Mar 5, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Display device including anisotropic conductive film and method of...
- Patent number 11,864,437
- Issue date Jan 2, 2024
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material and method for die attachment
- Patent number 11,842,974
- Issue date Dec 12, 2023
- Alpha Assembly Solutions Inc.
- Angelo Gulino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display module and manufacturing method thereof
- Patent number 11,817,414
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element bonding structure, method for producing semic...
- Patent number 11,810,885
- Issue date Nov 7, 2023
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,784,154
- Issue date Oct 10, 2023
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module of double-faced cooling
- Patent number 11,735,557
- Issue date Aug 22, 2023
- LG MAGNA E-POWERTRAIN CO., LTD.
- Siho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,710,716
- Issue date Jul 25, 2023
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for attachment and devices produced using the methods
- Patent number 11,699,632
- Issue date Jul 11, 2023
- Alpha Assembly Solutions Inc.
- Monnir Boureghda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 11,450,639
- Issue date Sep 20, 2022
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro LED display and manufacturing method with conductive film
- Patent number 11,417,627
- Issue date Aug 16, 2022
- Samsung Electronics Co., Ltd.
- Jamyeong Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced solder alloys for electronic interconnects
- Patent number 11,411,150
- Issue date Aug 9, 2022
- Alpha Assembly Solutions Inc.
- Morgana de Avila Ribas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,404,391
- Issue date Aug 2, 2022
- Dexerials Corporation
- Seiichiro Shinohara
- B32 - LAYERED PRODUCTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,348,891
- Issue date May 31, 2022
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member connection method and adhesive tape
- Patent number 11,342,303
- Issue date May 24, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Tetsuyuki Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive adhesive agent composition, and electricall...
- Patent number 11,306,225
- Issue date Apr 19, 2022
- Furukawa Electric Co., Ltd.
- Shunichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 11,239,191
- Issue date Feb 1, 2022
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire interfaces
- Patent number 11,239,195
- Issue date Feb 1, 2022
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive adhesive film and dicing-die bonding film u...
- Patent number 11,230,649
- Issue date Jan 25, 2022
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and connected structure
- Patent number 11,139,265
- Issue date Oct 5, 2021
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive adhesive film and dicing-die bonding film u...
- Patent number 11,066,577
- Issue date Jul 20, 2021
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Alignment method, method for connecting electronic component, metho...
- Patent number 11,049,842
- Issue date Jun 29, 2021
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor packages
- Patent number 11,031,347
- Issue date Jun 8, 2021
- Samsung Electronics Co., Ltd.
- Young-lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240347012
- Publication date Oct 17, 2024
- SAMSUNG DISPLAY CO., LTD.
- SUJEONG KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20240297133
- Publication date Sep 5, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
- Publication number 20240194629
- Publication date Jun 13, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Core-Shell Particle Die-Attach Material
- Publication number 20240182757
- Publication date Jun 6, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CHIP ARRANGEMENT
- Publication number 20230361076
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Hermann Bechert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20230253350
- Publication date Aug 10, 2023
- VueReal Inc.
- GHOLAMREZA CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20230118485
- Publication date Apr 20, 2023
- DEXERIALS CORPORATION
- Reiji TSUKAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN PARTICLES, ELECTRICALLY CONDUCTIVE PARTICLES, ELECTRICALLY CO...
- Publication number 20230106977
- Publication date Apr 6, 2023
- Sekisui Chemical Co., Ltd
- Kouki OOKURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20230017939
- Publication date Jan 19, 2023
- EPISTAR CORPORATION
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...
- Publication number 20230005843
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME
- Publication number 20220262760
- Publication date Aug 18, 2022
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
- Publication number 20220246510
- Publication date Aug 4, 2022
- HYPERTAC S.P.A.
- Alessandro Bosca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20220230989
- Publication date Jul 21, 2022
- Nitto Denko Corporation
- Mayu Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE INCLUDING ANISOTROPIC CONDUCTIVE FILM AND METHOD OF...
- Publication number 20220199743
- Publication date Jun 23, 2022
- SAMSUNG DISPLAY CO., LTD.
- Joo-nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING BONDE...
- Publication number 20220139864
- Publication date May 5, 2022
- FURUKAWA ELECTRIC CO., LTD.
- Norzafriza NITTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compliant Electronic Component Interconnection
- Publication number 20220052012
- Publication date Feb 17, 2022
- Paricon Technologies Corporation
- Larre H. Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20220013489
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSIENT LIQUID PHASE BONDING COMPOSITIONS AND POWER ELECTRONICS A...
- Publication number 20210381110
- Publication date Dec 9, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- B22 - CASTING POWDER METALLURGY
Information Patent Application
POWER MODULE OF DOUBLE-FACED COOLING
- Publication number 20210305193
- Publication date Sep 30, 2021
- LG ELECTRONICS INC.
- Siho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS
- Publication number 20210289680
- Publication date Sep 16, 2021
- Alpha Assembly Solutions Inc.
- Monnir Boureghda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
- Publication number 20210280548
- Publication date Sep 9, 2021
- DEXERIALS CORPORATION
- Kenichi SARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20210151405
- Publication date May 20, 2021
- Epistar Corporation
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER CONNECTION METHOD AND ADHESIVE TAPE
- Publication number 20210074674
- Publication date Mar 11, 2021
- Hitachi Chemical Company, Ltd.
- Tetsuyuki SHIRAKAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MICRO LED DISPLAY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210066243
- Publication date Mar 4, 2021
- Samsung Electronics Co., Ltd.
- Byunghoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED DISPLAY AND MANUFACTURING METHOD THEREOF
- Publication number 20210050336
- Publication date Feb 18, 2021
- Samsung Electronics Co., Ltd.
- Jamyeong KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20210020593
- Publication date Jan 21, 2021
- VueReal Inc.
- GHOLAMREZA CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE INTERFACES
- Publication number 20200321303
- Publication date Oct 8, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20200248040
- Publication date Aug 6, 2020
- DUPONT ELECTRONICS, INC.
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20200227371
- Publication date Jul 16, 2020
- Epistar Corporation
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT
- Publication number 20200203304
- Publication date Jun 25, 2020
- Alpha Assembly Solutions Inc.
- Angelo GULINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Nickel [Ni] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Resin particles, electrically conductive particles, electrically co...

Semiconductor device and a method of manufacturing thereof

Low pressure sintering powder

Integration and bonding of micro-devices into system substrate

Anisotropic conductive film and connected structure

Display device including anisotropic conductive film and method of...

Solder material and method for die attachment

Display module and manufacturing method thereof

Semiconductor element bonding structure, method for producing semic...

Anisotropic conductive film and method of producing the same

Power module of double-faced cooling

Anisotropic conductive film and method of producing the same

Methods for attachment and devices produced using the methods

Semiconductor device and a method of manufacturing thereof

Alternative compositions for high temperature soldering applications

Micro LED display and manufacturing method with conductive film

Advanced solder alloys for electronic interconnects

Anisotropic conductive film and method of producing the same

Sintering materials and attachment methods using same

Anisotropic conductive film and method of producing the same

Member connection method and adhesive tape

Electrically conductive adhesive agent composition, and electricall...

Semiconductor device and a method of manufacturing the same

Nanowire interfaces

Electrically conductive adhesive film and dicing-die bonding film u...

Anisotropic conductive film and connected structure

Electrically conductive adhesive film and dicing-die bonding film u...

Alignment method, method for connecting electronic component, metho...

Semiconductor packages

Low pressure sintering powder

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

Semiconductor Device and Method of Making a Semiconductor Package w...

Core-Shell Particle Die-Attach Material

CHIP ARRANGEMENT

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

ANISOTROPIC CONDUCTIVE FILM

RESIN PARTICLES, ELECTRICALLY CONDUCTIVE PARTICLES, ELECTRICALLY CO...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...

ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME

OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

DISPLAY DEVICE INCLUDING ANISOTROPIC CONDUCTIVE FILM AND METHOD OF...

BONDING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING BONDE...

Compliant Electronic Component Interconnection

DISPLAY MODULE AND MANUFACTURING METHOD THEREOF

TRANSIENT LIQUID PHASE BONDING COMPOSITIONS AND POWER ELECTRONICS A...

POWER MODULE OF DOUBLE-FACED COOLING

METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

MEMBER CONNECTION METHOD AND ADHESIVE TAPE

MICRO LED DISPLAY AND METHOD FOR MANUFACTURING THE SAME

MICRO LED DISPLAY AND MANUFACTURING METHOD THEREOF

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

NANOWIRE INTERFACES

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT