This application claims priority from Japanese Patent Application No. 2008-204393, filed Aug. 7, 2008, which is incorporated by reference herein in its entirety.
The present invention relates to a switch (for example, a push button switch) mounted on a substrate (for example, a printed circuit substrate) of various types of electronic devices; and more particularly relates to a push button switch mounted in the cutaway part of a substrate.
As indicated in
Nonetheless, in the previously described conventional example, no opening such as a through-hole or a cutaway was formed in the terminals 130, and therefore it was difficult to make a large solder contact surface area for the solder connection of the push button switch to the substrate 170, and great solder adhesion strength could not be obtained. Moreover, because no openings were formed in the terminals 130, while soldering the push button switch 100 to the substrate 170, flux was prone to travel along the terminal 130 when melting the solder and to penetrate into the push button switch 100 from between the housing 110 and a metal cover 160 secured outside of the housing 110 based on capillary action.
Then, as electronic devices have become more compact, when mounting the push button switch on the substrate, a cutaway part was formed in the substrate in order to control the height of the substrate, and this created problems regarding the method of installing and mounting the push button switch into this cutaway part.
In light of the problems described above, in forming a cutaway part in a substrate in order to control the height above the substrate surface when mounting a switch into this cutaway part, an object of the present invention is to be able to increase the strength of the solder connection to the substrate and to offer a switch for mounting on substrate wherein the penetration of flux into the interior of the switch can be controlled.
In a first embodiment of the present invention, a switch has a main body which is installed into and mounted on a cutaway part formed in a substrate. Terminals of the switch include through-hole parts plated on inner surfaces protrude from side surfaces of the aforementioned main body. When mounting the aforementioned terminals on the aforementioned substrate, a gap is formed between the side surfaces of the aforementioned main body and the aforementioned cutaway part, and part of the aforementioned through-hole has a space continuous with the aforementioned gap.
The invention as realized in the first embodiment comprises a switch the main body of which is installed into and mounted on a cutaway part formed in a substrate in order to reduce the mounting height. Because one part of a through-hole formed in the terminals has a space connected with a gap provided between the switch main body and the substrate, when mounting the switch on the substrate by soldering, flux traveling along the terminal and penetrating into the interior of the main body can be prevented because the flux stopped in the through-hole part of the terminal flows out to the terminal surface of the substrate. Moreover, because the terminals are plated on the inner surfaces of the through-holes, solder fillets are formed along the entire inner surfaces, and the mounting strength can be increased.
Preferably, the aforementioned main body comprises a housing consisting of an insulative body having an opening, a manipulation member housed within the aforementioned opening so as to be moveable, an operable contact piece arranged inside the opening and operated by the aforementioned manipulation member, and a cover that covers the aforementioned opening. Multiple fixed contact points, with which the aforementioned movable contact piece connects and disconnects, are also provided, spaced with gaps on the bottom surface of the aforementioned opening; and the aforementioned fixed contact points are connected with the aforementioned terminals.
This configuration enables stable mounting strength and stable operation when mounting a switch to which operational force is applied in order to operate the moveable contact piece.
Preferably, the aforementioned housing or the aforementioned cover forms protrusions that protrude in nearly the same direction as the aforementioned terminals.
Because a protruding part that protrudes in the same direction as the terminal is formed in the housing or cover that configures the switch, when mounting the switch on the substrate, fixed gaps can be provided between the main body of the switch and the substrate without using special methods such as jigs or image recognition, thereby enabling stable mounting strength and stable operation.
Preferably, the aforementioned housing or the aforementioned cover forms multiple protrusions that protrude having nearly an equivalent amount of protrusion in nearly the same direction as the aforementioned terminals, and when the aforementioned main body is installed into the aforementioned cutaway part, the aforementioned gaps are aligned nearly equally by the aforementioned protrusions.
By forming on the housing or cover that configures the switch protruding parts having equal amounts of protrusion, stable mounting strength and stable operation are made possible by the flux reliably flowing out at the substrate terminal surface when mounting. In addition, the switch can be easily centered by regulating the gaps to equal amounts.
The present invention will become more readily apparent from the Detailed Description of the Invention, which proceeds with reference to the drawings, in which:
A listing of some of the reference numerals that are used in the drawings, together with descriptions of the corresponding elements, is provided below.
Next, several embodiments of the present invention will be explained. These embodiments are provided to illustrated principles of the present invention, and are non-limiting.
The housing 20 comprises of an insulative material, and has an opening 22 on the upper side. Terminals 30, with contact points 34 in between and exposed on the opening side, are formed into a single body with the housing 20 on the bottom surface part 23, which is provided on an inner surface of the housing.
A contact plate 40 preferably comprises a conductive thin metal plate having a convexly curved dish shape with a thickness of about 0.01 to 0.05 mm, is separated from one contact point 34 with the central part exposed from the housing 20, and is installed in the housing 20 positioned at another contact point 34 at the peripheral part of the housing 20.
A manipulation member 60 includes a push piece 63, in which a hemispherical push part 62 is provided on a tip part 61, and a manipulation part 65, which has a flat surface 64 perpendicular to the direction of manipulation positioned on the exterior of the housing during installation. The manipulation member is installed in the housing such that a line connecting the push part 62 and the center of the contact plate 40, which is installed in the push button switch 10, matches the direction of manipulation.
Then, once this manipulation member 60 has been installed, the approximate center of an upper surface part 71, which is made of thin plate metal, is cut and then a guide tongue part 72 that protrudes at a downward slant is formed. When combined with housing 20, the opening part 22 of the housing is closed off and assembly of the push button switch 10 is completed by forming bent parts 74, which are bent having an equal amount of left and right protrusion in the same direction as the terminals 30 that protrude from housing 20, and by latching the cover 70, which has multiple latch parts 73 that are bent downward extended out from the tip parts of the upper surface part 71 that has roughly the same form as the outer shape of the housing, onto latch nubs 24 formed in the housing 20.
With the push button switch 10 assembled in this way, as illustrated in
Next, with reference in addition to
In addition to making compact and thin electronic devices of various kinds, the push button switch 10 facilitates a mounting method that installs and mounts the main body 11 of the push button switch 10 onto a substrate 50, on which a circuit is formed and which has a roughly rectangular shaped substrate cutaway part 52 as indicated in
The cutaway area of the substrate cutaway part 52 is larger than the main body 11 in the direction that the terminals 30 of the push button switch 10 protrude. When the main body 11 is installed in the substrate cutaway part 52, as illustrated in
The majority of the area of the opening of the through-hole 32 thereby formed in the terminal 30 is positioned above the substrate 50, but part of the area of the through-hole 32 is positioned not above the substrate 50 but above the gap 90 because the distance A between terminal surfaces 37 nearest to the main body 11 of the through-holes 32 of the left and right terminal parts formed in the direction of terminal protrusion as illustrated as in
To mount and solder the push button switch 10 to the substrate 50, paste solder is printed or coated on the mounting patterns 51 formed on the substrate in a shape roughly similar to the solder connection parts 31. Mounting equipment or the like then places the push button switch 10 on the substrate so that the solder connection parts 31 of the push button switch 10 are mated with the mounting patterns 51. Next; the solder is fused, for example, by passing the push button switch 10 mounted on this substrate 50 through a reflow tank at approximately 300° C. The mounting patterns 51 of the substrate and the solder connection parts 31 are soldered together, and the push button switch 10 and the substrate 50 become electrically connected.
At this time, the solder is fused and a solder fillet is formed at the corner parts formed by the plate thickness direction wall surfaces of the solder connection part 31 and the mounting pattern 51 of the substrate. Consequently, with the solder connection part 31 of the present push button switch 10, not only is a solder fillet formed on the long plate shaped outer periphery, but a solder fillet 80 is also formed on the wall surface, which is the inner surface 36 of the slotted through-hole 32 opened in the previously described solder connection part 31 (see, e.g.,
In this way, the present switch provides gaps 90 between the mounting substrate that are regulated by the bent parts 74 that protrude from the cover, and by forming in the switch terminal part a through-hole 32 that has a space 91 connecting between part of the through-hole and the gap, the flux produced by soldering during mounting passes through the space 91 formed between the through-hole 32 and the gap 90 and flows out along the end surface 53 of the substrate cutaway part 52, thus providing a countermeasure to flux traveling along the terminal part 30 and penetrating into the interior of the switch main body 11. Unsatisfactory fusion of the switch and other undesirable effects may thus be prevented, stable operation becomes possible, and the mounting strength is improved by solder fillets formed on the inner surface 36 of the through whole 32.
In the present embodiment, the bent parts 74 are formed on the cover 70 in order to regulate the gap 90, but implementation of the present invention is not limited to this configuration. As indicated in
One skilled on the art will readily recognize additional adaptations and modifications which can be made to the present inventions which fall within the scope of the invention as defined by the claims. Moreover, it is intended that the scope of the present invention include all foreseeable equivalents to the structure as described with reference to
Number | Date | Country | Kind |
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2008-204393 | Aug 2008 | JP | national |