3859722

Information

• Patent Grant
• 3859722

• References
• Source

• Patent Number

  3,859,722

• Date Filed

  Not available

• Date Issued

  Tuesday, January 14, 1975
  50 years ago

• CPC

  • H05K3/3468 - Applying molten solder
  • B23K1/08 - Soldering by means of dipping in molten solder
  • H01L49/02 - Thin-film or thick-film devices
  • B23K2201/42 - Printed circuits
  • H05K1/0306 - Inorganic insulating substrates
  • H05K2201/10636 - Leadless chip
  • H05K2203/044 - Solder dip coating, i.e. coating printed conductors
  • H05K2203/1518 - Vertically held PCB
  • H05K2203/1527 - Obliquely held PCB
  • H05K2203/1581 - Treating the backside of the PCB
  • Y02P70/611 - the product being a printed circuit board [PCB]
  • Y10T29/49144 - by metal fusion

• US Classifications

  • 029 - Metal working
  • 174 - Electricity: conductors and insulators
  • 228 - Metal fusion bonding
  • 361 - Electricity: electrical systems and devices