not being interposed between the connector and the bonding area

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H01L2224/40496

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/40496not being interposed between the connector and the bonding area

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Patents Grantslast 30 patents

Information Patent Grant
Power module
- Patent number 10,559,538
- Issue date Feb 11, 2020
- Mitsubishi Electric Corporation
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,337,129
- Issue date May 10, 2016
- Rohm Co., Ltd.
- Koji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE
- Publication number 20170338190
- Publication date Nov 23, 2017
- Mitsubishi Electric Corporation
- Junji FUJINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140291828
- Publication date Oct 2, 2014
- Rohm Co., Ltd.
- Koji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS