Non-volatile random-access memory [NVRAM]

Industry

CPC
H01L2924/1443

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1443Non-volatile random-access memory [NVRAM]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Shielding of packaged magnetic random access memory
- Patent number 12,278,195
- Issue date Apr 15, 2025
- Avalanche Technology, Inc.
- Zihui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on multichip package comprising standard commodit...
- Patent number 12,278,192
- Issue date Apr 15, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices and related methods of forming a memory device
- Patent number 12,261,111
- Issue date Mar 25, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- G11 - INFORMATION STORAGE
Information Patent Grant
Interposers for microelectronic devices
- Patent number 12,230,583
- Issue date Feb 18, 2025
- Micron Technology, Inc.
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC and AC magnetic field protection for MRAM device using magnetic-...
- Patent number 12,218,074
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic device assemblies and packages
- Patent number 12,199,068
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing optically accessible co-packaged optics
- Patent number 12,197,023
- Issue date Jan 14, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with logic circuits and memor...
- Patent number 12,183,699
- Issue date Dec 31, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip package based on vertical-through-via connector
- Patent number 12,176,278
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive with brain-like elasticity and integrality based on sta...
- Patent number 12,176,902
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,094,847
- Issue date Sep 17, 2024
- Samsung Electronics Co., Ltd.
- Seyeong Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial through via with novel high isolation cross coupling method...
- Patent number 12,074,125
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive using standard commodity programmable logic IC chips co...
- Patent number 12,057,837
- Issue date Aug 6, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Microelectronic device assemblies and packages including multiple d...
- Patent number 11,961,825
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Aparna U. Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming stacked semiconductors die assemblies
- Patent number 11,948,921
- Issue date Apr 2, 2024
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a microelectronic device
- Patent number 11,929,323
- Issue date Mar 12, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- G11 - INFORMATION STORAGE
Information Patent Grant
First fire and cold start in memories with threshold switching sele...
- Patent number 11,894,037
- Issue date Feb 6, 2024
- SanDisk Technologies LLC
- Michael Grobis
- G11 - INFORMATION STORAGE
Information Patent Grant
Logic drive based on multichip package comprising standard commodit...
- Patent number 11,869,847
- Issue date Jan 9, 2024
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,854,925
- Issue date Dec 26, 2023
- Kioxia Corporation
- Satoshi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,824,033
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Gyoyoung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers for microelectronic devices
- Patent number 11,824,010
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory with different word line hook up regions based...
- Patent number 11,817,150
- Issue date Nov 14, 2023
- SanDisk Technologies LLC
- Shiqian Shao
- G11 - INFORMATION STORAGE
Information Patent Grant
Hybrid bonding structures and semiconductor devices including the same
- Patent number 11,804,462
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active interposer for localized programmable integrated circuit rec...
- Patent number 11,784,794
- Issue date Oct 10, 2023
- Intel Corporation
- Peter John McElheny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,756,934
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuits, multi-chip package, and operatio...
- Patent number 11,749,355
- Issue date Sep 5, 2023
- Kioxia Corporation
- Daisaku Hiyamizu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory device structure
- Patent number 11,742,307
- Issue date Aug 29, 2023
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor module and method of manufacturing the same
- Patent number 11,722,800
- Issue date Aug 8, 2023
- Sony Group Corporation
- Shin Iwabuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC and AC magnetic field protection for MRAM device using magnetic-...
- Patent number 11,715,702
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive using standard commodity programmable logic IC chips co...
- Patent number 11,711,082
- Issue date Jul 25, 2023
- iCometrue Company Ltd.
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING A MEMORY DEVICE
- Publication number 20250218934
- Publication date Jul 3, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- G11 - INFORMATION STORAGE
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTERPOSER CHIP
- Publication number 20250210610
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK CHIP PACKAGE
- Publication number 20250183238
- Publication date Jun 5, 2025
- SK HYNIX INC.
- Dong Sop LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL MEMORY DEVICE
- Publication number 20250169080
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Bonjae KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP PACKAGE BASED ON VERTICAL-THROUGH-VIA CONNECTOR
- Publication number 20250125241
- Publication date Apr 17, 2025
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING OPTICALLY ACCESSIBLE CO-PACKAGED OPTICS
- Publication number 20250123452
- Publication date Apr 17, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118718
- Publication date Apr 10, 2025
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED MEMORY MRAM ARRAYS SHARING A COMMON DRIVER CIRCUIT AND METHO...
- Publication number 20250072010
- Publication date Feb 27, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Christopher PETTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062177
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Han Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...
- Publication number 20250006680
- Publication date Jan 2, 2025
- DUKSAN HI-METAL CO., LTD.
- Eun Kwang PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429192
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- CHAJEA JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429222
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240413104
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Sang Cheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404972
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Seyeong Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...
- Publication number 20240380401
- Publication date Nov 14, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- G11 - INFORMATION STORAGE
Information Patent Application
STRUCTURE INCLUDING PASSIVE COMPONENT TRAVERSING MULTIPLE SEMICONDU...
- Publication number 20240371809
- Publication date Nov 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Haritez Narisetty
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...
- Publication number 20240363560
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Feng Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240339420
- Publication date Oct 10, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- JU BIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...
- Publication number 20240321679
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Youngjoon KOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321823
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Donguk Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD...
- Publication number 20240321804
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Dowan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATION FOR MEMRISTOR-BASED HARDWARE ACCELERATORS
- Publication number 20240315053
- Publication date Sep 19, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- JINSUNG YOUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240304579
- Publication date Sep 12, 2024
- Macronix International Co., Ltd.
- Dai-Ying LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MEMORY AND CONTROL DIES
- Publication number 20240276740
- Publication date Aug 15, 2024
- SANDISK TECHNOLOGIES LLC
- Srinivasan Sivaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240234287
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES AND RELATED METHODS OF FORMING A MEMORY DEVICE
- Publication number 20240213150
- Publication date Jun 27, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240203900
- Publication date Jun 20, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES, STACKED SEMICONDUCTOR DIE ASSEMB...
- Publication number 20240186295
- Publication date Jun 6, 2024
- Lodestar Licensing Group LLC
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT
- Publication number 20240162192
- Publication date May 16, 2024
- International Business Machines Corporation
- Arvind Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240162184
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS

Non-volatile random-access memory [NVRAM]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Shielding of packaged magnetic random access memory

Logic drive based on multichip package comprising standard commodit...

Memory devices and related methods of forming a memory device

Interposers for microelectronic devices

DC and AC magnetic field protection for MRAM device using magnetic-...

Methods of forming microelectronic device assemblies and packages

Manufacturing optically accessible co-packaged optics

3D semiconductor device and structure with logic circuits and memor...

3D chip package based on vertical-through-via connector

Logic drive with brain-like elasticity and integrality based on sta...

Semiconductor package and method of manufacturing the same

Coaxial through via with novel high isolation cross coupling method...

Logic drive using standard commodity programmable logic IC chips co...

Microelectronic device assemblies and packages including multiple d...

Methods of forming stacked semiconductors die assemblies

Methods of forming a microelectronic device

First fire and cold start in memories with threshold switching sele...

Logic drive based on multichip package comprising standard commodit...

Semiconductor device and method of manufacturing semiconductor device

Semiconductor package and method of manufacturing the semiconductor...

Interposers for microelectronic devices

Non-volatile memory with different word line hook up regions based...

Hybrid bonding structures and semiconductor devices including the same

Active interposer for localized programmable integrated circuit rec...

Semiconductor structure and manufacturing method thereof

Semiconductor integrated circuits, multi-chip package, and operatio...

Semiconductor memory device structure

Semiconductor image sensor module and method of manufacturing the same

DC and AC magnetic field protection for MRAM device using magnetic-...

Logic drive using standard commodity programmable logic IC chips co...

Patents Applicationslast 30 patents

METHODS OF FORMING A MEMORY DEVICE

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTERPOSER CHIP

STACK CHIP PACKAGE

VERTICAL MEMORY DEVICE

3D CHIP PACKAGE BASED ON VERTICAL-THROUGH-VIA CONNECTOR

MANUFACTURING OPTICALLY ACCESSIBLE CO-PACKAGED OPTICS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

BONDED MEMORY MRAM ARRAYS SHARING A COMMON DRIVER CIRCUIT AND METHO...

SEMICONDUCTOR PACKAGE

SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...

STRUCTURE INCLUDING PASSIVE COMPONENT TRAVERSING MULTIPLE SEMICONDU...

COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...

SEMICONDUCTOR PACKAGE

HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD...

HETEROGENEOUS INTEGRATION FOR MEMRISTOR-BASED HARDWARE ACCELERATORS

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

INTEGRATED MEMORY AND CONTROL DIES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

MEMORY DEVICES AND RELATED METHODS OF FORMING A MEMORY DEVICE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

MICROELECTRONIC DEVICE ASSEMBLIES, STACKED SEMICONDUCTOR DIE ASSEMB...

STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT

SEMICONDUCTOR PACKAGE