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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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H01L24/14
of a plurality of bump connectors
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Method of manufacturing a semiconductor package including correctin...
Patent number
11,972,966
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Gyujin Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
11,967,577
Issue date
Apr 23, 2024
Rohm Co., Ltd.
Yosui Futamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solderless interconnection structure and method of forming same
Patent number
11,961,810
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company
Yu-Wei Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip socket, testing fixture and chip testing method thereof
Patent number
11,959,939
Issue date
Apr 16, 2024
NANYA TECHNOLOGY CORPORATION
Shih-Ting Lin
G11 - INFORMATION STORAGE
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Patent Grant
Electronic package structure with reinforcement element
Patent number
11,961,808
Issue date
Apr 16, 2024
Advanced Semiconductor Engineering, Inc.
Wei-Jen Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package including stacked chip structure
Patent number
11,961,824
Issue date
Apr 16, 2024
Samsung Electronics Co., Ltd.
Hyunggyun Noh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor assemblies using edge stacking and methods of manufac...
Patent number
11,955,457
Issue date
Apr 9, 2024
Micron Technology, Inc.
Thomas H. Kinsley
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method
Patent number
11,955,423
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Ting-Li Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Compact routing package for high frequency isolation
Patent number
11,955,418
Issue date
Apr 9, 2024
Cypress Semiconductor Corporation
Chenxi Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Fan out package with integrated peripheral devices and methods
Patent number
11,955,395
Issue date
Apr 9, 2024
Intel Corporation
Lizabeth Keser
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package with redistribution structure and manufacturi...
Patent number
11,955,439
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Cheng Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Architecture to manage FLI bump height delta and reliability needs...
Patent number
11,955,448
Issue date
Apr 9, 2024
Intel Corporation
Jung Kyu Han
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
11,948,930
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chin-Chuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including a support solder ball
Patent number
11,948,873
Issue date
Apr 2, 2024
Samsung Electronics Co., Ltd.
Jeonghyun Lee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and method
Patent number
11,948,890
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Hao Tseng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package
Patent number
11,948,903
Issue date
Apr 2, 2024
Samsung Electronics Co., Ltd.
Sang-Sick Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
11,942,446
Issue date
Mar 26, 2024
Samsung Electronics Co., Ltd.
Hyoeun Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Device and method of fluidic assembly of microchips on a substrate
Patent number
11,942,450
Issue date
Mar 26, 2024
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Melina Haupt
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor structure and method for making the same
Patent number
11,942,418
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Chuan Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power device module with dummy pad die layout
Patent number
11,935,817
Issue date
Mar 19, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Yusheng Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device having reduced bump height variation
Patent number
11,935,866
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jing-Cheng Lin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Grant
Semiconductor device with connecting structure and method for fabri...
Patent number
11,935,831
Issue date
Mar 19, 2024
NANYA TECHNOLOGY CORPORATION
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring substrate having metal post offset from conductor pad and me...
Patent number
11,935,822
Issue date
Mar 19, 2024
Ibiden Co., Ltd.
Isao Ohno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of inspection of semiconductor packages including measureme...
Patent number
11,935,873
Issue date
Mar 19, 2024
Samsung Electronics Co., Ltd.
Joonho Jun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stress relief for flip-chip packaged devices
Patent number
11,930,590
Issue date
Mar 12, 2024
Texas Instruments Incorporated
Tianyi Luo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated fan-out packages and methods of forming the same
Patent number
11,929,319
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ching-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die interconnect structures having bump field and ground plane
Patent number
11,923,308
Issue date
Mar 5, 2024
Intel Corporation
Zhiguo Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and semiconductor package
Patent number
11,923,328
Issue date
Mar 5, 2024
Advanced Semiconductor Engineering, Inc.
Hsin He Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die attached leveling control by metal stopper bumps
Patent number
11,923,331
Issue date
Mar 5, 2024
Wei-Jhih Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and system for packing optimization of semiconductor devices
Patent number
11,916,033
Issue date
Feb 27, 2024
Amkor Technology Singapore Holding Pte Ltd.
Glenn Rinne
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20240145322
Publication date
May 2, 2024
Medtronic, Inc.
Chunho KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240145418
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Junghoo Yun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RF AMPLIFIERS WITH IMPROVED STABILITY BY SOURCE INDUCTANCE ADJUSTMENT
Publication number
20240145414
Publication date
May 2, 2024
Wolfspeed, Inc.
Gerard Bouisse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
Publication number
20240145420
Publication date
May 2, 2024
Intel Corporation
Bok Eng CHEAH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240136307
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Geunwoo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE AND PACKAGE STRUCTURE
Publication number
20240136317
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Conductive Traces in Semiconductor Devices and Methods of Forming Same
Publication number
20240136280
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chao-Wen Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20240136241
Publication date
Apr 25, 2024
Rohm Co., Ltd.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240128173
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Ji-Yong Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF
Publication number
20240128635
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Ping Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES
Publication number
20240128255
Publication date
Apr 18, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF
Publication number
20240120295
Publication date
Apr 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Szu-Hsien Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS
Publication number
20240120305
Publication date
Apr 11, 2024
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY PACKAGE AND A MEMORY MODULE INCLUDING THE MEMORY PACKAGE
Publication number
20240119996
Publication date
Apr 11, 2024
SK HYNIX INC.
Won Ha CHOI
G11 - INFORMATION STORAGE
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20240113066
Publication date
Apr 4, 2024
Sony Semiconductor Solutions Corporation
Takashi IMAHIGASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240113089
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tian Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS
Publication number
20240096787
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Da Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM AND METHOD OF BUMP MAP DETERMINATION AND BUMP ARRAY FORMATION
Publication number
20240096834
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company Limited
Shih Hsuan HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNEC...
Publication number
20240096809
Publication date
Mar 21, 2024
Intel Corporation
Hiroki Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PATCH ACCOMMODATING EMBEDDED DIES HAVING DIFFERENT THICKNESSES
Publication number
20240088121
Publication date
Mar 14, 2024
Intel Corporation
Srinivas PIETAMBARAM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chamfered Die of Semiconductor Package and Method for Forming the Same
Publication number
20240088050
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES
Publication number
20240079371
Publication date
Mar 7, 2024
GLOBALFOUNDRIES U.S. Inc.
John C. MALINOWSKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT
Publication number
20240071881
Publication date
Feb 29, 2024
Micron Technology, Inc.
Ling Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
Publication number
20240071973
Publication date
Feb 29, 2024
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20240071971
Publication date
Feb 29, 2024
LAPIS Technology Co., Ltd.
Osamu KOIKE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD
Publication number
20240071972
Publication date
Feb 29, 2024
Micron Technology, Inc.
Hidenori Yamaguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240063124
Publication date
Feb 22, 2024
SOCIONEXT INC.
Sayuri OCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTILAYER ELECTRICAL CONDUCTORS FOR TRANSFER PRINTING
Publication number
20240063161
Publication date
Feb 22, 2024
X Display Company Technology Limited
Christopher Andrew Bower
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
Publication number
20240055420
Publication date
Feb 15, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC
Kaimin LV
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
Publication number
20240055385
Publication date
Feb 15, 2024
WISTRON NEWEB CORPORATION
KUO-HUA HSIEH
H01 - BASIC ELECTRIC ELEMENTS