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H01L2924/01108

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/01108Noble metals

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Patents Grantslast 30 patents

Information Patent Grant
Device packaging with substrates having embedded lines and metal de...
- Patent number 9,355,952
- Issue date May 31, 2016
- Intel Corporation
- Mark S Hlad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device packaging with substrates having embedded lines and metal de...
- Patent number 9,093,313
- Issue date Jul 28, 2015
- Intel Corporation
- Mark S Hlad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump, method for forming the bump, and method for mounting substrat...
- Patent number 8,962,471
- Issue date Feb 24, 2015
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging with substrates having embedded lines and metal de...
- Patent number 8,835,217
- Issue date Sep 16, 2014
- Intel Corporation
- Mark S Hlad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump, method for forming the bump, and method for mounting substrat...
- Patent number 8,492,894
- Issue date Jul 23, 2013
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Lead-Free Solder Alloy
- Publication number 20160074971
- Publication date Mar 17, 2016
- SENJU METAL INDUSTRY CO., LTD.
- Ken Tachibana
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...
- Publication number 20150008578
- Publication date Jan 8, 2015
- Intel Corporation
- Mark S. Hlad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
- Publication number 20140295619
- Publication date Oct 2, 2014
- Tanaka Kikinzoku Kogyo K.K.
- TOSHINORI OGASHIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...
- Publication number 20120161330
- Publication date Jun 28, 2012
- Intel Corporation
- Mark S. Hlad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
- Publication number 20110272802
- Publication date Nov 10, 2011
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS