of a plurality of bump connectors

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CPC
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/14of a plurality of bump connectors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Memory package and a memory module including the memory package
- Patent number 12,322,436
- Issue date Jun 3, 2025
- SK Hynix Inc.
- Won Ha Choi
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit (IC) package with substrate having validation co...
- Patent number 12,322,685
- Issue date Jun 3, 2025
- Intel Corporation
- Luis Ricardo Perez-Corona
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eccentric via structures for stress reduction
- Patent number 12,322,703
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 12,322,722
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor packages with wavelength-specific light filters
- Patent number 12,317,638
- Issue date May 27, 2025
- Texas Instruments Incorporated
- Jo Bito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact routing package for high frequency isolation
- Patent number 12,315,790
- Issue date May 27, 2025
- Cypress Semiconductor Corporation
- Chenxi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 12,308,334
- Issue date May 20, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsin He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures to increase substrate routing density and methods of for...
- Patent number 12,308,321
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided routing in 3D semiconductor system-in-package structure...
- Patent number 12,308,322
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package structure comprising package unit incl...
- Patent number 12,300,630
- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,300,598
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, package structure and electronic manufacturing m...
- Patent number 12,300,651
- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Pei-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive and thermal interface material on a plurality of dies cove...
- Patent number 12,300,574
- Issue date May 13, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and package structure
- Patent number 12,300,652
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming thereof
- Patent number 12,300,656
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip socket, testing fixture and chip testing method thereof
- Patent number 12,292,455
- Issue date May 6, 2025
- NANYA TECHNOLOGY CORPORATION
- Shih-Ting Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,293,952
- Issue date May 6, 2025
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including re-distribution pads disposed at dif...
- Patent number 12,288,761
- Issue date Apr 29, 2025
- SK Hynix Inc.
- Jun Yong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,283,545
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of forming the same
- Patent number 12,283,537
- Issue date Apr 22, 2025
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper wire bond on gold bump on semiconductor die bond pad
- Patent number 12,283,559
- Issue date Apr 22, 2025
- Texas Instruments Incorporated
- Lin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate and display device
- Patent number 12,278,213
- Issue date Apr 15, 2025
- BOE Technology Group Co., Ltd.
- Mingxing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 12,272,665
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Yongho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and manufacturing methods thereof
- Patent number 12,266,847
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and carrier thereof and method for manufacturing...
- Patent number 12,255,165
- Issue date Mar 18, 2025
- Siliconware Precision Industries Co., Ltd.
- Chi-Ren Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,255,184
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting element and semiconductor light emitti...
- Patent number 12,255,278
- Issue date Mar 18, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Yasumitsu Kunoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat dissipation layer
- Patent number 12,255,183
- Issue date Mar 18, 2025
- SK hynix Inc.
- Joo Wan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including a thermal conductive layer a...
- Patent number 12,249,555
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE WITH BURIED POWER RAILS AND METHOD OF FABRI...
- Publication number 20250174495
- Publication date May 29, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Sheng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20250174539
- Publication date May 29, 2025
- nD-HI Technologies Lab, Inc.
- HO-MING TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER
- Publication number 20250167158
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS WITH SELECTED GRAIN DISTRIBUTION
- Publication number 20250167046
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE STRUCTURE, PACKAGE STRUCTURE, AND METHOD FOR FORMIN...
- Publication number 20250164709
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167151
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Chonghee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Integration of Passive Devices
- Publication number 20250167176
- Publication date May 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20250157985
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES
- Publication number 20250157870
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...
- Publication number 20250157971
- Publication date May 15, 2025
- Institute of Semiconductors, Guangdong Academy of Sciences
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE, ELECTRONIC DEVICE, AND PACKAGING METHOD OF...
- Publication number 20250157999
- Publication date May 15, 2025
- Huawei Technologies Co., Ltd
- Jinwen Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP STRUCTURE AND CIRCUIT BOARD THEREOF
- Publication number 20250157970
- Publication date May 15, 2025
- Chipbond Technology Corporation
- Kung-Tzu Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149490
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Wonhee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149478
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Yongho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250149489
- Publication date May 8, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250149494
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP ARRANGEMENT OF INTEGRATED CIRCUITS FOR FLIP CHIP BONDING
- Publication number 20250140725
- Publication date May 1, 2025
- SYNAPTICS INCORPORATED
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250140726
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Kyunglyul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250132277
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Seokbeom Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ADHESIVE LAYER AND METHOD FOR MANUF...
- Publication number 20250125271
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Yeohoon YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS
- Publication number 20250125275
- Publication date Apr 17, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20250125295
- Publication date Apr 17, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...
- Publication number 20250125307
- Publication date Apr 17, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250118631
- Publication date Apr 10, 2025
- WINBOND ELECTRONICS CORP.
- Jin-Neng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Semiconductor Package and Semiconductor Package
- Publication number 20250118649
- Publication date Apr 10, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Semiconductor Interconnect Interfaces, Semiconductor...
- Publication number 20250118663
- Publication date Apr 10, 2025
- JARIET TECHNOLOGIES, INC.
- Scott Richard POWELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-DIFFUSING LIQUID METAL INTERCONNECT ARCHITECTURES ENABLING SNA...
- Publication number 20250112190
- Publication date Apr 3, 2025
- Intel Corporation
- Xiao Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS
- Publication number 20250112191
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas WAGNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY
- Publication number 20250112198
- Publication date Apr 3, 2025
- Intel Corporation
- Pratyasha Mohapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES
- Publication number 20250112175
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS

of a plurality of bump connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Memory package and a memory module including the memory package

Integrated circuit (IC) package with substrate having validation co...

Eccentric via structures for stress reduction

Die attached leveling control by metal stopper bumps

Sensor packages with wavelength-specific light filters

Compact routing package for high frequency isolation

Semiconductor device and semiconductor package

Structures to increase substrate routing density and methods of for...

Dual-sided routing in 3D semiconductor system-in-package structure...

Semiconductor device package structure comprising package unit incl...

Package structure and method of fabricating the same

Electronic device, package structure and electronic manufacturing m...

Adhesive and thermal interface material on a plurality of dies cove...

Substrate and package structure

Semiconductor package and method of forming thereof

Semiconductor packages and methods of forming same

Chip socket, testing fixture and chip testing method thereof

Electronic package and manufacturing method thereof

Semiconductor device including re-distribution pads disposed at dif...

Package structure and method of manufacturing the same

Electronic package and method of forming the same

Copper wire bond on gold bump on semiconductor die bond pad

Display substrate and display device

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor packages and manufacturing methods thereof

Electronic package and carrier thereof and method for manufacturing...

Semiconductor packages and methods of forming the same

Semiconductor light emitting element and semiconductor light emitti...

Semiconductor package including heat dissipation layer

Semiconductor device package including a thermal conductive layer a...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE WITH BURIED POWER RAILS AND METHOD OF FABRI...

3D INTEGRATED CIRCUIT PACKAGE AND SUBSTRATE STRUCTURE THEREOF

CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER

VIAS WITH SELECTED GRAIN DISTRIBUTION

OPTICAL PACKAGE STRUCTURE, PACKAGE STRUCTURE, AND METHOD FOR FORMIN...

SEMICONDUCTOR PACKAGE

Wafer Level Integration of Passive Devices

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

PACKAGE STRUCTURES

THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...

CHIP PACKAGE STRUCTURE, ELECTRONIC DEVICE, AND PACKAGING METHOD OF...

FLIP CHIP STRUCTURE AND CIRCUIT BOARD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

Multi-Die Fine Grain Integrated Voltage Regulation

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

BUMP ARRANGEMENT OF INTEGRATED CIRCUITS FOR FLIP CHIP BONDING

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING ADHESIVE LAYER AND METHOD FOR MANUF...

MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME

Method for Forming Semiconductor Package and Semiconductor Package

Heterogeneous Semiconductor Interconnect Interfaces, Semiconductor...

SELF-DIFFUSING LIQUID METAL INTERCONNECT ARCHITECTURES ENABLING SNA...

DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS

IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY

MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES