not in direct contact with the bonding area

Industry

CPC
H01L2224/02233

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/02233not in direct contact with the bonding area

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package with metal-insulator-metal capacitor and method of manufact...
- Patent number 11,581,250
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with metal-insulator-metal capacitor and method of manufact...
- Patent number 10,971,441
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with metal-insulator-metal capacitor and method of manufact...
- Patent number 10,475,731
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with metal-insulator-metal capacitor and method of manufact...
- Patent number 10,276,484
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with metal-insulator-metal capacitor and method of manufact...
- Patent number 9,960,106
- Issue date May 1, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method thereof
- Patent number 9,373,597
- Issue date Jun 21, 2016
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,111,951
- Issue date Aug 18, 2015
- Seiko Instruments Inc.
- Keisuke Uemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor chip with supportive terminal...
- Patent number 8,647,974
- Issue date Feb 11, 2014
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode pad having a recessed portion
- Patent number 8,421,208
- Issue date Apr 16, 2013
- Panasonic Corporation
- Kouji Takemura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128218
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...
- Publication number 20220093555
- Publication date Mar 24, 2022
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, PAD STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20210233822
- Publication date Jul 29, 2021
- Changxin Memory Technologies, Inc.
- Chih-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACT...
- Publication number 20210217691
- Publication date Jul 15, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACT...
- Publication number 20200020623
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACT...
- Publication number 20190229048
- Publication date Jul 25, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ASSEMBLY WITH SPACER ELEMENT
- Publication number 20190206821
- Publication date Jul 4, 2019
- Intel Corporation
- Huxiao XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACT...
- Publication number 20180211908
- Publication date Jul 26, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140217594
- Publication date Aug 7, 2014
- Seiko Instruments Inc.
- Keisuke UEMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH SUPPORTIVE TERMINAL PAD
- Publication number 20120241985
- Publication date Sep 27, 2012
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20110309505
- Publication date Dec 22, 2011
- PANASONIC CORPORATION
- Kouji TAKEMURA
- H01 - BASIC ELECTRIC ELEMENTS

not in direct contact with the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package with metal-insulator-metal capacitor and method of manufact...

Package with metal-insulator-metal capacitor and method of manufact...

Package with metal-insulator-metal capacitor and method of manufact...

Package with metal-insulator-metal capacitor and method of manufact...

Package with metal-insulator-metal capacitor and method of manufact...

Chip package and method thereof

Semiconductor device

Method of fabricating a semiconductor chip with supportive terminal...

Electrode pad having a recessed portion

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...

SEMICONDUCTOR DEVICE, PAD STRUCTURE AND FABRICATION METHOD THEREOF

PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACT...

PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACT...

PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACT...

SUBSTRATE ASSEMBLY WITH SPACER ELEMENT

PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACT...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP WITH SUPPORTIVE TERMINAL PAD

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME