Niobium [Nb] as principal constituent

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H01L2224/05179

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05179Niobium [Nb] as principal constituent

Industries

Patents Grantslast 30 patents

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Information Patent Grant
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Information Patent Grant
Structure and method for a superbarrier to prevent diffusion betwee...
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Information Patent Grant
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Patents Applicationslast 30 patents

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Niobium [Nb] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Reducing loss in stacked quantum devices

Array substrate, display panel and display device

Silicon carbide device and method for forming a silicon carbide device

System and method for superconducting multi-chip module

Power semiconductor chip, method for producing a power semiconducto...

Reducing loss in stacked quantum devices

Silicon carbide device and method for forming a silicon carbide device

Superconducting bump bonds

Superconducting bump bonds

System and method for superconducting multi-chip module

Reducing loss in stacked quantum devices

Bump bonded cryogenic chip carrier

Bump bonded cryogenic chip carrier

Superconducting bump bonds

Superconducting bump bonds

Systems and methods for testing and packaging a superconducting chip

Semiconductor element, semiconductor device and method for manufact...

Semiconductor device

Semiconductor device with a layer including niobium, and/or tantalu...

Manufacturing method of semiconductor device

Semiconductor devices including an alloy layer and a wetting layer...

Semiconductor devices and methods for manufacturing the same

Semiconductor device having semiconductor element with copper pad m...

Method for forming bonding pad structures in semiconductor devices

Structure and method for corrosion and stress-resistant interconnec...

Structure and method for a superbarrier to prevent diffusion betwee...

Structure and method for a superbarrier to prevent diffusion betwee...

Structure and method for corrosion and stress-resistant interconnec...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME

Silicon Carbide Device and Method for Forming a Silicon Carbide Device

SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE

REWORKABLE INTER-SUBSTRATE BOND STRUCTURE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

REDUCING LOSS IN STACKED QUANTUM DEVICES

ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE

Silicon Carbide Device and Method for Forming a Silicon Carbide Device

SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE

REDUCING LOSS IN STACKED QUANTUM DEVICES

SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE

REDUCING LOSS IN STACKED QUANTUM DEVICES

BUMP BONDED CRYOGENIC CHIP CARRIER

BUMP BONDED CRYOGENIC CHIP CARRIER

SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACT...

SYSTEMS AND METHODS FOR TESTING AND PACKAGING A SUPERCONDUCTING CHIP

Semiconductor Device and Bonding Wire

LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS

Nitride-based semiconductor light-emitting device and method of man...

Manufacturing method of semiconductor device

Semiconductor device and method of fabricating the same

Semiconductor devices and methods for manufacturing the same

Micromechanical device contact terminals free of particle generation

Semiconductor devices and methods for manufacturing the same

Semiconductor devices and methods for manufacturing the same