of a plurality of bonding areas

Industry

CPC
H01L2224/06

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/06of a plurality of bonding areas

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Stacked semiconductor devices and methods of forming same
- Patent number 12,170,207
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including anisotropic conductive film (ACF)
- Patent number 12,167,644
- Issue date Dec 10, 2024
- SHARP KABUSHIKI KAISHA
- Shinzoh Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,998
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Tohru Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 12,165,999
- Issue date Dec 10, 2024
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Kouki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,165,997
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Hung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with non-uniformly distributed vias
- Patent number 12,159,829
- Issue date Dec 3, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light emitting diode and display apparatus having the same
- Patent number 12,159,861
- Issue date Dec 3, 2024
- SEOUL VIOSYS CO., LTD.
- Seong Kyu Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,159,882
- Issue date Dec 3, 2024
- KYOCERA Coporation
- Hiroaki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 12,154,900
- Issue date Nov 26, 2024
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel
- Patent number 12,154,892
- Issue date Nov 26, 2024
- AUO Corporation
- Cheng-He Ruan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrayed switch circuit, switching element and system chip package s...
- Patent number 12,154,905
- Issue date Nov 26, 2024
- Industrial Technology Research Institute
- Jie Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump coplanarity for semiconductor device assembly and methods of m...
- Patent number 12,154,879
- Issue date Nov 26, 2024
- Micron Technology, Inc.
- Ko Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure and method
- Patent number 12,154,876
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of semiconductor device
- Patent number 12,148,723
- Issue date Nov 19, 2024
- United Microelectronics Corp.
- Zhirui Sheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 12,142,592
- Issue date Nov 12, 2024
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged multi-chip semiconductor devices and methods of fabricatin...
- Patent number 12,132,019
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission circuit, interface circuit, and memory
- Patent number 12,132,018
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Feng Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Die on die bonding structure
- Patent number 12,125,819
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor package and semiconductor package
- Patent number 12,125,776
- Issue date Oct 22, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing different size opposing bonding pads and...
- Patent number 12,125,814
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for fabricating the same
- Patent number 12,125,838
- Issue date Oct 22, 2024
- Samsung Display Co., Ltd.
- Seung Geun Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device assemblies with molded support substrates
- Patent number 12,119,325
- Issue date Oct 15, 2024
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 12,119,238
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 12,119,363
- Issue date Oct 15, 2024
- Tong Hsing Electronic Industries, Ltd.
- Chien-Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 12,119,321
- Issue date Oct 15, 2024
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with increased thermal radiation efficiency
- Patent number 12,113,050
- Issue date Oct 8, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and driving circuit structure
- Patent number 12,112,669
- Issue date Oct 8, 2024
- E Ink Holdings Inc.
- Shu-Fen Tsai
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method for fabricating semiconductor device with redistribution plugs
- Patent number 12,112,978
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE PACKAGE WITH HETEROGENEOUS DIE STRUCTURES AND METHODS OF FOR...
- Publication number 20240421111
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE
- Publication number 20240421124
- Publication date Dec 19, 2024
- VIA TECHNOLOGIES, INC.
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DEVICE HAVING AN INTEGRATED PASSIVE DEVICE WITH WAFER LEVE...
- Publication number 20240421053
- Publication date Dec 19, 2024
- Qianli MU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20240421073
- Publication date Dec 19, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421011
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- WanSun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240413106
- Publication date Dec 12, 2024
- United Microelectronics Corp.
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR MODULE
- Publication number 20240413235
- Publication date Dec 12, 2024
- Rohm Co., Ltd.
- Hirotaka Otake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Semiconductor Module
- Publication number 20240413127
- Publication date Dec 12, 2024
- Infineon Technologies Austria AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE, LIGHT-EMITTING SUBSTRATE AND DISPLAY DEVICE
- Publication number 20240413091
- Publication date Dec 12, 2024
- HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Qin ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WRAP-AROUND SOURCE/DRAIN METHOD OF MAKING CONTACTS FOR BACKSIDE METALS
- Publication number 20240413237
- Publication date Dec 12, 2024
- Intel Corporation
- Patrick MORROW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240413104
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Sang Cheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND AS...
- Publication number 20240404880
- Publication date Dec 5, 2024
- Lodestar Licensing Group LLC
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A MOLDING LAYER
- Publication number 20240404984
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- HAE-JUNG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE, AND ELE...
- Publication number 20240407216
- Publication date Dec 5, 2024
- Sony Semiconductor Solutions Corporation
- Shinichi Arakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Interconnect Structure and Method
- Publication number 20240395748
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240395749
- Publication date Nov 28, 2024
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Yusuke ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240395648
- Publication date Nov 28, 2024
- ROHM CO., LTD.
- Kazuki YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
- Publication number 20240395746
- Publication date Nov 28, 2024
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240395789
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Sanguk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD DESIGN FOR SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20240387423
- Publication date Nov 21, 2024
- NEXPERIA B.V.
- Vasantha Kumar Vaddagere Nagaraju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ON DIE BONDING STRUCTURE
- Publication number 20240387452
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PACKAGE SEAL RING AND METHODS FOR F...
- Publication number 20240387484
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Organic Integrated Circuit Substrate Embedded in Inorg...
- Publication number 20240387456
- Publication date Nov 21, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICE HAVING GROUPS OF TRANSISTOR CELLS WITH DIFFERENT...
- Publication number 20240387526
- Publication date Nov 21, 2024
- Infineon Technologies Austria AG
- Gerhard Thomas Nöbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240387422
- Publication date Nov 21, 2024
- MEDIATEK INC.
- Cheng-Lin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR 3DIC POWER DISTRIBUTION
- Publication number 20240387502
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE IN A STACK FORM
- Publication number 20240387420
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Soyeon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240387483
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Juhyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, EFFICIENT SIC POWER MODULE
- Publication number 20240380320
- Publication date Nov 14, 2024
- Wolfspeed, Inc.
- Mrinal K. DAS
- B60 - VEHICLES IN GENERAL
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS

of a plurality of bonding areas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked semiconductor devices and methods of forming same

Semiconductor device

Display device including anisotropic conductive film (ACF)

Semiconductor device

Semiconductor device and semiconductor module

Semiconductor device and method of manufacturing the same

Semiconductor package with non-uniformly distributed vias

Light emitting diode and display apparatus having the same

Display device

Semiconductor device and semiconductor package

Display panel

Arrayed switch circuit, switching element and system chip package s...

Bump coplanarity for semiconductor device assembly and methods of m...

Semiconductor interconnect structure and method

Semiconductor device assembly with die support structures

Structure of semiconductor device

Semiconductor package including stacked semiconductor chips

Packaged multi-chip semiconductor devices and methods of fabricatin...

Transmission circuit, interface circuit, and memory

Die on die bonding structure

Method for forming semiconductor package and semiconductor package

Bonded assembly containing different size opposing bonding pads and...

Display device and method for fabricating the same

Semiconductor device assemblies with molded support substrates

Semiconductor bonding structures and methods

Sensor package structure

Semiconductor device and a method of manufacturing thereof

Semiconductor package with increased thermal radiation efficiency

Display device and driving circuit structure

Method for fabricating semiconductor device with redistribution plugs

Patents Applicationslast 30 patents

DEVICE PACKAGE WITH HETEROGENEOUS DIE STRUCTURES AND METHODS OF FOR...

MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE

PACKAGED DEVICE HAVING AN INTEGRATED PASSIVE DEVICE WITH WAFER LEVE...

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

NITRIDE SEMICONDUCTOR MODULE

Method of Forming a Semiconductor Module

ARRAY SUBSTRATE, LIGHT-EMITTING SUBSTRATE AND DISPLAY DEVICE

WRAP-AROUND SOURCE/DRAIN METHOD OF MAKING CONTACTS FOR BACKSIDE METALS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND AS...

SEMICONDUCTOR PACKAGE INCLUDING A MOLDING LAYER

DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE, AND ELE...

Semiconductor Interconnect Structure and Method

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER

SEMICONDUCTOR PACKAGE

BOND PAD DESIGN FOR SEMICONDUCTOR DEVICE PACKAGES

DIE ON DIE BONDING STRUCTURE

SEMICONDUCTOR PACKAGE INCLUDING PACKAGE SEAL RING AND METHODS FOR F...

Package with Organic Integrated Circuit Substrate Embedded in Inorg...

TRANSISTOR DEVICE HAVING GROUPS OF TRANSISTOR CELLS WITH DIFFERENT...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

METHOD AND STRUCTURE FOR 3DIC POWER DISTRIBUTION

SEMICONDUCTOR PACKAGE IN A STACK FORM

SEMICONDUCTOR PACKAGE

HIGH SPEED, EFFICIENT SIC POWER MODULE

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING