Niobium [Nb] as principal constituent

Industry

CPC
H01L2224/05179

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05179Niobium [Nb] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Reducing loss in stacked quantum devices
- Patent number 11,955,465
- Issue date Apr 9, 2024
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Array substrate, display panel and display device
- Patent number 11,942,443
- Issue date Mar 26, 2024
- HEFEI BOE DISPLAY TECHNOLOGY CO., LTD.
- Chunxu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide device and method for forming a silicon carbide device
- Patent number 11,869,840
- Issue date Jan 9, 2024
- Infineon Technologies AG
- Ralf Siemieniec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for superconducting multi-chip module
- Patent number 11,711,985
- Issue date Jul 25, 2023
- SeeQC Inc.
- Daniel Yohannes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip, method for producing a power semiconducto...
- Patent number 11,664,335
- Issue date May 30, 2023
- Semikron Elektronik GmbH & Co., KG
- Wolfgang-Michael Schulz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing loss in stacked quantum devices
- Patent number 11,569,205
- Issue date Jan 31, 2023
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Silicon carbide device and method for forming a silicon carbide device
- Patent number 11,367,683
- Issue date Jun 21, 2022
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 11,133,450
- Issue date Sep 28, 2021
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 11,133,451
- Issue date Sep 28, 2021
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for superconducting multi-chip module
- Patent number 11,121,302
- Issue date Sep 14, 2021
- Daniel Yohannes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing loss in stacked quantum devices
- Patent number 10,978,425
- Issue date Apr 13, 2021
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,734,567
- Issue date Aug 4, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,727,391
- Issue date Jul 28, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 10,497,853
- Issue date Dec 3, 2019
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 10,468,579
- Issue date Nov 5, 2019
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for testing and packaging a superconducting chip
- Patent number 9,865,648
- Issue date Jan 9, 2018
- D-Wave Systems Inc.
- Paul I. Bunyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element, semiconductor device and method for manufact...
- Patent number 9,553,063
- Issue date Jan 24, 2017
- Mitsubishi Electric Corporation
- Kenji Ohtsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,355,937
- Issue date May 31, 2016
- Mitsubishi Electric Corporation
- Hidetoshi Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a layer including niobium, and/or tantalu...
- Patent number 8,836,120
- Issue date Sep 16, 2014
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,759,177
- Issue date Jul 20, 2010
- Semiconductor Energy Laboratory Co., Ltd.
- Hidekazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including an alloy layer and a wetting layer...
- Patent number 7,091,609
- Issue date Aug 15, 2006
- Seiko Epson Corporation
- Kazuki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for manufacturing the same
- Patent number 6,812,123
- Issue date Nov 2, 2004
- Seiko Epson Corporation
- Kazuki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor element with copper pad m...
- Patent number 6,798,050
- Issue date Sep 28, 2004
- Kabushiki Kaisha Toshiba
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming bonding pad structures in semiconductor devices
- Patent number 6,723,628
- Issue date Apr 20, 2004
- Seiko Epson Corporation
- Kazuki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for corrosion and stress-resistant interconnec...
- Patent number 5,442,239
- Issue date Aug 15, 1995
- International Business Machines Corporation
- Giulio DiGiacomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for a superbarrier to prevent diffusion betwee...
- Patent number 5,420,073
- Issue date May 30, 1995
- International Business Machines Corporation
- Giulio DiGiacomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for a superbarrier to prevent diffusion betwee...
- Patent number 5,367,195
- Issue date Nov 22, 1994
- International Business Machines Corporation
- Giulio DiGiacomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for corrosion and stress-resistant interconnec...
- Patent number 5,175,609
- Issue date Dec 29, 1992
- International Business Machines Corporation
- Giulio DiGiacomo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240243028
- Publication date Jul 18, 2024
- Innolux Corporation
- Ming-Chih Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Device and Method for Forming a Silicon Carbide Device
- Publication number 20240113026
- Publication date Apr 4, 2024
- INFINEON TECHNOLOGIES AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REWORKABLE INTER-SUBSTRATE BOND STRUCTURE
- Publication number 20230378126
- Publication date Nov 23, 2023
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE
- Publication number 20230380302
- Publication date Nov 23, 2023
- Daniel Yohannes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20230317649
- Publication date Oct 5, 2023
- Fuji Electric Co., Ltd.
- Masahide GOTOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING LOSS IN STACKED QUANTUM DEVICES
- Publication number 20230178519
- Publication date Jun 8, 2023
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20220293539
- Publication date Sep 15, 2022
- Hefei BOE Display Technology Co., Ltd.
- Chunxu ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Device and Method for Forming a Silicon Carbide Device
- Publication number 20220285283
- Publication date Sep 8, 2022
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE
- Publication number 20210408355
- Publication date Dec 30, 2021
- Daniel Yohannes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING LOSS IN STACKED QUANTUM DEVICES
- Publication number 20210233896
- Publication date Jul 29, 2021
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE
- Publication number 20200119251
- Publication date Apr 16, 2020
- Daniel Yohannes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING LOSS IN STACKED QUANTUM DEVICES
- Publication number 20190229094
- Publication date Jul 25, 2019
- Google LLC
- Theodore Charles White
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BUMP BONDED CRYOGENIC CHIP CARRIER
- Publication number 20190131509
- Publication date May 2, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BONDED CRYOGENIC CHIP CARRIER
- Publication number 20190103541
- Publication date Apr 4, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACT...
- Publication number 20140312361
- Publication date Oct 23, 2014
- MITSUBISHI ELECTRIC CORPORATION
- Kenji Ohtsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR TESTING AND PACKAGING A SUPERCONDUCTING CHIP
- Publication number 20140246763
- Publication date Sep 4, 2014
- D-WAVE SYSTEMS INC.
- Paul I. Bunyk
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Device and Bonding Wire
- Publication number 20120267784
- Publication date Oct 25, 2012
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS
- Publication number 20120068345
- Publication date Mar 22, 2012
- INFINEON TECHNOLOGIES AG
- Tobias Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nitride-based semiconductor light-emitting device and method of man...
- Publication number 20070051968
- Publication date Mar 8, 2007
- Shuichiro Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor device
- Publication number 20070037337
- Publication date Feb 15, 2007
- Semiconductor Energy Laboratory Co., Ltd
- Hidekazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of fabricating the same
- Publication number 20040238955
- Publication date Dec 2, 2004
- KABUSHIKI KAISHA TOSHIBA
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices and methods for manufacturing the same
- Publication number 20040169274
- Publication date Sep 2, 2004
- Kazuki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical device contact terminals free of particle generation
- Publication number 20030107137
- Publication date Jun 12, 2003
- Roger J. Stierman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor devices and methods for manufacturing the same
- Publication number 20010051422
- Publication date Dec 13, 2001
- Kazuki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices and methods for manufacturing the same
- Publication number 20010033028
- Publication date Oct 25, 2001
- Kazumi Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS

Niobium [Nb] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Reducing loss in stacked quantum devices

Array substrate, display panel and display device

Silicon carbide device and method for forming a silicon carbide device

System and method for superconducting multi-chip module

Power semiconductor chip, method for producing a power semiconducto...

Reducing loss in stacked quantum devices

Silicon carbide device and method for forming a silicon carbide device

Superconducting bump bonds

Superconducting bump bonds

System and method for superconducting multi-chip module

Reducing loss in stacked quantum devices

Bump bonded cryogenic chip carrier

Bump bonded cryogenic chip carrier

Superconducting bump bonds

Superconducting bump bonds

Systems and methods for testing and packaging a superconducting chip

Semiconductor element, semiconductor device and method for manufact...

Semiconductor device

Semiconductor device with a layer including niobium, and/or tantalu...

Manufacturing method of semiconductor device

Semiconductor devices including an alloy layer and a wetting layer...

Semiconductor devices and methods for manufacturing the same

Semiconductor device having semiconductor element with copper pad m...

Method for forming bonding pad structures in semiconductor devices

Structure and method for corrosion and stress-resistant interconnec...

Structure and method for a superbarrier to prevent diffusion betwee...

Structure and method for a superbarrier to prevent diffusion betwee...

Structure and method for corrosion and stress-resistant interconnec...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME

Silicon Carbide Device and Method for Forming a Silicon Carbide Device

REWORKABLE INTER-SUBSTRATE BOND STRUCTURE

SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

REDUCING LOSS IN STACKED QUANTUM DEVICES

ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE

Silicon Carbide Device and Method for Forming a Silicon Carbide Device

SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE

REDUCING LOSS IN STACKED QUANTUM DEVICES

SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE

REDUCING LOSS IN STACKED QUANTUM DEVICES

BUMP BONDED CRYOGENIC CHIP CARRIER

BUMP BONDED CRYOGENIC CHIP CARRIER

SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACT...

SYSTEMS AND METHODS FOR TESTING AND PACKAGING A SUPERCONDUCTING CHIP

Semiconductor Device and Bonding Wire

LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS

Nitride-based semiconductor light-emitting device and method of man...

Manufacturing method of semiconductor device

Semiconductor device and method of fabricating the same

Semiconductor devices and methods for manufacturing the same

Micromechanical device contact terminals free of particle generation

Semiconductor devices and methods for manufacturing the same

Semiconductor devices and methods for manufacturing the same