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Niobium [Nb] as principal constituent
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CPC
H01L2224/29479
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/29479
Niobium [Nb] as principal constituent
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Patent Application
Method for Producing a Metal Layer on a Substrate and Device
Publication number
20120292773
Publication date
Nov 22, 2012
INFINEON TECHNOLOGIES AG
Khalil Hosseini
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...