Obliquely held PCB

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CPC
H05K2203/1527

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1527Obliquely held PCB

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate
- Patent number 11,589,457
- Issue date Feb 21, 2023
- Kyocera Corporation
- Seiichirou Itou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and system for controlled laser-driven explosive bonding
- Patent number 9,192,056
- Issue date Nov 17, 2015
- Lawrence Livermore National Security, LLC
- Alexander M. Rubenchik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for adhering solder powder and method for adhering solder...
- Patent number 8,752,754
- Issue date Jun 17, 2014
- Showa Denko K.K.
- Takashi Shoji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining method and reflow apparatus
- Patent number 8,434,658
- Issue date May 7, 2013
- Fujitsu Limited
- Tetsuji Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production method of solder circuit board
- Patent number 8,123,111
- Issue date Feb 28, 2012
- Showa Denko K.K.
- Takashi Shoji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, method of manufacturing wiring substrate, and liq...
- Patent number 8,109,612
- Issue date Feb 7, 2012
- FUJIFILM Corporation
- Toshiya Kojima
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Joining method and reflow apparatus
- Patent number 7,975,898
- Issue date Jul 12, 2011
- Fujitsu Limited
- Tetsuji Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin filling apparatus, filling method, and method of manufacturin...
- Patent number 7,955,065
- Issue date Jun 7, 2011
- Fujitsu Limited
- Shuichi Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective soldering system
- Patent number 7,913,894
- Issue date Mar 29, 2011
- Sony Corporation
- Esteban Arturo Alvarez Serrano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective soldering system
- Patent number 7,631,796
- Issue date Dec 15, 2009
- Sony Corporation
- Esteban Arturo Alvarez Serrano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing process for a super-digital (SD) flash card with slan...
- Patent number 7,479,039
- Issue date Jan 20, 2009
- Super Talent Electronics, Inc.
- Jim Chin-Nan Ni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Super-digital (SD) flash card with asymmetric circuit board and mec...
- Patent number 7,476,105
- Issue date Jan 13, 2009
- Super Talent Electronics, Inc.
- Jim Chin-Nan Ni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Depaneling system having fixture pallets that tilt toward an operator
- Patent number 7,469,453
- Issue date Dec 30, 2008
- Cencorp USA, Inc.
- Kurt John Hill
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inclined solder wave methodology for wave soldering double sided pi...
- Patent number 6,974,071
- Issue date Dec 13, 2005
- International Business Machines Corporation
- Todd H. Buley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Partial immersion flow coating method and apparatus
- Patent number 4,794,018
- Issue date Dec 27, 1988
- Frederick M. Scheetz
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Process of coating the surface of a board
- Patent number 4,600,601
- Issue date Jul 15, 1986
- Aisin Seiki Kabushikikaisha
- Kazuyoshi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flow-over mass soldering
- Patent number 4,011,980
- Issue date Mar 15, 1977
- Western Electric Company, Inc.
- Howard A. Dvorak
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3859722
- Patent number 3,859,722
- Issue date Jan 14, 1975
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR STRUCTURING METAL-CERAMIC SUBSTRATES, AND STRUCTURED MET...
- Publication number 20240074064
- Publication date Feb 29, 2024
- Heraeus Deutschland GmbH & Co. KG
- Richard WACKER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING BOARD
- Publication number 20210127486
- Publication date Apr 29, 2021
- KYOCERA CORPORATION
- Seiichirou ITOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INKJET PRINTER FOR PRINTING ON A THREE-DIMENSIONAL OBJECT AND RELAT...
- Publication number 20130342592
- Publication date Dec 26, 2013
- Apple Inc.
- Nicholas MERZ
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHODS AND SYSTEM FOR CONTROLLED LASER-DRIVEN EXPLOSIVE BONDING
- Publication number 20130064993
- Publication date Mar 14, 2013
- LAWRENCE LIVERMORE NATIONAL SECURITY, LLC
- Alexander M. Rubenchik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS FOR ADHERING SOLDER POWDER AND METHOD FOR ADHERING SOLDER...
- Publication number 20120292377
- Publication date Nov 22, 2012
- Showa Denko K.K.
- Takashi Shoji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINING METHOD AND REFLOW APPARATUS
- Publication number 20110192536
- Publication date Aug 11, 2011
- Fujitsu Limited
- Tetsuji ISHIKAWA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Non-Volatile Memory Based Computer Systems
- Publication number 20110029723
- Publication date Feb 3, 2011
- Super Talent Electronics, Inc.
- Charles C. Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
JOINING METHOD AND REFLOW APPARATUS
- Publication number 20100170939
- Publication date Jul 8, 2010
- FUJITSU LIMITED
- Tetsuji ISHIKAWA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SELECTIVE SOLDERING SYSTEM
- Publication number 20100001039
- Publication date Jan 7, 2010
- Sony Corporation and Sony Electronics Inc.
- Esteban Arturo Alvarez Serrano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package structure module with high density electrical connections a...
- Publication number 20090184332
- Publication date Jul 23, 2009
- Ming-Che Wu
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SELECTIVE SOLDERING SYSTEM
- Publication number 20090179067
- Publication date Jul 16, 2009
- Sony Corporation
- Esteban Arturo Alvarez Serrano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD OF SOLDER CIRCUIT BOARD
- Publication number 20090056977
- Publication date Mar 5, 2009
- SHOWA DENKOK.K.
- Takashi Shoji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN FILLING APPARATUS, FILLING METHOD, AND METHOD OF MANUFACTURIN...
- Publication number 20080216917
- Publication date Sep 11, 2008
- Fujitsu Limited
- Shuichi TAKEUCHI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Manufacturing Process for a Super-Digital (SD) Flash Card with Slan...
- Publication number 20080003883
- Publication date Jan 3, 2008
- SUPER TALENT ELECTRONICS INC.
- Jim Chin-Nan Ni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Super-Digital (SD) Flash Card with Asymmetric Circuit Board and Mec...
- Publication number 20080003882
- Publication date Jan 3, 2008
- SUPER TALENT ELECTRONICS INC.
- Jim Chin-Nan Ni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Circuit board cleaning apparatus, burn-in board cleaning apparatus,...
- Publication number 20070246086
- Publication date Oct 25, 2007
- Micron Technology, Inc.
- Ong Eng Guan
- B08 - CLEANING
Information Patent Application
Depaneling system having fixture pallets that tilt toward an operator
- Publication number 20070067974
- Publication date Mar 29, 2007
- Kurt John Hill
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring substrate, method of manufacturing wiring substrate, and liq...
- Publication number 20070049130
- Publication date Mar 1, 2007
- Fuji Photo Film Co., Ltd.
- Toshiya Kojima
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Metal filling process and metal filling apparatus
- Publication number 20060113057
- Publication date Jun 1, 2006
- FUJIKURA LTD.
- Sayaka Hirafune
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INCLINED SOLDER WAVE METHODOLOGY FOR WAVE SOLDERING DOUBLE SIDED PI...
- Publication number 20050061850
- Publication date Mar 24, 2005
- International Business Machines Corporation
- Todd H. Buley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Obliquely held PCB

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring substrate

Methods and system for controlled laser-driven explosive bonding

Apparatus for adhering solder powder and method for adhering solder...

Joining method and reflow apparatus

Production method of solder circuit board

Wiring substrate, method of manufacturing wiring substrate, and liq...

Joining method and reflow apparatus

Resin filling apparatus, filling method, and method of manufacturin...

Selective soldering system

Selective soldering system

Manufacturing process for a super-digital (SD) flash card with slan...

Super-digital (SD) flash card with asymmetric circuit board and mec...

Depaneling system having fixture pallets that tilt toward an operator

Inclined solder wave methodology for wave soldering double sided pi...

Partial immersion flow coating method and apparatus

Process of coating the surface of a board

Flow-over mass soldering

3859722

Patents Applicationslast 30 patents

METHOD FOR STRUCTURING METAL-CERAMIC SUBSTRATES, AND STRUCTURED MET...

WIRING BOARD

INKJET PRINTER FOR PRINTING ON A THREE-DIMENSIONAL OBJECT AND RELAT...

METHODS AND SYSTEM FOR CONTROLLED LASER-DRIVEN EXPLOSIVE BONDING

APPARATUS FOR ADHERING SOLDER POWDER AND METHOD FOR ADHERING SOLDER...

JOINING METHOD AND REFLOW APPARATUS

Non-Volatile Memory Based Computer Systems

JOINING METHOD AND REFLOW APPARATUS

SELECTIVE SOLDERING SYSTEM

Package structure module with high density electrical connections a...

SELECTIVE SOLDERING SYSTEM

PRODUCTION METHOD OF SOLDER CIRCUIT BOARD

RESIN FILLING APPARATUS, FILLING METHOD, AND METHOD OF MANUFACTURIN...

Manufacturing Process for a Super-Digital (SD) Flash Card with Slan...

Super-Digital (SD) Flash Card with Asymmetric Circuit Board and Mec...

Circuit board cleaning apparatus, burn-in board cleaning apparatus,...

Depaneling system having fixture pallets that tilt toward an operator

Wiring substrate, method of manufacturing wiring substrate, and liq...

Metal filling process and metal filling apparatus

INCLINED SOLDER WAVE METHODOLOGY FOR WAVE SOLDERING DOUBLE SIDED PI...