of a plurality of bonding areas

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/06of a plurality of bonding areas

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor structure having hybrid bondi...
- Patent number 12,266,622
- Issue date Apr 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package
- Patent number 12,266,639
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with solder restraining wall
- Patent number 12,266,624
- Issue date Apr 1, 2025
- Texas Instruments Incorporated
- John Carlo Cruz Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display device
- Patent number 12,262,605
- Issue date Mar 25, 2025
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Shuya Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,255,127
- Issue date Mar 18, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidekazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,255,161
- Issue date Mar 18, 2025
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mirror image of geometrical patterns in stacked integrated circuit...
- Patent number 12,255,178
- Issue date Mar 18, 2025
- Mellanox Technologies, Ltd.
- Ido Bourstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor component and method of fabrica...
- Patent number 12,255,162
- Issue date Mar 18, 2025
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structure with bifunctional routing and assembly compris...
- Patent number 12,249,572
- Issue date Mar 11, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Candice Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate structure and manufacturing method thereof
- Patent number 12,243,838
- Issue date Mar 4, 2025
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices, systems, and methods for stacked die packages
- Patent number 12,243,850
- Issue date Mar 4, 2025
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,243,837
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display apparatus
- Patent number 12,243,880
- Issue date Mar 4, 2025
- Wuhan Tianma Microelectronics Co., Ltd. Shanghai Branch
- Yingying Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having topside power delivery structures
- Patent number 12,243,828
- Issue date Mar 4, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 12,237,283
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate, tiled display panel and display device
- Patent number 12,237,316
- Issue date Feb 25, 2025
- BOE Technology Group Co., Ltd.
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and implantable medical device including same
- Patent number 12,237,281
- Issue date Feb 25, 2025
- Medtronic, Inc.
- Mark E. Henschel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay module with thermal storage
- Patent number 12,237,243
- Issue date Feb 25, 2025
- GE Aviation Systems LLC
- Rinaldo Luigi Miorini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure comprising dummy feature interposed between...
- Patent number 12,237,284
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor package including horizontally stacked dies...
- Patent number 12,230,613
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device assembly in computer system
- Patent number 12,222,880
- Issue date Feb 11, 2025
- RAMBUS INC.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Clamped semiconductor wafers and semiconductor devices
- Patent number 12,224,259
- Issue date Feb 11, 2025
- SanDisk Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection device
- Patent number 12,224,579
- Issue date Feb 11, 2025
- Nexperia B.V.
- Hans-Martin Ritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, device and methods of manufacture
- Patent number 12,218,006
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,218,087
- Issue date Feb 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,218,096
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts
- Patent number 12,218,123
- Issue date Feb 4, 2025
- Rohm Co., Ltd.
- Keisuke Fukae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate comprising a binding region having a binding zone a...
- Patent number 12,218,154
- Issue date Feb 4, 2025
- CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Xiaoyuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display apparatus
- Patent number 12,218,150
- Issue date Feb 4, 2025
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Hong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Drive chip and display panel
- Patent number 12,211,810
- Issue date Jan 28, 2025
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shuya Dong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250112180
- Publication date Apr 3, 2025
- AOI ELECTRONICS CO., LTD.
- Shinji WAKISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS
- Publication number 20250112191
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas WAGNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250112193
- Publication date Apr 3, 2025
- Samsung Electronics Co., Ltd.
- INHYUNG SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE AND METHODS OF FORMATION
- Publication number 20250112183
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- CHERN-YOW HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power, Signaling and Thermal Path Co-optimization
- Publication number 20250112154
- Publication date Apr 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105169
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Leu-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device And Method Of Manufacturing The Same
- Publication number 20250105180
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Hung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure and alignment method thereof
- Publication number 20250105166
- Publication date Mar 27, 2025
- UNITED MICROELECTRONICS CORP.
- Chiao-Yi Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250107298
- Publication date Mar 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250107126
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Tomohiro TANIGUCHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250105184
- Publication date Mar 27, 2025
- MEDIATEK INC.
- Kai-Lun KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DUMMY PAD AND METHOD FOR FORMING THE SAME
- Publication number 20250105141
- Publication date Mar 27, 2025
- Yangtze Memory Technologies Co., Ltd.
- Fanfan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
- Publication number 20250105179
- Publication date Mar 27, 2025
- Mitsubishi Electric Corporation
- Chikara INADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250105182
- Publication date Mar 27, 2025
- SAMSUNG ELECTRONICS CO,. LTD.
- JAEYONG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
- Publication number 20250105183
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Hyung Chul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER
- Publication number 20250105200
- Publication date Mar 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seokbong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PAD SURFACE LEVELING DEVICE
- Publication number 20250105033
- Publication date Mar 27, 2025
- Shine Optics Technology Company Limited
- KUNG-AN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGING BOND PADS TO REDUCE IMPACT ON PASSIVE DEVICES
- Publication number 20250105185
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20250107106
- Publication date Mar 27, 2025
- Macronix International Co., Ltd.
- Jung-Chuan Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURI...
- Publication number 20250096183
- Publication date Mar 20, 2025
- Renesas Electronics America Inc.
- Martin Ashley VAGUES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096169
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Tohru SHIRAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250096204
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS INCLUDING STACKED THIN FILM INDUCTORS AND METHO...
- Publication number 20250096117
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Anshih TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096201
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Gyujin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250087543
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. Hsinchu
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP COPLANARITY FOR SEMICONDUCTOR DEVICE ASSEMBLY AND METHODS OF M...
- Publication number 20250087614
- Publication date Mar 13, 2025
- Micron Technology, Inc.
- Ko Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming FOWLP with Pre-Molded Em...
- Publication number 20250087545
- Publication date Mar 13, 2025
- STATS ChipPAC Pte Ltd.
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20250087581
- Publication date Mar 13, 2025
- Infineon Technologies Austria AG
- Sergey Yuferev
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR BONDED STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20250087600
- Publication date Mar 13, 2025
- Macronix International Co., Ltd.
- Cheng-Hsien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250079362
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Young Kun Jee
- H01 - BASIC ELECTRIC ELEMENTS

of a plurality of bonding areas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing semiconductor structure having hybrid bondi...

Method of fabricating semiconductor package

Semiconductor die with solder restraining wall

Display panel and display device

Semiconductor device and method for manufacturing the same

Semiconductor device with composite conductive features and method...

Mirror image of geometrical patterns in stacked integrated circuit...

Semiconductor device, semiconductor component and method of fabrica...

Integrated structure with bifunctional routing and assembly compris...

Circuit substrate structure and manufacturing method thereof

Devices, systems, and methods for stacked die packages

Semiconductor device and method

Display panel and display apparatus

Microelectronic assemblies having topside power delivery structures

Semiconductor structure and method for manufacturing the same

Display substrate, tiled display panel and display device

Electronic package and implantable medical device including same

Power overlay module with thermal storage

Semiconductor structure comprising dummy feature interposed between...

Vertical semiconductor package including horizontally stacked dies...

Stacked semiconductor device assembly in computer system

Clamped semiconductor wafers and semiconductor devices

ESD protection device

System, device and methods of manufacture

Semiconductor device with composite conductive features and method...

Semiconductor package and method of forming the same

Chip parts

Array substrate comprising a binding region having a binding zone a...

Display panel and display apparatus

Drive chip and display panel

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DIE AND METHODS OF FORMATION

Power, Signaling and Thermal Path Co-optimization

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Device And Method Of Manufacturing The Same

Semiconductor structure and alignment method thereof

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE HAVING DUMMY PAD AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER

CHIP PAD SURFACE LEVELING DEVICE

ARRANGING BOND PADS TO REDUCE IMPACT ON PASSIVE DEVICES

MEMORY DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURI...

SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUITS INCLUDING STACKED THIN FILM INDUCTORS AND METHO...

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGES AND METHODS

BUMP COPLANARITY FOR SEMICONDUCTOR DEVICE ASSEMBLY AND METHODS OF M...

Semiconductor Device and Method of Forming FOWLP with Pre-Molded Em...

METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR BONDED STRUCTURE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME