Nitrogen [N]

Industry

CPC
H01L2924/01007

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01007Nitrogen [N]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Hybrid manufacturing for integrated circuit devices and assemblies
- Patent number 11,817,442
- Issue date Nov 14, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid manufacturing of microeletronic assemblies with first and se...
- Patent number 11,756,886
- Issue date Sep 12, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure to prevent metal redeposit and to prevent bond pad c...
- Patent number 11,735,550
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,515,202
- Issue date Nov 29, 2022
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device load terminal
- Patent number 11,315,892
- Issue date Apr 26, 2022
- Infineon Technologies AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,289,372
- Issue date Mar 29, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure to prevent metal redeposit and to prevent bond pad c...
- Patent number 11,211,352
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 11,031,310
- Issue date Jun 8, 2021
- QUALCOMM Incorporated
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,011,418
- Issue date May 18, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a composite barrier layer
- Patent number 10,665,556
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a die
- Patent number 10,340,227
- Issue date Jul 2, 2019
- Infineon Technologies AG
- Markus Zundel
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Tooling for coupling multiple electronic chips
- Patent number 10,340,239
- Issue date Jul 2, 2019
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 10,312,217
- Issue date Jun 4, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding using plasma gas
- Patent number 10,297,567
- Issue date May 21, 2019
- Intel Corporation
- Donglai David Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for gap filling improvement
- Patent number 10,283,359
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Company Limited
- Chi-Yuan Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device
- Patent number 10,163,850
- Issue date Dec 25, 2018
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D IC method and device
- Patent number 10,147,641
- Issue date Dec 4, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent bonding of wafers
- Patent number 10,083,933
- Issue date Sep 25, 2018
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device load terminal
- Patent number 10,079,217
- Issue date Sep 18, 2018
- Infineon Technologies AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for fabricating the same
- Patent number 9,899,284
- Issue date Feb 20, 2018
- QUALCOMM Incorporated
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package having patterned insulation metal substrate
- Patent number 9,865,531
- Issue date Jan 9, 2018
- Delta Electronics, Inc.
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with composite barrier layer under redistri...
- Patent number 9,824,987
- Issue date Nov 21, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,780,069
- Issue date Oct 3, 2017
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tooling for coupling multiple electronic chips
- Patent number 9,754,907
- Issue date Sep 5, 2017
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic system
- Patent number 9,748,449
- Issue date Aug 29, 2017
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 9,716,033
- Issue date Jul 25, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding using boron and nitrogen based bonding stack
- Patent number 9,640,514
- Issue date May 2, 2017
- GLOBALFOUNDRIES Inc.
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 9,612,615
- Issue date Apr 4, 2017
- QUALCOMM Incorporated
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor integrated circuit device having protective split at...
- Patent number 9,536,821
- Issue date Jan 3, 2017
- Renesas Electronics Corporation
- Takuro Homma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTOELECTRONIC SYSTEM
- Publication number 20240421266
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS THEREOF
- Publication number 20240242999
- Publication date Jul 18, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Jeffrey Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES
- Publication number 20240030213
- Publication date Jan 25, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGE INTERCONNECTS AND METHODS FOR FORMING THE SAME
- Publication number 20230058704
- Publication date Feb 23, 2023
- TOKYO ELECTRON LIMITED
- Robert D. Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES
- Publication number 20220181256
- Publication date Jun 9, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES
- Publication number 20220181313
- Publication date Jun 9, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE TO PREVENT METAL REDEPOSIT AND TO PREVENT BOND PAD C...
- Publication number 20220115349
- Publication date Apr 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20210313225
- Publication date Oct 7, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20210280461
- Publication date Sep 9, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE TO PREVENT METAL REDEPOSIT AND TO PREVENT BOND PAD C...
- Publication number 20210098405
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20190148222
- Publication date May 16, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT BONDING OF WAFERS
- Publication number 20190006313
- Publication date Jan 3, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE LOAD TERMINAL
- Publication number 20180366428
- Publication date Dec 20, 2018
- INFINEON TECHNOLOGIES AG
- Roman ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20180158746
- Publication date Jun 7, 2018
- QUALCOMM Incorporated
- Mou-Shiung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180122765
- Publication date May 3, 2018
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180068963
- Publication date Mar 8, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS
- Publication number 20180033754
- Publication date Feb 1, 2018
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180005981
- Publication date Jan 4, 2018
- Rohm Co., Ltd.
- Motoharu HAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTOELECTRONIC SYSTEM
- Publication number 20170324009
- Publication date Nov 9, 2017
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20170316971
- Publication date Nov 2, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE HAVING PATTERNED INSULATION METAL SUBSTRATE
- Publication number 20170317014
- Publication date Nov 2, 2017
- Delta Electronics, Inc.
- Hsin-Chang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE LOAD TERMINAL
- Publication number 20170221842
- Publication date Aug 3, 2017
- INFINEON TECHNOLOGIES AG
- Roman ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Gap Filling Improvement
- Publication number 20170221710
- Publication date Aug 3, 2017
- Taiwan Semiconductor Manufacturing Company Limited
- Chi-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING USING PLASMA GAS
- Publication number 20170179070
- Publication date Jun 22, 2017
- Donglai David Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS
- Publication number 20160322320
- Publication date Nov 3, 2016
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A DIE
- Publication number 20160284648
- Publication date Sep 29, 2016
- INFINEON TECHNOLOGIES AG
- Markus ZUNDEL
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20160254357
- Publication date Sep 1, 2016
- Masatoshi AKETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT BONDING OF WAFERS
- Publication number 20160111394
- Publication date Apr 21, 2016
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20160086913
- Publication date Mar 24, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTRURE WITH COMPOSITE BARRIER LAYER UNDER REDISTR...
- Publication number 20150333021
- Publication date Nov 19, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yu WU
- H01 - BASIC ELECTRIC ELEMENTS

Nitrogen [N]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hybrid manufacturing for integrated circuit devices and assemblies

Hybrid manufacturing of microeletronic assemblies with first and se...

Bump structure to prevent metal redeposit and to prevent bond pad c...

3D IC method and device

Power semiconductor device load terminal

3D IC method and device

Method of making a pillar structure having a non-metal sidewall pro...

Bump structure to prevent metal redeposit and to prevent bond pad c...

Chip package

3D IC method and device

Semiconductor structure having a composite barrier layer

Method for processing a die

Tooling for coupling multiple electronic chips

Method for low temperature bonding and bonded structure

Thermocompression bonding using plasma gas

Systems and methods for gap filling improvement

Semiconductor device

3D IC method and device

Method for permanent bonding of wafers

Power semiconductor device load terminal

Chip package and method for fabricating the same

Power module package having patterned insulation metal substrate

Semiconductor structure with composite barrier layer under redistri...

Semiconductor device

Tooling for coupling multiple electronic chips

Optoelectronic system

3D IC method and device

Wafer bonding using boron and nitrogen based bonding stack

Integrated circuit chip using top post-passivation technology and b...

Semiconductor integrated circuit device having protective split at...

Patents Applicationslast 30 patents

OPTOELECTRONIC SYSTEM

SEMICONDUCTOR PACKAGES AND METHODS THEREOF

HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES

PHASE CHANGE INTERCONNECTS AND METHODS FOR FORMING THE SAME

HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES

HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES

BUMP STRUCTURE TO PREVENT METAL REDEPOSIT AND TO PREVENT BOND PAD C...

3D IC METHOD AND DEVICE

3D IC METHOD AND DEVICE

BUMP STRUCTURE TO PREVENT METAL REDEPOSIT AND TO PREVENT BOND PAD C...

3D IC METHOD AND DEVICE

METHOD FOR PERMANENT BONDING OF WAFERS

POWER SEMICONDUCTOR DEVICE LOAD TERMINAL

CHIP PACKAGE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS

SEMICONDUCTOR DEVICE

OPTOELECTRONIC SYSTEM

3D IC METHOD AND DEVICE

POWER MODULE PACKAGE HAVING PATTERNED INSULATION METAL SUBSTRATE

POWER SEMICONDUCTOR DEVICE LOAD TERMINAL

Systems and Methods for Gap Filling Improvement

THERMOCOMPRESSION BONDING USING PLASMA GAS

TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS

METHOD FOR PROCESSING A DIE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

METHOD FOR PERMANENT BONDING OF WAFERS

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

SEMICONDUCTOR STRUCTRURE WITH COMPOSITE BARRIER LAYER UNDER REDISTR...