Noble-metal alloys

Industry

CPC
H01L23/53247

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/53247Noble-metal alloys

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 11,462,476
- Issue date Oct 4, 2022
- TDK ELECTRONICS AG
- Thomas Feichtinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device including a graphene barrie...
- Patent number 11,302,576
- Issue date Apr 12, 2022
- Tokyo Electron Limited
- Makoto Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned wafer solder diffusion barrier
- Patent number 10,861,792
- Issue date Dec 8, 2020
- Raytheon Company
- Paul J. Duval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising silver
- Patent number 10,862,030
- Issue date Dec 8, 2020
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing cobalt capped copper lin...
- Patent number 10,748,966
- Issue date Aug 18, 2020
- SanDisk Technologies LLC
- Satoru Mayuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with improved reliability
- Patent number 10,707,858
- Issue date Jul 7, 2020
- Cree, Inc.
- Mrinal K. Das
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
BEOL integration with advanced interconnects
- Patent number 10,541,199
- Issue date Jan 21, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus installing passive device
- Patent number 10,475,777
- Issue date Nov 12, 2019
- Sumitomo Electric Device Innovations, Inc.
- Akitada Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure of a semiconductor device
- Patent number 10,461,050
- Issue date Oct 29, 2019
- Fuji Electric Co., Ltd.
- Hidekazu Tanisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit substrate and method of producing thereof
- Patent number 10,461,004
- Issue date Oct 29, 2019
- QDOS FLEXCIRCUITS SDN BHD
- Zalina Binti Abdullah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including silver conductive materials
- Patent number 10,411,186
- Issue date Sep 10, 2019
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with core substrate having a through hole
- Patent number 10,170,410
- Issue date Jan 1, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt first layer advanced metallization for interconnects
- Patent number 10,170,424
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt first layer advanced metallization for interconnects
- Patent number 10,163,793
- Issue date Dec 25, 2018
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of advanced interconnects including set of metal conducto...
- Patent number 10,115,670
- Issue date Oct 30, 2018
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with improved reliability
- Patent number 9,998,109
- Issue date Jun 12, 2018
- Cree, Inc.
- Mrinal K. Das
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Ag alloy film for reflecting electrode or wiring electrode, reflect...
- Patent number 9,947,429
- Issue date Apr 17, 2018
- Kobe Steel, Ltd.
- Yoko Shida
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Interconnects based on subtractive etching of silver
- Patent number 9,911,648
- Issue date Mar 6, 2018
- International Business Machines Corporation
- Brett C. Baker-O'Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,875,965
- Issue date Jan 23, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Guangcai Fu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of forming conductive elements of semiconductor devices and...
- Patent number 9,865,812
- Issue date Jan 9, 2018
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt first layer advanced metallization for interconnects
- Patent number 9,852,990
- Issue date Dec 26, 2017
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High quality electrical contacts between integrated circuit chips
- Patent number 9,646,882
- Issue date May 9, 2017
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection device
- Patent number 9,607,976
- Issue date Mar 28, 2017
- MURATA MANUFACTURING CO., LTD.
- Toshiyuki Nakaiso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising contact structures with protection...
- Patent number 9,590,056
- Issue date Mar 7, 2017
- GLOBALFOUNDRIES Inc.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level die attach metallization
- Patent number 9,536,783
- Issue date Jan 3, 2017
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and memory cells including conductive mate...
- Patent number 9,520,558
- Issue date Dec 13, 2016
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field-stop reverse conducting insulated gate bipolar transistor and...
- Patent number 9,443,926
- Issue date Sep 13, 2016
- CSMC Technologies FAB1 Co., Ltd.
- Shuo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level die to package and die to die interconnects suspended o...
- Patent number 9,385,083
- Issue date Jul 5, 2016
- HRL Laboratories, LLC
- Florian G. Herrault
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-level die attach metallization
- Patent number 8,970,010
- Issue date Mar 3, 2015
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride semiconductor element having m-plane angled semiconductor r...
- Patent number 8,933,543
- Issue date Jan 13, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Toshiya Yokogawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SELF-FORMED BARRIER METAL LAYER
- Publication number 20240006233
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Kang FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING METAL STRUCTURES HAVING A CURV...
- Publication number 20230369111
- Publication date Nov 16, 2023
- Samsung Electronics Co., Ltd.
- Jaemyung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20220415825
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- Keunwook SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device
- Publication number 20210066199
- Publication date Mar 4, 2021
- TDK Electronics AG
- Thomas Feichtinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED WAFER SOLDER DIFFUSION BARRIER
- Publication number 20200312776
- Publication date Oct 1, 2020
- Raytheon Company
- Paul J. Duval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing the Same
- Publication number 20200303251
- Publication date Sep 24, 2020
- TOKYO ELECTRON LIMITED
- Makoto WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING COBALT CAPPED COPPER LIN...
- Publication number 20200006431
- Publication date Jan 2, 2020
- SANDISK TECHNOLOGIES LLC
- Satoru MAYUZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING SILVER
- Publication number 20190363253
- Publication date Nov 28, 2019
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL INTEGRATION WITH ADVANCED INTERCONNECTS
- Publication number 20190164885
- Publication date May 30, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH IMPROVED RELIABILITY
- Publication number 20180331679
- Publication date Nov 15, 2018
- Cree, Inc.
- Mrinal K. Das
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
DEVICES AND METHODS OF COBALT FILL METALLIZATION
- Publication number 20180174965
- Publication date Jun 21, 2018
- GLOBALFOUNDRIES INC.
- Vimal KAMINENI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SUBSTRATE AND METHOD OF PRODUCING THEREOF
- Publication number 20180151462
- Publication date May 31, 2018
- QDOS Flexcircuits Sdn Bhd
- ZALINA BINTI ABDULLAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING SILVER CONDUCTIVE MATERIALS
- Publication number 20180114901
- Publication date Apr 26, 2018
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180114765
- Publication date Apr 26, 2018
- Fuji Electric Co., Ltd.
- Hidekazu Tanisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT FIRST LAYER ADVANCED METALLIZATION FOR INTERCONNECTS
- Publication number 20180061768
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE MODULE USING THE SAME
- Publication number 20180053719
- Publication date Feb 22, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF ADVANCED INTERCONNECTS
- Publication number 20180053725
- Publication date Feb 22, 2018
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DUAL TRENCH EPITAXIAL DUAL-LINER CON...
- Publication number 20180005903
- Publication date Jan 4, 2018
- International Business Machines Corporation
- Veeraraghavan S. BASKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS INSTALLING PASSIVE DEVICE
- Publication number 20170141093
- Publication date May 18, 2017
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Akitada Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH QUALITY ELECTRICAL CONTACTS BETWEEN INTEGRATED CIRCUIT CHIPS
- Publication number 20170062273
- Publication date Mar 2, 2017
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160322303
- Publication date Nov 3, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- GUANGCAI FU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FIELD-STOP REVERSE CONDUCTING INSULATED GATE BIPOLAR TRANSISTOR AND...
- Publication number 20160240608
- Publication date Aug 18, 2016
- CSMC TECHNOLOGIES FAB1 CO., LTD.
- Shuo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING CONTACT STRUCTURES WITH PROTECTION...
- Publication number 20160099321
- Publication date Apr 7, 2016
- GLOBALFOUNDRIES INC.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150364462
- Publication date Dec 17, 2015
- TOSHIYUKI NAKAISO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM INTERCONNECTS WITH LARGE GRAINS
- Publication number 20150348832
- Publication date Dec 3, 2015
- International Business Machines Corporation
- Robert L. Bruce
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING CONTACT STRUCTURES WITH PROTECTION...
- Publication number 20140264641
- Publication date Sep 18, 2014
- GLOBALFOUNDRIES INC.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL DIE ATTACH METALLIZATION
- Publication number 20140264868
- Publication date Sep 18, 2014
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Corrosive Resistant Electronic Components
- Publication number 20140061637
- Publication date Mar 6, 2014
- Jason Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND MEMORY CELLS INCLUDING CONDUCTIVE MATE...
- Publication number 20130320291
- Publication date Dec 5, 2013
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-BONDED LED
- Publication number 20120256228
- Publication date Oct 11, 2012
- Industrial Technology Research Institute
- Hsiu Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS

Noble-metal alloys

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device

Method of making a semiconductor device including a graphene barrie...

Patterned wafer solder diffusion barrier

Semiconductor devices comprising silver

Three-dimensional memory device containing cobalt capped copper lin...

Power module with improved reliability

BEOL integration with advanced interconnects

Semiconductor apparatus installing passive device

Bonding pad structure of a semiconductor device

Integrated circuit substrate and method of producing thereof

Semiconductor devices including silver conductive materials

Semiconductor package with core substrate having a through hole

Cobalt first layer advanced metallization for interconnects

Cobalt first layer advanced metallization for interconnects

Formation of advanced interconnects including set of metal conducto...

Power module with improved reliability

Ag alloy film for reflecting electrode or wiring electrode, reflect...

Interconnects based on subtractive etching of silver

Semiconductor device

Methods of forming conductive elements of semiconductor devices and...

Cobalt first layer advanced metallization for interconnects

High quality electrical contacts between integrated circuit chips

Electrostatic discharge protection device

Semiconductor device comprising contact structures with protection...

Wafer-level die attach metallization

Semiconductor structures and memory cells including conductive mate...

Field-stop reverse conducting insulated gate bipolar transistor and...

Wafer-level die to package and die to die interconnects suspended o...

Wafer-level die attach metallization

Nitride semiconductor element having m-plane angled semiconductor r...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING A SELF-FORMED BARRIER METAL LAYER

INTEGRATED CIRCUIT DEVICES INCLUDING METAL STRUCTURES HAVING A CURV...

INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME

Electronic Device

PATTERNED WAFER SOLDER DIFFUSION BARRIER

Semiconductor Device and Method of Manufacturing the Same

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING COBALT CAPPED COPPER LIN...

SEMICONDUCTOR DEVICES COMPRISING SILVER

BEOL INTEGRATION WITH ADVANCED INTERCONNECTS

POWER MODULE WITH IMPROVED RELIABILITY

DEVICES AND METHODS OF COBALT FILL METALLIZATION

INTEGRATED CIRCUIT SUBSTRATE AND METHOD OF PRODUCING THEREOF

SEMICONDUCTOR DEVICES INCLUDING SILVER CONDUCTIVE MATERIALS

SEMICONDUCTOR DEVICE

COBALT FIRST LAYER ADVANCED METALLIZATION FOR INTERCONNECTS

SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE MODULE USING THE SAME

FORMATION OF ADVANCED INTERCONNECTS

SEMICONDUCTOR DEVICE INCLUDING DUAL TRENCH EPITAXIAL DUAL-LINER CON...

SEMICONDUCTOR APPARATUS INSTALLING PASSIVE DEVICE

HIGH QUALITY ELECTRICAL CONTACTS BETWEEN INTEGRATED CIRCUIT CHIPS

SEMICONDUCTOR DEVICE

FIELD-STOP REVERSE CONDUCTING INSULATED GATE BIPOLAR TRANSISTOR AND...

SEMICONDUCTOR DEVICE COMPRISING CONTACT STRUCTURES WITH PROTECTION...

SEMICONDUCTOR DEVICE

THIN FILM INTERCONNECTS WITH LARGE GRAINS

SEMICONDUCTOR DEVICE COMPRISING CONTACT STRUCTURES WITH PROTECTION...

WAFER-LEVEL DIE ATTACH METALLIZATION

Corrosive Resistant Electronic Components

SEMICONDUCTOR STRUCTURES AND MEMORY CELLS INCLUDING CONDUCTIVE MATE...

DIE-BONDED LED