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  • H05K2201/1084
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/1084Notched leads
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER
    • Publication number 20220390488
    • Publication date Dec 8, 2022
    • JF Microtechnology Sdn. Bhd.
    • Wei Kuong FOONG
    • G01 - MEASURING TESTING
  • Information Patent Application

    SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER
    • Publication number 20220151063
    • Publication date May 12, 2022
    • JF Microtechnology Sdn. Bhd.
    • Wei Kuong FOONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER
    • Publication number 20210392746
    • Publication date Dec 16, 2021
    • JF Microtechnology Sdn. Bhd.
    • Wei Kuong FOONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Electronic Device
    • Publication number 20150144985
    • Publication date May 28, 2015
    • Osram Opto Semiconductors GmbH
    • Michael Zitzlsperger
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC PART AND ELECTRONIC CONTROL UNIT
    • Publication number 20140240885
    • Publication date Aug 28, 2014
    • Murata Manufacturing Co., Ltd.
    • Yuuto KAMIYA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method and Apparatus for Converting Commerical Off-The-Shelf (COTS)...
    • Publication number 20140131307
    • Publication date May 15, 2014
    • Deepak Keshav Pai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR PRODUCING AN ELECTRONIC MODULE BY MEANS OF SEQUENTIAL FI...
    • Publication number 20130301231
    • Publication date Nov 14, 2013
    • VALEO SYSTEMES DE CONTROLE MOTEUR
    • Bruno Lefevre
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Planar Contact with Solder
    • Publication number 20130283608
    • Publication date Oct 31, 2013
    • Jack Seidler
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR PRODUCING AN ELECTRONIC MODULE BY SEQUENTIAL FIXATION OF...
    • Publication number 20130148320
    • Publication date Jun 13, 2013
    • Bruno Lefevre
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD UNIT
    • Publication number 20120181077
    • Publication date Jul 19, 2012
    • SHINANO KENSHI CO., LTD.
    • Kazuya MIYASAKA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Electronic Device
    • Publication number 20120111628
    • Publication date May 10, 2012
    • Michael Zitzlsperger
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    LEAD PLATE WITH A MOUNTING PORTION BEING HEAVIER THAN ITS JOINT POR...
    • Publication number 20120107648
    • Publication date May 3, 2012
    • Samsung SDI Co., Ltd
    • Bong-Young KIM
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    SURFACE MOUNTED CHIP RESISTOR WITH FLEXIBLE LEADS
    • Publication number 20110241819
    • Publication date Oct 6, 2011
    • VISHAY INTERNATIONAL, LTD.
    • Joseph Szwarc
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    CIRCUIT MODULE
    • Publication number 20110199744
    • Publication date Aug 18, 2011
    • Murata Manufacturing Co., Ltd.
    • Yoshihiro YAMAGUCHI
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    STRUCTURE OF LIGHT EMITTING DIODE AND METHOD TO ASSEMBLE THEREOF
    • Publication number 20110198663
    • Publication date Aug 18, 2011
    • EVERLIGHT YI-GUANG TECHNOLOGY (SHANGHAI) LTD
    • Sheng-Jia Sheu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead plate and protection circuit module having the same
    • Publication number 20110151730
    • Publication date Jun 23, 2011
    • Bong-Young Kim
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    PRINTED CIRCUIT BOARD TERMINAL AND PRINTED CIRCUIT BOARD CONNECTOR...
    • Publication number 20110111609
    • Publication date May 12, 2011
    • Sumitomo Wiring Systems, Ltd.
    • Hideki GOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BOARD TERMINAL
    • Publication number 20110051389
    • Publication date Mar 3, 2011
    • Sumitomo Wiring Systems, Ltd.
    • Hideki GOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor Device Having Grooved Leads to Confine Solder Wicking
    • Publication number 20110008936
    • Publication date Jan 13, 2011
    • TEXAS INSTRUMENTS INCORPORATED
    • John Tellkamp
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    LEAD FRAME WITH STITCHING-ASSISTING STRUCTURES, ELECTRONIC DEVICE H...
    • Publication number 20100302745
    • Publication date Dec 2, 2010
    • FU-BIAU HSU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER ATTACHED CONTACT AND A METHOD OF MANUFACTURING THE SAME
    • Publication number 20100304625
    • Publication date Dec 2, 2010
    • Yuji Nakamura
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    EMI SHIELD SPRING DEVICE
    • Publication number 20100261359
    • Publication date Oct 14, 2010
    • HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
    • MING-CHIH CHAN
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    PLANAR CONTACT WITH SOLDER
    • Publication number 20100236815
    • Publication date Sep 23, 2010
    • Interplex Industries, Inc.
    • Jack Seidler
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LEAD PIN FOR MOUNTING SEMICONDUCTOR AND PRINTED WIRING BOARD
    • Publication number 20100187004
    • Publication date Jul 29, 2010
    • IBIDEN CO., LTD.
    • Masanori KAWADE
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Metal shell, connector and connector assembly
    • Publication number 20100178803
    • Publication date Jul 15, 2010
    • ADVANCED-CONNECTEK INC.
    • Ming-Yung Chang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SURFACE MOUNTING COMPONENT
    • Publication number 20100172114
    • Publication date Jul 8, 2010
    • Sumida Corporation
    • Tsuyoshi Sato
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Anchor pin lead frame
    • Publication number 20100147558
    • Publication date Jun 17, 2010
    • Harry Pon
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Semiconductor Package Leads Having Grooved Contact Areas
    • Publication number 20100133693
    • Publication date Jun 3, 2010
    • TEXAS INSTRUMENTS INCORPORATED
    • Mohamad Ashraf Mohd ARSHAD
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    RESIN-MOLDED ARTICLE FIT WITH A METAL PLATE
    • Publication number 20100124665
    • Publication date May 20, 2010
    • SUMITOMO WIRING SYSTEMS, LTD.
    • Akihito Maegawa
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SWITCH
    • Publication number 20100032271
    • Publication date Feb 11, 2010
    • SMK Corporation
    • Masataka Maehara
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...