Oblique hole, via or bump

Industry

CPC
H05K2201/09836

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09836Oblique hole, via or bump

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Flexible printed wiring board, joined body, pressure sensor and mas...
- Patent number 11,895,776
- Issue date Feb 6, 2024
- Hitachi Metals, Ltd.
- Takahiro Umeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a glass substrate with a plurality of vias
- Patent number 11,646,246
- Issue date May 9, 2023
- Samtec, Inc.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filling materials and methods of filling through holes of a substrate
- Patent number 11,251,109
- Issue date Feb 15, 2022
- Samtec, Inc.
- Tim Mobley
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Trace/via hybrid structure multichip carrier
- Patent number 10,791,628
- Issue date Sep 29, 2020
- International Business Machines Corporation
- Chad M. Albertson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,600,728
- Issue date Mar 24, 2020
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Trace/via hybrid structure multichip carrier
- Patent number 10,426,030
- Issue date Sep 24, 2019
- International Business Machines Corporation
- Chad M. Albertson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier comprising a deformation counteracting structure
- Patent number 10,420,206
- Issue date Sep 17, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for gas generation in a sealed gas cell cavity
- Patent number 10,370,760
- Issue date Aug 6, 2019
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,014,244
- Issue date Jul 3, 2018
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate, manufacturing method therefor, and sub...
- Patent number 9,961,768
- Issue date May 1, 2018
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bus bar plate, electronic component unit, and wire harness
- Patent number 9,699,919
- Issue date Jul 4, 2017
- Yazaki Corporation
- Akemi Maebashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 9,451,711
- Issue date Sep 20, 2016
- Ibiden Co., Ltd.
- Toshiaki Hibino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate
- Patent number 9,443,788
- Issue date Sep 13, 2016
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Touch member and method of manufacturing the same
- Patent number 9,320,143
- Issue date Apr 19, 2016
- Unimicron Technology Corp.
- Cheng-Ming Weng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging substrate, method for manufacturing same, and chip packag...
- Patent number 9,173,298
- Issue date Oct 27, 2015
- Zhen Ding Technology Co., Ltd.
- Yong Ha Woo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 9,155,196
- Issue date Oct 6, 2015
- Ibiden Co., Ltd.
- Haruhiko Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and fabrication method thereof
- Patent number 9,155,205
- Issue date Oct 6, 2015
- National Taipei University of Technology
- Chien-Yi Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a printed wiring board having a through-ho...
- Patent number 9,029,711
- Issue date May 12, 2015
- Ibiden Co., Ltd.
- Tomoyuki Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board having through-hole and a method of production...
- Patent number 8,890,000
- Issue date Nov 18, 2014
- Ibiden Co., Ltd.
- Tomoyuki Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting board including a flat-type electrical element and capable...
- Patent number 8,618,423
- Issue date Dec 31, 2013
- SANYO Electric Co., Ltd.
- Hirotoshi Ozaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a through-hole electrode substrate
- Patent number 8,544,169
- Issue date Oct 1, 2013
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 8,536,456
- Issue date Sep 17, 2013
- Hon Hai Precision Industry Co., Ltd.
- Yung-Chieh Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wave soldering of surface-mounting electronic devices on printed ci...
- Patent number 8,453,917
- Issue date Jun 4, 2013
- STMicroelectronics S.R.L.
- Concetto Privitera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 8,383,957
- Issue date Feb 26, 2013
- Hon Hai Precision Industry Co., Ltd.
- Shou-Kuo Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support module for a solid state light source, a lighting device co...
- Patent number 8,373,194
- Issue date Feb 12, 2013
- Koninklijke Philips Electronics N.V.
- Marcus Johannes Gerardus Elzinga
- F21 - LIGHTING
Information Patent Grant
Method of manufacturing an interposer
- Patent number 8,322,031
- Issue date Dec 4, 2012
- Micron Technology, Inc.
- Chin Hui Chong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and a method of production thereof
- Patent number 8,324,506
- Issue date Dec 4, 2012
- Ibiden Co., Ltd.
- Tomoyuki Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spacer, and its manufacturing method
- Patent number 8,174,116
- Issue date May 8, 2012
- NEC Corporation
- Koichiro Masuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, method of manufacturing wiring substrate, and liq...
- Patent number 8,109,612
- Issue date Feb 7, 2012
- FUJIFILM Corporation
- Toshiya Kojima
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Printed wiring board and a method of production thereof
- Patent number 8,101,865
- Issue date Jan 24, 2012
- Ibiden Co., Ltd.
- Tomoyuki Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD, MULTILAYER RESONATOR, AND MULTILAYER FILTER
- Publication number 20240040693
- Publication date Feb 1, 2024
- KYOCERA CORPORATION
- Atsuo KAWAGOE
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE
- Publication number 20220059436
- Publication date Feb 24, 2022
- SAMTEC, INC.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED WIRING BOARD, JOINED BODY, PRESSURE SENSOR AND MAS...
- Publication number 20220039262
- Publication date Feb 3, 2022
- Hitachi Metals, Ltd.
- Takahiro Umeyama
- G05 - CONTROLLING REGULATING
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20180277471
- Publication date Sep 27, 2018
- DAI NIPPON PRINTING CO., LTD.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier Comprising a Deformation Counteracting Structure
- Publication number 20180070443
- Publication date Mar 8, 2018
- Markus Leitgeb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...
- Publication number 20150380391
- Publication date Dec 31, 2015
- ZHEN DING TECHNOLOGY CO., LTD.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI LAYERED PRINTED CIRCUIT BOARD
- Publication number 20150053475
- Publication date Feb 26, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Jung Keun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20140353022
- Publication date Dec 4, 2014
- IBIDEN CO., LTD.
- Haruhiko MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD
- Publication number 20140254120
- Publication date Sep 11, 2014
- FUJIKURA LTD.
- Satoshi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20140216794
- Publication date Aug 7, 2014
- IBIDEN CO., LTD.
- Toshiaki HIBINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...
- Publication number 20140185259
- Publication date Jul 3, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20140177177
- Publication date Jun 26, 2014
- NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY
- Chien-Yi Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOUCH MEMBER AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140151107
- Publication date Jun 5, 2014
- UNIMICRON TECHNOLOGY CORP.
- CHENG-MING WENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER SUBSTRATE, ELECTRONIC DEVICE PACKAGE, AND ELECTRONIC COM...
- Publication number 20140009898
- Publication date Jan 9, 2014
- FUJIKURA LTD.
- Satoshi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20130328214
- Publication date Dec 12, 2013
- DAI NIPPON PRINTING CO., LTD.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVE SOLDERING OF SURFACE-MOUNTING ELECTRONIC DEVICES ON PRINTED CI...
- Publication number 20130126590
- Publication date May 23, 2013
- STMICROELECTRONICS S.R.L.
- Concetto Privitera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ORGANIC EL ILLUMINATION DEVICE
- Publication number 20130093308
- Publication date Apr 18, 2013
- LUMIOTEC INC.
- Akihito Kagotani
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20120273258
- Publication date Nov 1, 2012
- HON HAI Precision Industry CO., LTD.
- YUNG-CHIEH CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD
- Publication number 20120261177
- Publication date Oct 18, 2012
- FUJIKURA LTD.
- Satoshi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120261179
- Publication date Oct 18, 2012
- FUJIKURA LTD.
- Satoshi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD
- Publication number 20120205148
- Publication date Aug 16, 2012
- FUJIKURA LTD.
- Satoshi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Wiring Board And A Method Of Production Thereof
- Publication number 20120175155
- Publication date Jul 12, 2012
- IBIDEN, CO., LTD.
- Tomoyuki IKEDA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20120152607
- Publication date Jun 21, 2012
- HON HAI Precision Industry CO., LTD.
- YUNG-CHIEH CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20120048610
- Publication date Mar 1, 2012
- HON HAI Precision Industry CO., LTD.
- SHOU-KUO HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE MOUNTING STRUCTURE AND DEVICE MOUNTING METHOD
- Publication number 20120039055
- Publication date Feb 16, 2012
- FUJIKURA LTD.
- Satoshi YAMAMOTO
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED WIRING BOARD AND A METHOD OF PRODUCTION THEREOF
- Publication number 20120012464
- Publication date Jan 19, 2012
- IBIDEN CO., LTD.
- Tomoyuki IKEDA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SPACER, AND ITS MANUFACTURING METHOD
- Publication number 20110127680
- Publication date Jun 2, 2011
- NEC Corporation
- Koichiro Masuda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SUPPORT MODULE FOR A SOLID STATE LIGHT SOURCE, A LIGHTING DEVICE CO...
- Publication number 20110101411
- Publication date May 5, 2011
- Koninklijke Philips Electronics N.V.
- Marcus Johannes Gerardus Elzinga
- F21 - LIGHTING
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20110056740
- Publication date Mar 10, 2011
- DAI NIPPON PRINTING CO., LTD.
- Takamasa Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND A METHOD OF PRODUCTION THEREOF
- Publication number 20100155112
- Publication date Jun 24, 2010
- IBIDEN, CO., LTD.
- Tomoyuki IKEDA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Oblique hole, via or bump

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flexible printed wiring board, joined body, pressure sensor and mas...

Method of fabricating a glass substrate with a plurality of vias

Filling materials and methods of filling through holes of a substrate

Trace/via hybrid structure multichip carrier

Through-hole electrode substrate

Trace/via hybrid structure multichip carrier

Component carrier comprising a deformation counteracting structure

Methods for gas generation in a sealed gas cell cavity

Through-hole electrode substrate

Multilayer wiring substrate, manufacturing method therefor, and sub...

Bus bar plate, electronic component unit, and wire harness

Printed wiring board and method for manufacturing printed wiring board

Through-hole electrode substrate

Touch member and method of manufacturing the same

Packaging substrate, method for manufacturing same, and chip packag...

Wiring board

Electronic device and fabrication method thereof

Method for manufacturing a printed wiring board having a through-ho...

Printed wiring board having through-hole and a method of production...

Mounting board including a flat-type electrical element and capable...

Method of manufacturing a through-hole electrode substrate

Printed circuit board

Wave soldering of surface-mounting electronic devices on printed ci...

Printed circuit board

Support module for a solid state light source, a lighting device co...

Method of manufacturing an interposer

Printed wiring board and a method of production thereof

Spacer, and its manufacturing method

Wiring substrate, method of manufacturing wiring substrate, and liq...

Printed wiring board and a method of production thereof

Patents Applicationslast 30 patents

PRINTED WIRING BOARD, MULTILAYER RESONATOR, AND MULTILAYER FILTER

FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE

FLEXIBLE PRINTED WIRING BOARD, JOINED BODY, PRESSURE SENSOR AND MAS...

THROUGH-HOLE ELECTRODE SUBSTRATE

Component Carrier Comprising a Deformation Counteracting Structure

PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...

MULTI LAYERED PRINTED CIRCUIT BOARD

WIRING BOARD

DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...

ELECTRONIC DEVICE AND FABRICATION METHOD THEREOF

TOUCH MEMBER AND METHOD OF MANUFACTURING THE SAME

INTERPOSER SUBSTRATE, ELECTRONIC DEVICE PACKAGE, AND ELECTRONIC COM...

THROUGH-HOLE ELECTRODE SUBSTRATE

WAVE SOLDERING OF SURFACE-MOUNTING ELECTRONIC DEVICES ON PRINTED CI...

ORGANIC EL ILLUMINATION DEVICE

PRINTED CIRCUIT BOARD

DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD

INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD

Printed Wiring Board And A Method Of Production Thereof

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

DEVICE MOUNTING STRUCTURE AND DEVICE MOUNTING METHOD

PRINTED WIRING BOARD AND A METHOD OF PRODUCTION THEREOF

SPACER, AND ITS MANUFACTURING METHOD

SUPPORT MODULE FOR A SOLID STATE LIGHT SOURCE, A LIGHTING DEVICE CO...

THROUGH-HOLE ELECTRODE SUBSTRATE AND MANUFACTURING METHOD THEREOF

PRINTED WIRING BOARD AND A METHOD OF PRODUCTION THEREOF