Non-galvanic coupling

Industry

CPC
H01L2225/06531

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06531Non-galvanic coupling

Industries

Patents Grantslast 30 patents

Information Patent Grant
Scalable quantum processor design
- Patent number 12,086,689
- Issue date Sep 10, 2024
- Google LLC
- Julian Shaw Kelly
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Integrated circuit including a first semiconductor wafer and a seco...
- Patent number 12,062,641
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monitoring equipment for cables
- Patent number 12,002,349
- Issue date Jun 4, 2024
- Alcatel Submarine Networks
- Mathieu Duval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages including multiple d...
- Patent number 11,961,825
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Aparna U. Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming stacked semiconductors die assemblies
- Patent number 11,948,921
- Issue date Apr 2, 2024
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid felts of electrospun nanofibers
- Patent number RE49773
- Issue date Jan 2, 2024
- NANOPAREIL, LLC
- Todd J. Menkhaus
Information Patent Grant
Device, system and method for providing inductor structures
- Patent number 11,830,829
- Issue date Nov 28, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with back-side coils for wireless signal and...
- Patent number 11,823,977
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,817,422
- Issue date Nov 14, 2023
- Shinko Electric Industries Co., Ltd.
- Yohei Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,791,311
- Issue date Oct 17, 2023
- Nagase & Co., Ltd.
- Yoichiro Kurita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and electronic device for configuring signal pads between th...
- Patent number 11,748,545
- Issue date Sep 5, 2023
- I Shou University
- Yu-Jung Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and systems for improving power delivery and signaling in s...
- Patent number 11,728,315
- Issue date Aug 15, 2023
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,705,433
- Issue date Jul 18, 2023
- Renesas Electronics Corporation
- Yasutaka Nakashiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including a first semiconductor wafer and a seco...
- Patent number 11,658,157
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package with multiple dies
- Patent number 11,616,048
- Issue date Mar 28, 2023
- Texas Instruments Incorporated
- Thomas Dyer Bonifield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 11,495,579
- Issue date Nov 8, 2022
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages and related methods
- Patent number 11,456,284
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages and related methods...
- Patent number 11,410,973
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity coupling interconnect packaging systems and methods
- Patent number 11,398,465
- Issue date Jul 26, 2022
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages including surface mo...
- Patent number 11,393,794
- Issue date Jul 19, 2022
- Micron Technology, Inc.
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device, system and method for providing inductor structures
- Patent number 11,387,198
- Issue date Jul 12, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages including multiple d...
- Patent number 11,362,070
- Issue date Jun 14, 2022
- Micron Technology, Inc.
- Aparna U. Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for improving power delivery and signaling in s...
- Patent number 11,239,200
- Issue date Feb 1, 2022
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including control switches to reduce pin capac...
- Patent number 11,177,239
- Issue date Nov 16, 2021
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Shineng Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure with capacitive chip interconnection, method for ma...
- Patent number 11,114,414
- Issue date Sep 7, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed, high density, low power die interconnect system
- Patent number 11,069,571
- Issue date Jul 20, 2021
- Gula Consulting Limited Liability Company
- Ernest E. Hollis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including a first semiconductor wafer and a seco...
- Patent number 11,043,473
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,991,673
- Issue date Apr 27, 2021
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High speed, high density, low power die interconnect system
- Patent number 10,872,816
- Issue date Dec 22, 2020
- Gula Consulting Limited Liabiity Company
- Ernest E. Hollis
- G02 - OPTICS
Information Patent Grant
Semiconductor devices with back-side coils for wireless signal and...
- Patent number 10,872,843
- Issue date Dec 22, 2020
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240332259
- Publication date Oct 3, 2024
- Rohm Co., Ltd.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES, STACKED SEMICONDUCTOR DIE ASSEMB...
- Publication number 20240186295
- Publication date Jun 6, 2024
- Lodestar Licensing Group LLC
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE COUPLING SYSTEM AND METHOD FOR ADAPTIVE CONTROL OF POWER...
- Publication number 20240162751
- Publication date May 16, 2024
- ZHEJIANG UNIVERSITY
- Xiaolei Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERPENDICULAR SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS
- Publication number 20240063184
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURIN...
- Publication number 20230299052
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Lin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH MULTIPLE DIES
- Publication number 20230230961
- Publication date Jul 20, 2023
- TEXAS INSTRUMENTS INCORPORATED
- THOMAS DYER BONIFIELD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230085314
- Publication date Mar 16, 2023
- KIOXIA Corporation
- Masayuki KITAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...
- Publication number 20230040454
- Publication date Feb 9, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230023018
- Publication date Jan 26, 2023
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS
- Publication number 20230008292
- Publication date Jan 12, 2023
- Micron Technology, Inc.
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING INTEGRATED THIN FILM CAPACITORS
- Publication number 20220392855
- Publication date Dec 8, 2022
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...
- Publication number 20220375902
- Publication date Nov 24, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES INCLUDING MULTIPLE D...
- Publication number 20220302090
- Publication date Sep 22, 2022
- Micron Technology, Inc.
- Aparna U. Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, SYSTEM AND METHOD FOR PROVIDING INDUCTOR STRUCTURES
- Publication number 20220302051
- Publication date Sep 22, 2022
- Intel Corporation
- Wilfred GOMES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING POWER DELIVERY AND SIGNALING IN S...
- Publication number 20220122943
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM
- Publication number 20220115268
- Publication date Apr 14, 2022
- Gula Consulting Limited Liability Company
- Ernest E. Hollis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE AND VR CHIPLET WITH DUAL-SIDED AND UNIDIRECTIONAL CURRE...
- Publication number 20220093565
- Publication date Mar 24, 2022
- Intel Corporation
- Kaladhar RADHAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUC...
- Publication number 20220028838
- Publication date Jan 27, 2022
- Qorvo US, Inc.
- John Robert Siomkos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURIN...
- Publication number 20210305213
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Lin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES INCLUDING MULTIPLE D...
- Publication number 20210118849
- Publication date Apr 22, 2021
- Micron Technology, Inc.
- Aparna U. Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES INCLUDING SURFACE MO...
- Publication number 20210118851
- Publication date Apr 22, 2021
- Micron Technology, Inc.
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...
- Publication number 20210118852
- Publication date Apr 22, 2021
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS
- Publication number 20210118850
- Publication date Apr 22, 2021
- Micron Technology, Inc.
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH BACK-SIDE COILS FOR WIRELESS SIGNAL AND...
- Publication number 20210104451
- Publication date Apr 8, 2021
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...
- Publication number 20210035954
- Publication date Feb 4, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Structure, Method For Manufacturing The Same, And Chip Structure
- Publication number 20210028151
- Publication date Jan 28, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, SYSTEM AND METHOD FOR PROVIDING INDUCTOR STRUCTURES
- Publication number 20200258852
- Publication date Aug 13, 2020
- Intel Corporation
- Wilfred GOMES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200152601
- Publication date May 14, 2020
- Shinko Electric Industries Co., Ltd.
- Yohei Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURIN...
- Publication number 20200126952
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Lin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200035646
- Publication date Jan 30, 2020
- Kabushiki Kaisha Toshiba
- Yoichiro KURITA
- G11 - INFORMATION STORAGE

Non-galvanic coupling

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Scalable quantum processor design

Integrated circuit including a first semiconductor wafer and a seco...

Monitoring equipment for cables

Microelectronic device assemblies and packages including multiple d...

Methods of forming stacked semiconductors die assemblies

Hybrid felts of electrospun nanofibers

Device, system and method for providing inductor structures

Semiconductor devices with back-side coils for wireless signal and...

Semiconductor device

Electronic device

Method and electronic device for configuring signal pads between th...

Methods and systems for improving power delivery and signaling in s...

Semiconductor device

Integrated circuit including a first semiconductor wafer and a seco...

IC package with multiple dies

Capacitive coupling in a direct-bonded interface for microelectroni...

Microelectronic device assemblies and packages and related methods

Microelectronic device assemblies and packages and related methods...

Proximity coupling interconnect packaging systems and methods

Microelectronic device assemblies and packages including surface mo...

Device, system and method for providing inductor structures

Microelectronic device assemblies and packages including multiple d...

Methods and systems for improving power delivery and signaling in s...

Semiconductor device including control switches to reduce pin capac...

Wafer structure with capacitive chip interconnection, method for ma...

High speed, high density, low power die interconnect system

Integrated circuit including a first semiconductor wafer and a seco...

Electronic device

High speed, high density, low power die interconnect system

Semiconductor devices with back-side coils for wireless signal and...

Patents Applicationslast 30 patents

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

MICROELECTRONIC DEVICE ASSEMBLIES, STACKED SEMICONDUCTOR DIE ASSEMB...

INDUCTIVE COUPLING SYSTEM AND METHOD FOR ADAPTIVE CONTROL OF POWER...

PERPENDICULAR SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS

INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURIN...

IC PACKAGE WITH MULTIPLE DIES

SEMICONDUCTOR DEVICE

CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...

SEMICONDUCTOR DEVICE

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS

MICROELECTRONIC ASSEMBLIES HAVING INTEGRATED THIN FILM CAPACITORS

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES INCLUDING MULTIPLE D...

DEVICE, SYSTEM AND METHOD FOR PROVIDING INDUCTOR STRUCTURES

METHODS AND SYSTEMS FOR IMPROVING POWER DELIVERY AND SIGNALING IN S...

HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM

STACKED DIE AND VR CHIPLET WITH DUAL-SIDED AND UNIDIRECTIONAL CURRE...

DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUC...

INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURIN...

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES INCLUDING MULTIPLE D...

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES INCLUDING SURFACE MO...

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS

SEMICONDUCTOR DEVICES WITH BACK-SIDE COILS FOR WIRELESS SIGNAL AND...

CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...

Wafer Structure, Method For Manufacturing The Same, And Chip Structure

DEVICE, SYSTEM AND METHOD FOR PROVIDING INDUCTOR STRUCTURES

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURIN...

ELECTRONIC DEVICE