Nickel [Ni] as principal constituent

Industry

CPC
H01L2224/29455

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29455Nickel [Ni] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Adhesive member, display device, and manufacturing method of displa...
- Patent number 11,923,330
- Issue date Mar 5, 2024
- Samsung Display Co., Ltd.
- Jung Hoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and manufacturing method thereof
- Patent number 11,817,414
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding structures and semiconductor devices including the same
- Patent number 11,804,462
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 11,683,963
- Issue date Jun 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Particles, connecting material and connection structure
- Patent number 11,024,439
- Issue date Jun 1, 2021
- Sekisui Chemical Co., Ltd.
- Mai Yamagami
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Particles, connecting material and connection structure
- Patent number 11,017,916
- Issue date May 25, 2021
- Sekisui Chemical Co., Ltd.
- Mai Yamagami
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bump-forming film, semiconductor device and manufacturing method th...
- Patent number 10,943,879
- Issue date Mar 9, 2021
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,892,243
- Issue date Jan 12, 2021
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film with conductive particles forming repea...
- Patent number 10,854,571
- Issue date Dec 1, 2020
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,847,487
- Issue date Nov 24, 2020
- Dexerials Corporation
- Seiichiro Shinohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic electrically conductive film, method for producing same...
- Patent number 10,832,830
- Issue date Nov 10, 2020
- Dexerials Corporation
- Tomoyuki Ishimatsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Conductive paste for bonding
- Patent number 10,756,047
- Issue date Aug 25, 2020
- E I du Pont de Nemours and Company
- Takuya Konno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing an electronic assembly
- Patent number 10,672,690
- Issue date Jun 2, 2020
- Deere & Company
- Robert K. Kinyanjui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale interconnect array for stacked dies
- Patent number 10,600,761
- Issue date Mar 24, 2020
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic electrically conductive film, method for producing same...
- Patent number 10,566,108
- Issue date Feb 18, 2020
- Dexerials Corporation
- Tomoyuki Ishimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,546,831
- Issue date Jan 28, 2020
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film
- Patent number 10,513,635
- Issue date Dec 24, 2019
- Dexerials Corporation
- Seiichiro Shinohara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Anisotropic conductive film (ACF) and forming method thereof, ACF r...
- Patent number 10,510,708
- Issue date Dec 17, 2019
- BOE Technology Group Co., Ltd.
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device connected by anisotropic conductive film
- Patent number 10,504,866
- Issue date Dec 10, 2019
- Kudko Chemical Co., Ltd.
- Young Woo Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic assembly with enhanced thermal dissipation
- Patent number 10,461,021
- Issue date Oct 29, 2019
- Deere & Company
- Robert K. Kinyanjui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and production method of the same
- Patent number 10,442,958
- Issue date Oct 15, 2019
- Dexerials Corporation
- Yuta Araki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film
- Patent number 10,424,538
- Issue date Sep 24, 2019
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic electrically conductive film, method for producing same...
- Patent number 10,304,587
- Issue date May 28, 2019
- Dexerials Corporation
- Tomoyuki Ishimatsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Conductive adhesive film structures
- Patent number 10,224,304
- Issue date Mar 5, 2019
- Apple Inc.
- Wei Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 10,217,807
- Issue date Feb 26, 2019
- Samsung Display Co., Ltd.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection material
- Patent number 10,154,587
- Issue date Dec 11, 2018
- Dexerials Corporation
- Yasushi Akutsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Anisotropic conductive film and connection structure
- Patent number 9,953,947
- Issue date Apr 24, 2018
- Dexerials Corporation
- Reiji Tsukao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device connected by anisotropic conductive film
- Patent number 9,865,558
- Issue date Jan 9, 2018
- Samsung SDI Co., Ltd.
- Young Ju Shin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
- Publication number 20240128224
- Publication date Apr 18, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jung Hoon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME
- Publication number 20230290751
- Publication date Sep 14, 2023
- SAMSUNG DISPLAY CO., LTD.
- Joo Nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
- Publication number 20220216172
- Publication date Jul 7, 2022
- SAMSUNG DISPLAY CO., LTD.
- Jung Hoon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME
- Publication number 20220077100
- Publication date Mar 10, 2022
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20220013489
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE
- Publication number 20200161268
- Publication date May 21, 2020
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MA...
- Publication number 20200043888
- Publication date Feb 6, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Hiroaki TATSUMI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY
- Publication number 20200020619
- Publication date Jan 16, 2020
- Deere & Company
- Robert K. Kinyanjui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES
- Publication number 20190237437
- Publication date Aug 1, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM, METHOD FOR PRODUCING SAME...
- Publication number 20190237214
- Publication date Aug 1, 2019
- DEXERIALS CORPORATION
- Tomoyuki ISHIMATSU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME
- Publication number 20190148478
- Publication date May 16, 2019
- SAMSUNG DISPLAY CO., LTD.
- Chungseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20190096843
- Publication date Mar 28, 2019
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM (ACF) AND FORMING METHOD THEREOF, ACF R...
- Publication number 20190035760
- Publication date Jan 31, 2019
- BOE TECHNOLOGY GROUP CO., LTD.
- Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTICLES, CONNECTING MATERIAL AND CONNECTION STRUCTURE
- Publication number 20180297154
- Publication date Oct 18, 2018
- Sekisui Chemical Co., Ltd
- Mai YAMAGAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Anisotropic Electrically Conductive Film and Connection Structure
- Publication number 20180301432
- Publication date Oct 18, 2018
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY WITH ENHANCED THERMAL DISSIPATION
- Publication number 20180247885
- Publication date Aug 30, 2018
- Deere & Company
- Robert K. Kinyanjui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Paste For Bonding
- Publication number 20180102341
- Publication date Apr 12, 2018
- E I DU PONT DE NEMOURS AND COMPANY
- Takuya Konno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE ADHESIVE FILM STRUCTURES
- Publication number 20180082971
- Publication date Mar 22, 2018
- Apple Inc.
- Wei LIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE
- Publication number 20170309590
- Publication date Oct 26, 2017
- DEXERIALS CORPORATION
- Reiji TSUKAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM (ACF), BONDING STRUCTURE, AND DISPLAY P...
- Publication number 20170271299
- Publication date Sep 21, 2017
- BOE TECHNOLOGY GROUP CO., LTD.
- HONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXED-ARRAY ANISOTROPIC CONDUCTIVE FILM USING CONDUCTIVE PARTICLES...
- Publication number 20170004901
- Publication date Jan 5, 2017
- TRILLION SCIENCE, INC.
- Rong-Chang Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE DIE ATTACH FILM FOR LARGE DIE SEMICONDUCTOR PACKAGES AND...
- Publication number 20160148894
- Publication date May 26, 2016
- Henkel IP & Holding GmbH
- Pukun Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...
- Publication number 20140302643
- Publication date Oct 9, 2014
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND...
- Publication number 20140291869
- Publication date Oct 2, 2014
- Kyoung Soo PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTERCONNECT STRUCTURES WITH POLYMER CORE
- Publication number 20140264910
- Publication date Sep 18, 2014
- Sandeep Razdan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FILM ADHESIVE, DICING TAPE WITH FILM ADHESIVE, METHOD OF MANUFACTUR...
- Publication number 20140231983
- Publication date Aug 21, 2014
- Yuki SUGO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESI...
- Publication number 20140225144
- Publication date Aug 14, 2014
- DEXERIALS CORPORATION
- Hidetsugu NAMIKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140179065
- Publication date Jun 26, 2014
- Kil Yong LEE
- G02 - OPTICS
Information Patent Application
LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESI...
- Publication number 20140103266
- Publication date Apr 17, 2014
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Hidetsugu Namiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140106160
- Publication date Apr 17, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHANG-CHIN WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Nickel [Ni] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Adhesive member, display device, and manufacturing method of displa...

Display module and manufacturing method thereof

Hybrid bonding structures and semiconductor devices including the same

Anisotropic conductive film and display device using the same

Alternative compositions for high temperature soldering applications

Sintering materials and attachment methods using same

Particles, connecting material and connection structure

Particles, connecting material and connection structure

Bump-forming film, semiconductor device and manufacturing method th...

Anisotropic electrically conductive film and connection structure

Anisotropic conductive film with conductive particles forming repea...

Anisotropic electrically conductive film and connection structure

Anisotropic electrically conductive film, method for producing same...

Conductive paste for bonding

Method for manufacturing an electronic assembly

Nanoscale interconnect array for stacked dies

Anisotropic electrically conductive film, method for producing same...

Anisotropic electrically conductive film and connection structure

Anisotropic conductive film

Anisotropic conductive film (ACF) and forming method thereof, ACF r...

Semiconductor device connected by anisotropic conductive film

Electronic assembly with enhanced thermal dissipation

Anisotropic conductive film and production method of the same

Anisotropic conductive film

Anisotropic electrically conductive film, method for producing same...

Conductive adhesive film structures

Anisotropic conductive film and display device using the same

Electrical connection material

Anisotropic conductive film and connection structure

Semiconductor device connected by anisotropic conductive film

Patents Applicationslast 30 patents

ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME

ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...

HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME

DISPLAY MODULE AND MANUFACTURING METHOD THEREOF

ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE

SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MA...

METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY

NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES

ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM, METHOD FOR PRODUCING SAME...

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME

ANISOTROPIC CONDUCTIVE FILM

ANISOTROPIC CONDUCTIVE FILM (ACF) AND FORMING METHOD THEREOF, ACF R...

PARTICLES, CONNECTING MATERIAL AND CONNECTION STRUCTURE

Anisotropic Electrically Conductive Film and Connection Structure

ELECTRONIC ASSEMBLY WITH ENHANCED THERMAL DISSIPATION

Conductive Paste For Bonding

CONDUCTIVE ADHESIVE FILM STRUCTURES

ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE

ANISOTROPIC CONDUCTIVE FILM (ACF), BONDING STRUCTURE, AND DISPLAY P...

FIXED-ARRAY ANISOTROPIC CONDUCTIVE FILM USING CONDUCTIVE PARTICLES...

CONDUCTIVE DIE ATTACH FILM FOR LARGE DIE SEMICONDUCTOR PACKAGES AND...

CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...

ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND...

INTERCONNECT STRUCTURES WITH POLYMER CORE

FILM ADHESIVE, DICING TAPE WITH FILM ADHESIVE, METHOD OF MANUFACTUR...

LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESI...

ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME